• Journal of the Korean Society for Precision Engineering
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• v.16 no.8
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• pp.170-177
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• 1999

과공정 알루미늄 실리콘 합금 (Hypereutectic Al-Si Alloy, A390)은 내마멸성 및 우수한 강성에 의해서 자동차 부품에 많이 사용되고 있다. 본 연구에서는 초음파 진동 절삭에 의한 과공정 알루미늄 실리콘 합금의 가공성과 실리콘 석출의 실험적 연구를 수행 하였다. 최적 공구와 가공조건의 선정 실험을 통하여 보다 효과적인 초음파 진동 절삭을 수행하였으며, 과공정 알루미늄 실리콘 합금의 가공 표면거칠기와 실리콘 석출은 절삭속도와 절삭깊이와 밀접한 연관성을 갖고 있다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.1
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• pp.84-88
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• 1999

The behavior of oxygen precipitation was investigated in radial direction using Si wafers with different vacancy-related defects generation area. The behavior of oxygen precipitation in radial direction is strongly dependent on the size of vacancy rich area which is related with crystal growth condition. Oxygen precipitation rate is more enhanced in vacancy rich area than that of interstitial rich area. And anomalous oxygen precipitation is generated in the marginal bands of vacancy and interstial area. In V/I boundary, however, oxygen precipitation is suppressed to nearly perfect.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.6
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• pp.246-251
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• 2014

Recent studies have shown methods of improving solar cell efficiency. Especially on single crystalline silicon wafer which is high-efficiency solar cell material that has been widely studied. Interstitial oxygen (Oi) is the main impurity in the Czochralski (Cz) growing method, and excess of this can form precipitates during cell fabrication. We have demonstrated the effect of Oi impurity and oxygen precipitation concentration of the wafer on Cz-silicon solar cell efficiency. The result showed a decrease in cell efficiency as Oi and oxygen precipitation increase. Moreover, we have found that the critical point of [Oi] to bring higher cell efficiency is at 14.5 ppma in non-existent Bulk Micro Defect (BMD).

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.12
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• pp.2279-2286
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• 1992

A hypereutectic Aluminum-Silicon Alloy is widely used in the parts of autombile because of high-resistance and good strength. In this study, the cutting of a hypereutectic Al-Si alloy (A390) for extraction of Si particle was experimentally investigated. By proper selection of cutting tool materials and optimization of cutting conditions, economical machining of this alloy is achieved. The surface roughness relates closely with the feed rate and cutting speed.

• Korean Journal of Materials Research
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• v.2 no.2
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• pp.119-125
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• 1992

Oxygen segregation in horizontal-magnetic-field-applied Czochralski (HMCZ) silicon crystals has been studied as a function of magnetic field strength (B) and crucible rotation rate (C). Along the axis of 57mm din. <100> crystals grown under B=2, 3, 4 kG and C=4-15rpm, the oxygen distribution was usually saw-tooth shaped and fluctuated unevenly. Compared to the conventional CZ method, this result seems to indicate that the horizontal magnetic field, at levels used in the present experiment, had a destabilizing influence on oxygen transport to the growth interface. On the other hand, as C increased, the oxygen fluctuation lessened, and [0] increased overall. At B=2 kG, an oxygen profile in a level of 27-36 ppma was achieved by a programmed ramp of C. Oxygen precipitation behavior of the HMCZ silicon during a simulated device manufacturing process was compared and found to be inferior to that of typical CZ silicon. The uneven oxygen profile in the as-grown state was identified as the major source of poor precipitation uniformity in the HMCZ silicon.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.91-92
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• 1999

• Proceedings of the Korean Vacuum Society Conference
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• 2008.08a
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• pp.327-327
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• 2008

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.3
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• pp.360-367
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• 1996

The OISF (Oxidation Induced Stacking Fault)is expected to affect the electrical properties in Si single crystals, and the nuclei of OISF are believed to be formed during the crystal growing process. Initial oxygen concentration, dopant type and its density, and cooling rate are regareded as major factors on OISF formation. In this study, the variations of OISF density under various cooling rate were investigated. Si single crystal was heated to $1400^{\circ}C$ in Ar ambient and cooled down to room temperature at different cooling rate, using horizontal tube furnace. After that, they were oxidized at $1150^{\circ}C$, and then, OISF was observed with optical microscope. The relation between oxide procipitates and OISF nucleation was investigated by FTIR analysis. As a result, it was found that there exists the intermediate cooling rate range in which OISF nucleation is highly enhanced. And also, it was found that OISF nucleation is closely related with silicon oxide procipitation in Si single crystals.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.283.2-283.2
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• 2014

열필라멘트 화학증착공정(Hot Wire Chemical Vapor Deposition)에서 기상 에서 생성되는 하전된 실리콘 나노입자와 저온결정성 실리콘박막 증착의 연관성을 압력의 변화에 따른 상호비교를 통해 조사하였다. 필라멘트 온도는 $1800^{\circ}C$로 고정시키고 0.3~2 torr의 범위에서 공정 압력을 변화시키면서 증착하였다. 압력이 증가함에 따라 증착된 실리콘 박막의 결정화도는 증가하였으며, 증착속도는 감소하였다. 반응기 압력에 따른 기상에서 생성되는 나노입자의 크기분포의 변화를 조사하기 위하여 탄소막이 코팅된 투과전자현미경(Transmission Electron Microscopy) 그리드 위에 실리콘 나노입자를 포획하고 관찰하였다. 포획된 실리콘 나노입자의 크기분포와 개수농도는 압력이 증가함에 따라 감소하였다. 투과전자현미경을 이용하여 분석한 결과, 나노입자는 결정성 구조를 보였다. 압력이 증가함에 따라 나노입자의 크기가 감소하고 개수농도가 감소하는 것은 증착속도의 감소와 관련됨을 알 수 있다. 한편, 공정압력 증가에 따른 나노입자의 크기분포 및 개수농도 감소와 증착속도의 감소는 일반적으로 알려진 기상에서 석출하는 고상의 평형석출량(equilibrium amount of precipitation)이 압력의 증가함에 따라 증가한다는 사실과 일치하지 않는다. 이러한 압력경향성은 Si-H 시스템이 0.3~2 torr의 압력 영역에서 retrograde solubility를 갖는 것을 의미한다. 나노입자의 하전여부, 크기분포 및 개수농도를 측정하기 위하여 입자빔질량분석장비(Particle Beam Mass Spectroscopy)를 이용하였다. 그 결과, 실리콘 나노입자는 양 또는 음의 극성을 가진 하전된 상태임을 확인하였고, 투과전자현미경(TEM) grid에 포획한 실리콘 나노입자의 크기와 경향성이 일치하였다. 이는 나노입자가 저온의 기판에서 핵생성되어 성장하여 생성된 것이 아니라 열필라멘트 주위의 고온영역에서 생성된 것을 의미한다.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.10
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• pp.29-38
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• 1998

In this paper, we have induced a model for the growth and dissolution of oxygen precipitates which is generated during arbitrary thermal treatments or VLSI processes in CZ-grown silicon. Based on diffusion-limited growth law and detailed balance equilibrium theory, growth and dissolution rates are induced and inserted into a set of chemical rate equations and a Fokker-Planck equation. Then this is solved by numerical analysis. And because phenomenon at the silicon surface must be considered differently in various annealing conditions, in particular in $O_2$ ambient we have considered the growth model of SiO$_2$ at the surface of silicon wafer and the enhancement of oxygen solubility. By this method, oxygen depth profile and density distribution of oxygen precipitates are calculated more accurately than the other simulation results.