• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.157-158
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• 2007

• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.89-96
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• 2006

In this study, fabrication of the large area silicon mirror is accomplished by anisotropic wet etching using micromachining technology for implementation of integrated slim optical pickup and the process condition is also established for improving the mirror surface roughness. Until now, few results have been reported about the production of highly stepped $9.74^{\circ}$ off-axis-cut silicon wafers using wet etching. In addition rough surface of the mirror is achieved in case of tong etching time. Hence a novel method called magnetorheolocal finishing is applied to enhance the surface quality of the mirror plane. Finally, areal peak to valley surface roughness of mirror plane is reduced about 100nm in large area of $mm^2$ and it is applicable to optical pickup using infrared wavelength.

• The Journal of Korea Robotics Society
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• v.2 no.3
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• pp.249-254
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• 2007

본 논문에서는 웨이퍼 레벨 밀봉 실장된 수직 운동 가속도 신호를 감지할 수 있는 초소형 Z축 가속도 센싱 엘리먼트를 제작하였다. 초소형 Z축 가속도 센싱 엘리먼트는 수직 방향의 정전용량 변화를 필요로 하기 때문에 단일 기판상에 수직 단차의 형성을 가능케 하는 확장된 희생 몸체 미세 가공 기술 (Extended Sacrificial Bulk Micromachining, ESBM) 을 이용하여 제작되었다. 확장된 희생 몸체 미세 가공 기술을 이용하면 정렬오차가 없이 상하부 양쪽에 수직 단차를 갖는 실리콘 구조물의 제작이 가능하다. 또한, MEMS 센싱 엘리먼트의 부유된 실리콘 구조물을 보호하기 위하여 웨이퍼 레벨 밀봉 실장 기술이 적용하여 고신뢰성, 고수율, 고성능의 Z축 가속도 센서를 제작하였다. 신호 처리 회로와 가속도 센서를 결합하여 Z축 가속도 센싱 시스템을 제작하였고 운동가속도 범위 10 g 이상, 정지 드리프트 17.3 mg 그리고 대역폭 60 Hz 이상의 성능을 나타내었다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1047-1055
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• 2006

We patterned nano-width lines on a super hard bulk diamond substrate by varying the ion beam current and ion beam sources with a dual beam field ion beam (FIB). In addition, we successfully fabricated two-dimensional nano patterns and three-dimensional nano plate modules. We prepared nano lines on a diamond and a silicon substrate at the beam condition of 30 kV, 10 pA $\sim$ 5 nA with $Ga^+$ ion and $H_2O$ assisted ion sources. We measured each of the line-width, line-depth, etched line profiles, etch rate, and aspect ratio, and then compared them. We confirmed that nano patterning was possible on both a bulk diamond and a silicon substrate. The etch rate of $H_2O$ source can be enhanced about two times than that of Ga source. The width of patterns on a diamond was smaller than that on a silicon substrate at the same ion beam power The sub-100 nm patterns on a diamond were made under the charge neutralization mode to prevent charge accumulation. We successfully made a two-dimensional, 240 nm-width text of the 300-lettered Lord's Prayer on a gem diamond with 30 kV-30 pA FIB. The patterned text image was readable with a scanning electron microscope. Moreover, three dimensional nano-thick plate module fabrication was made successfully with an FIB and a platinum deposition, and electron energy loss spectrum (EELS) analysis was easily performed with the prepared nano plate module.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.770-776
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• 2003

#140 mesh and #600 mesh wheels were adopted to grind (111) and (100) oriented single crystalline silicon wafer and the grinding induced change of the surface integrity was investigated. For this purpose, microroughness, residual stress and phase transformation were analyzed for the ground surface. Microroughness was analyzed using AFM (Atomic Force Microscope) and crystal structure was analyzed using micro-Raman spectroscopy. The residual stress and phase transformation were also analyzed after thermal annealing in the air. As a result, microroughness of (111) wafer was larger than that of (100) wafer after grinding. It was observed using Raman spectrum that the silicon was transformed from diamond cubic Si-I to Si-III(body centered tetragonal) or Si-XII(rhombohedral). Residual stress relaxation was also shown in cavities which were produced after grinding. The thermal annealing was effective for the recovery of the silicon phase to the original phase and the residual stress relaxation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.10
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• pp.3113-3125
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• 1996

The objective of this study is to develop novel method named mechanical and chemical machining technique, which is capable of producing three dimensional patterns of few micrometers in dimension on a silicon wafer without the use of a mask. The strategy is to impart mechanical energy along the path of the pattern to be fabricated on a single crystal silicon by way on introdusing frictional interaction under controlled conditions. Then, the surface is preferentially etched to reveal the areas that have been mechanically energized. Upon completion of the etching process, the three dimensional pattern is produced on the silicon surface. Experiments have been conducted to identify the optimal tool material, geometery, as well as fabrication condition. The new technique introduced in this paper is significantly simpler than the conventional method which require sophisticated equipment and much time.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.184-189
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• 2005

