• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.45-51
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• 2009

Vertical wet equipment was newly developed in stead of horizontal wet equipment which has been widely used for BGA develop process. We intended to eliminate the collision problem between equipment's transferring rollers and fine circuit patterns, which could be achieved by fixing the BGA panel vertically using jig unit. The process characteristics of vertical wet equipment were evaluated by conducting uniformity evaluation, pattern damage evaluation and defect analysis. The process uniformity of the vertical equipment was measured to be the same level as the uniformity of horizontal equipment. And it was measured that $3{\sim}4{\mu}m$ finer circuit pattern could be processed adopting vertical equipment rather than horizontal equipment.

• Journal of the Korean Vacuum Society
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• v.18 no.4
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• pp.310-317
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• 2009

Vertical wet equipment for the BGA develop process was newly developed substituted for conventional horizontal wet equipment. The benefits of vertical equipment are that the pattern damages generated by the collision between the patterns and transferring rollers can be eliminated because the direct contact between the equipment's transferring units and the soft dry film patterns does not occurs. Taguchi experiment was conducted to optimize the process characteristics for the vertical equipment. The experiment was organized as the smaller the better problem which includes adequate uncontrollable factor and controllable factors. The uncontrollable factors are the 4 sides of two panels which are loaded to the equipment at the same time. By the analysis of the experiment, temperature of the develop chemicals and develop spraying time are analyzed as the main controllable factors. Finally, line pattern's minimum width which is not damaged for the develop process was improved from $13.8{\mu}m$ for the horizontal equipment to $10.4{\mu}m$ for the vertical equipment. And dot pattern's minimum width is improved from $22.1{\mu}m$ to $16.3{\mu}m$.

• Geotechnical Engineering
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• v.21 no.10
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• pp.52-55
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• 2005

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2000.11a
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• pp.59-60
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• 2000

에어로졸을 분리할 수 있는 장비로는 전기적 이동차 분석기(differential mobility analyzer), 싸이클론(cyclone), 습식 충돌기(impinger), 습식 싸이클론(wet cyclone), 확산 배터리(diffusion battery), 관성 임팩터(inertial impactor), 그리고 가상 임팩터(virtual impactor) 등이 있다. 이중 가상 임팩터는 설계 및 제작이 비교적 간편하고, 입자를 분리 및 농축하는데도 좋은 성능을 나타냄으로 널리 사용되어져 왔다. (중략)

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2000.04a
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• pp.125-126
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• 2000

현재 공단지역에서 발생하는 오염물질을 파악하기 위해서는 오염물질이 배출되는 곳에 TMS를 설치하거나 측정하고자 하는 지점에 습식법을 이용하여 오염물질을 측정하는 방법이 사용되고 있다. 하지만 이러한 TMS나 습식법을 이용하여 오염물질을 측정하기 위해서는 고가의 설치비나 인력 장비 문제로 인하여 동시에 여러 지역을 측정하기 어렵다는 단점을 가지고 있으며, 특히 공단 지역과 같은 특수한 지역의 오염물질의 경향을 파악하기 위해서는 더욱 그러하다. (중략)

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.23-25
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• 2003

단결정 실리콘의 이방성 습식식각을 위하여 KOH 용액을 사용하여 식각 특성을 관찰하였다. 식각율은 식각액의 온도와 농도에 따라 변하는 것이 관찰되었으며, 패턴 형성 방향과 식각액의 농도에 따라 식각 형태가 다름도 알 수 있었다. 식각용액의 농도 20wt0% 이고 식각 시의 온도가 $80^{\circ}C$ 이상에서는 알파벳 "U" 자 모양의 형태로 식각이 이루어지고, 그 이하의 온도와 농도에서는 "V" 자 모양의 식각형태가 이루어졌다.; 자 모양의 식각형태가 이루어졌다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.182-189
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• 2006

현재 반도체 습식식각 공정에 사용되고 있는 방법은 batch식과 매엽식이 있다. batch식 식각방법은 매엽식보다 throughput이 많은 반면 식각균일도는 떨어진다. 매엽식은 웨이퍼를 회전시키면서 약액을 분사할 때 Boom swing을 하여 균일하게 식각할 수 있다. 본 연구에서는 Boom swing이 없는 구조의 매엽식 장비에서 약액이 상온과 고온일 때 $SiO_2$막을 식각하여 비교하였다. 각각의 조건에서 식각량의 분포와 균일도의 변화에 대해서 알아보았으며, 실험평가시 분사된 약액의 온도분포를 이론적으로 계산하여 실제 실험결과와 비교하여 보았다. 식각균일도는 batch식 보다 매엽식 스핀방식이 균일하였으며, 약액분사 방법은 boom swing을 하는 것이 더 균일하였다.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2005.11a
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• pp.122-127
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• 2005

• Tunnel and Underground Space
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• v.32 no.6
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• pp.353-362
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• 2022

The wet shotcrete refers to a method in which all materials are mixed and then supplied to the spraying device, compressed air is added to the nozzle, and the spraying speed is improved to spray on the target surface. In order to reproduce the amount of shotcrete used in the wet method in the field and the situation at the laboratory scale, it is essential to control the discharge amount of the equipment. In this study, in order to increase the reproducibility of field conditions at the laboratory scale, a flow control system for shotcrete mortar spraying equipment was developed and applied to the equipment. To verify the developed equipment, a discharge control test using water and mortar was performed. In the developed control system, the discharge was smoothly controlled according to the user input value for the mono pump, but the discharge was not properly controlled according to the input value for the screw pump because of a reducer. When a speed reducer is attached, it is necessary to adjust the operation rate of the screw pump close to the target flow rate by increasing the operation rate of the screw pump while lowering the operation rate of the mono pump.

• Journal of IKEEE
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• v.23 no.1
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• pp.107-111
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• 2019

In FPD WET equipment, heaters are used a lot. There are many electric accidents caused by short circuit and overheating due to the use of heater, so it is necessary to have a safe electric system and interlock. Therefore, in this paper, we propose an electrical schematic and interlock for FPD WET equipment. In this paper, a hardware interlock such as a level sensor, an overheat protector, and an SSR heater sink is inserted, and the electric system is composed of ELB - MC - SSR - EOCR - heater. When the interlock occurs, the magnetic contactor (MC) is turned off and the power of the heater is cut off.EOCR, an electric overcurrent protection device, has an interlock to shut down the MC when there is an abnormality in the heater while checking the overcurrent, undercurrent and disconnection. These circuit configurations and interlocks are likely to be useful not only for WET equipment but also for any equipment in which the heater is placed.