• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.23-26
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• 2002

In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of diluted slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.4
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• pp.341-347
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• 2008

Laminated LTCC components of high integrity, fabricated by thick film process, are applied to industrial field of IT technology along with miniaturization trend of electronic devices. Dispersion states were examined by several evaluation methods with MLS-22, which is one of commercial LTCC powders, to achieve optimal dispersion as basis for stable LTCC fabrication process. Slurry viscosity, surface roughness of dip-coated slide glass, sedimentaion of slurry, and SEM observation of dried surface were utilized with respective amount change of various commercial dispersants. Among these commercial dispersants, optimal dispersion state was obtained with 0.4 wt% of BYK-111, from the results of various evaluation methods.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.156-161
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• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.567-568
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• 2006

To investigate the recycle possibility of slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, three kinds of retreated methods were introduced as follows: First, the effects on the addition of silica abrasives and the diluted silica slurry (DSS) on CMP performances were investigated. Second, the characteristics of mixed abrasive slurry (MAS) using non-annealed and annealed alumina ($Al_2O_3$) powder as an abrasive added within DSS were evaluated to achieve the improvement of removal rates (RRs) and within-wafer non-uniformity (WIWNU%). Third, the oxide-CMP wastewater was examined in order to evaluate the possible ways of reusing it. And then, we have discussed the CMP characteristics of silica slurry retreated by mixing of original slurry and used slurry (MOS).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.645-646
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• 2005

The increasing hydroxyl ($OH^-$) groups diffused into the TEOS and then weakened reactants such as H-C-O-Si bonds on the surface of TEOS film were actively generated with the increase of slurry temperature. These soft reactants on the surface of TEOS film could be removed easily by mechanical parts of CMP.

• Korean Journal of Materials Research
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• v.7 no.4
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• pp.276-286
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• 1997

SOFC용 L $a_{0.68}$Ca/ sub 0.32/C $r_{0.97}$ $O_{3}$분말은 수산염법에 의해 제조되었고, 이 합성된 분말을 이용한 슬러리의 최적제조조건과 그린 필름의 최적 소성조건을 얻었으며,이 제조 조건에서 소결 시간과 온도에 따라 제조된 연결재료의 결정구조, 미세구조 및 소결거동을 각각X-선 회절, 주사전자현미경 그리고 에너지 분산 분광계를 이용하여 조사하였다. L $a_{0.68}$C $a_{0.32}$C $r_{0.97}$ $O_{3}$의 저온소결은 $Ca_{m}$ (Cr $O_{4}$)$_{n}$에 의해 이루어졌음이 관찰되었고, 이때 $Ca_{m}$ (Cr $O_{4}$)$_{n}$은 불규칙하게 녹아서 L $a_{1-x}$C $a_{x}$Cr $O_{3-}$$\delta$/와 반응하고 이 현상이 질량 이동을 증가시켜 시편의 급격한 결정립 성장과 조밀화를 야기시켰다. 이러한 결정립 성장과 조밀화는 소결온도 140$0^{\circ}C$부터 일어났다.X>부터 일어났다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.162-162
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• 2008

세리아는 고체 산화물 연료전지(SOFC, solid oxide fuel cell)의 전해질 재료와CMP( chemical mechanical polishing) 슬러리 재료, 자동차의 3원 촉매, gas sensor, UV absorbent등 여러 분야에서 사용되고 있다. 본 연구에서는 세리아의 입자의 크기와 형상을 조절하여 성능 및 물성을 향상시켜 보다 넓은 분야의 활용을 하고자 실험을 실시하였다. 세리아 합성에 사용되는 전구체인 cerium carbonate의 특성이 세리아 분말의 물리화학적 특성에 직접적인 영향을 주기 때문에 전구체의 합성 단계에서 형상과 크기를 조절하고자 하였다. 세륨염으로 cerium nitrate hexahydrate, 균일침전반응을 할 수 있는 urea를 침전제로 사용하였다. 반응 용매의 유전상수를 조절하고 반응의 과포화도 변화를 이용하기 위하여 에탄올을 첨가하여 입자의 크기 및 형상을 조절, cubic형태의 $Ce_2O(CO_3)_2{\cdot}H_2O$ 결정상을 가지는 세리아 전구체를 합성하였다. 이렇게 생성된 전구체를 $1000^{\circ}C$에서 2시간동안 하소하여 세리아를 합성하고 반응시간, 농도, 에탄올의 함량 변화에 대해 XRD, FE-SEM, particle size analyzer, micropore physisorption analyzer 분석을 통하여 입자의 결정상과 형상, 입도 분포 및 기공분포 등을 반응인자의 변화에 따라 비교 및 해석하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.336-339
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• 2004

근래에 $TiO_2$를 이용한 염료감응형 태양전지에 대한 연구가 많이 진행되어 이미 실용화 단계에 이르고 있다. 그러나, 이러한 $TiO_2$를 이용한 태양전지 효율이 한계에 이르러 이를 향상시키기 위한 노력이 다방면에서 이루어지고 있다. 이에 본 연구에서는 넓은 밴드갭 직접형 반도체재료로서, 전기적, 열적, 광학적, 촉매 특성이 우수하고, 압전성이 크고 광투과성 및 형광성이 매우 우수하여, 현재 여러 전자사업 분야에서 사용될 뿐아니라, 태양전지분야에서도 최근 관심이 증대되고 있는, ZnO를 이용하여 $TiO_2$ 대체 전극재로서의 가능성을 고찰하였다. ZnO 슬러리는 유계 방법을 이용하여 제조하였고, 막은 닥터 블레이드(doctor blade)법에 의해 TCO 위에 형성되었다. 원료 분말 및 막의 형상은 FE-SEM에 의해 확인되었다. 형성된 막은 다양한 조건에서 소결하여, 최종적으로 샌드위치형 염료감응형 셀을 제조한 후 효율을 측정 비교하여 태양전지의 활성 전극 재료로서 적정한 ZnO 조건을 예측할 수 있었다.

• Journal of the Korea Concrete Institute
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• v.20 no.5
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• pp.653-660
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• 2008

The purpose of this study is to analyze the optimal mix design of the sound absorption material that is made from perlite and various binder systems for noise barrier wall. The polymer cement slurry which is made from two types of polymer dispersions, and silicone type inorganic material are used as binder. The test specimens are prepared with various polymer cement ratios, binder ratios, and tested for strengths, freezing and thawing and sound absorption performance by the tube and the reverberation room methods. From the test results, the difference of sound absorption coefficient by the tube method is a little recognized, however, noise reduction coefficient (NRC) of test specimens bound by the polymer cement slurry is in the ranges of 0.48 to 0.51. They are a little higher than those bound by cement only, and are lower values than recommended value of 0.7 by the Ministry of Environment. However, the sound absorption coefficient of test specimens at low frequency range of 250 to 500 Hz by reverberation room method shows very high values as 0.84 to 1.00, and 0.57 to 0.77 at the high frequency. The test specimens with polymer cement slurry binder have a good balance between performance and cost, and have proper properties in strengths, freezing and thawing resistance as sound absorption material for noise barrier wall. It is apparent that the good sound absorption material can be produced according to the optimum mix design that is recommended from this study.