An experimental study of the femtosecond laser machining of Si materials was carried out. Direct laser machining of the materials for the feature size of a few micron scale has the advantage of low cost and simple process comparing to the semiconductor process, E-beam lithography, ECM and other machining process. Further, the femtosecond laser is the better tool to machine the micro parts due to its characteristics of minimizing the heat affected zone(HAZ). As a result of line cutting of Si, the optimal condition had the region of the effective energy of 2mJ/mm-2.5mJ/mm with the power of 0.5mW-1.5mW. The polarization effects of the incident beam existed in the machining qualities, therefore the sample motion should be perpendicular to the projection of the electric vector. We also observed the periodic ripple patterns which come out in condition of the pulse overlap with the threshold energy. Finally, we could machined the groove with the linewidth of below $2{\mu}m$ for the application of MEMS device repairing, scribing and arbitrary patterning.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.1151-1153
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• 1999

3-layer polysilicon 표면미세가공공정을 이용하여 micro zone plate 렌즈와 미러 및 이를 구동하기 위한 구동기를 일체화시킨 마이크로 구동형 광학소자를 설계, 제작하였다. 650nm의 파장대역에서 초점거리가 $500{\mu}m$가 되도록 마이크로 zone plate 렌즈를 설계하였으며, 렌즈의 광학축은 실리콘 기판 상에서 $121{\mu}m$거리에 위치하도록 제작하였다. 마이크로 hinge와 스프링 latch 및 측면지지 plate를 이용하여 마이크로 렌즈와 미러가 실리콘 기판상에서 out-of-plane동작이 가능하도록 하였다. 마이크로렌즈 초점거리의 가변을 위하여 6개의 SDA(Scratch Drive Actuator)어레이를 설계, 제작하였다. 또한 빔 반사를 위한 마이크로 미러를 설계하고 $45^{\circ}$ self-assembly를 위하여 마이크로 hinge와 SDA array를 제작하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.409-409
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• 2012

최근 나노크기의 미세구조 가공기술이 발달함에 따라 다양한 응용을 위한 나노소재/구조가 활발히 연구 되고 있다[1]. 그 중에서 실리콘 나노선은 태양전지, 메모리, 트랜지스터 그리고 광 공진기에 쓰일 수 있는 소재로서 기존의 실리콘 가공기술을 바로 사용할 수 있을 뿐 아니라[2], 비용 면에서 탁월한 잇점이 있기 때문에 주목 받고 있는 소재이다. 실리콘 나노선의 물리적 특성을 연구하기 위한 많은 연구가 진행되었지만, 매우 작은 크기와 높은 표면적-부피비율로 인해 생긴 독특한 특징을 완전히 이해하기에는 아직 부족한 점이 많다. 실리콘 나노선의 전류-전압특성에 영향을 미치는 요소는 도핑농도, 표면상태, 채널의 크기 등으로 다양한데, 이번 연구에서는 실리콘 나노선의 표면환경이 공기와 물 두 종류로 매질에 접하고 있을 경우에 대하여 각각 전류-전압을 측정하였다. 물이 공기와 다른 점은 크게 두 가지로 볼 수 있다. 첫째로 물의 경우에는 물에 용해된 수소이온과의 화학반응을 통하여 실리콘 표면전하가 유도되며 pH 값에 민감하게 변화한다. 둘째로 물의 유전율은 공기의 80배로서 표면부근에서의 전기장분포가 많이 왜곡된다. 이를 위하여 SOI를 기반으로 채널길이 $5{\mu}s$, 두께 40 nm, 너비 100 nm인 실리콘 나노선을 일반적인 반도체공정을 사용하여 제작하였다. 나노선의 전기적 특성 실험은 Semiconductor Parameter Analyzer (Agilent, 4155C)를 사용하여 전류-전압특성을 표면 상태를 변화시키면서 측정하였다. 실험을 통해 실리콘 나노선은 물과 공기 두 가지 표면환경에 따라 전류-전압특성이 확연히 변화하는 것을 볼 수 있었다. 동일한 전압 바이어스에서 표면에 물이 있을 때가 공기 있을 때 보다 훨씬 증가한 전류를 얻을 수 있었고(3V에서 약 2배), 비선형적인 전류-전압특성이 나타남을 관찰하였다. 본 발표에서는 이러한 실험결과를 표면에서의 전하와 정전기적인 효과로서 정성적으로 설명하고, 전산모사결과와 비교분석 하고자 한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.725-730
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• 1996

The key process in silicon surface micromachining is the selective etching of a sacrificial layer to release the silicon microstructure. The newly developed anhydrous HF/$CH_3$OH gas phase etching of TEOS (teraethylorthosilicate) sacrificial layers onto the polysilicon and the nitride substrates was employed to release the polysilicon microstructures. A residual product after TEOS etching onto the nitride substrate was observed on the surface, since a SiOxNy layer is formed on the TEOS/nitride interface. The polysilicon microstructures are stuck to the underlying substrate because SiOxNy layer does not vaporize. We found that the only sacrificial etching without any residual product and stiction is TEOS etching onto the polysilicon substrate.