• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.33-36
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• 2015

It has increased several decades in the field of Indium Tin Oxide (ITO) transparent thin film, However, a major problem with this ITO thin film application is high cost compared with other transparent thin film materials[1]. So far, in order to overcome this disadvantage, we show that a transparent ITO/Ag/i-ZnO multilayer thin film electrode would be more cost-effective and it has not only highly transparent but also conductive properties. The aim of this research has therefore been to try and establish how ITO/Ag/i-ZnO multilayer thin film would be more effective than ITO thin film. Herein, we report the properties of ITO/Ag/i-ZnO multilayer thin film by using optical spectroscopic method and measuring sheet resistance. At a certain total thickness of thin film, sheet resistance of ITO/Ag/i-ZnO multilayer was drastically decreased than ITO layer approximately $40{\Omega}/{\Box}$ at same visible light transmittance. (minimal point $5.2{\Omega}/{\Box}$). Tendency, which shows lowly sheet resistive in a certain transmittance, has been observed, hence, it should be suitable for transparent electrode device.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.3 no.2
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• pp.115-119
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• 2002

This study was performed to improve mechanical properties of rotor and bushing materials. SACD and SKD11 steels as rotor and bushing materials were investigated. Gas nitriding and TiN coating were carried out on SACM and SKD11 steels. TiN coating was deposited on SKD11 steel by reactive sputtering process. This coated layer was picked off during the operation because of insufficient adhesion. Gas nitriding was carried out on SACM and SKD11 steels in an ammonia atmosphere at 51$0^{\circ}C$ for 72 hrs. These gas nitrided parts showed good mechanical properties. SKD11 steels were heat-treated to obtain optimum carbide size and distribution. As a results, the hardness increased.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.169-169
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• 2010

박막형 CIGS 태양전지의 배면전극으로 사용되는 Mo 박막은 낮은 저항으로 인한 전기전도성과 열적 안전성이 아주 우수하다. 연구에서는 연성 CIGS 태양전지의 제조를 위한 Mo 배면전극의 대면적 증착기술에 관한 것으로 DC Magnetron Sputtering 공정을 이용하여 전주기술을 통한 Ni-Fe계 연성기판재 위에 졸걸법으로 합성된 $SiO_2$ 절연박막에 Mo 박막을 증착하는 것을 목적으로 하고 있다. 실험에서는 연성기판재 대신 시편을 Sodalime glass, Si wafer, SUS계 소재를 사용하여 스퍼터링 공정에 의한 Mo 박막을 증착하였다. 실험에서 타겟에 인가되는 전력과 공정압력을 변수로 하여 Mo 박막의 증착율, 전기저항성을 측정하였다. 타겟의 크기는 $80mm{\times}350mm$, 타겟과 기판간 거리 20cm 이었으며, 공정 압력은 2~50 mtorr 영역에서 인가전력을 0.5-1.5kW로 하였다. Mo 박막의 증착율과 전기적 특성을 측정하기 위하여 $\alpha$-step과 4-point probe(CMT-SR 1000N)를 이용하였다. 그리고 Mo 박막의 잔류응력을 측정하기 위하여 잔류응력측정기를 이용하였다. Mo 박막의 미세구조분석을 위하여 SEM 및 XRD를 분석을 실시하였다. 배면전극으로서 전기저항성은 공정압력에 따라 좌우 되었으며, 2 mTorr 공정압력과 1.5kW의 전력에서 최소값인 $8.2\;{\mu}{\Omega}-cm$의 저항값과 증착율 약 $6\;{\mu}/h$를 보였다. 기판재와의 밀착성과 관련한 잔류응력 측정과 XRD분석을 통한 결정립 크기를 분석하여 공정압력에 따른 Mo 박막의 잔류응력과 전기 저항 및 결정립 크기의 상관관계를 조사하였다. 그리고 대면적 CIGS 증착공정을 위해 직각형 타겟을 통해 증착된 Mo 박막의 증착분포를 20cm 이내 조사하였다.

• Journal of the Semiconductor & Display Technology
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• v.17 no.2
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• pp.71-75
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• 2018

In this study, we prepared OLED cell with ITO (Indium Tin Oxide) films grown on the glass substrate by facing targets sputtering. Before fabrication of OLED cells, we investigated properties of ITO films deposited at various sputtering conditions. To investigate properties of as-prepared films, we employed four-point probe, UV-VIS spectrometer, X-ray diffractometer (XRD), field emission scanning electron microscopy (FE-SEM), hall-effect measurement. As a results, as-prepared ITO films have high transmittance of over 85 % in the visible range (300-800 nm) and a resistivity of under $10^{-4}$ (${\Omega}-cm$). Their resistivity increased as a function of oxygen gas flow and substrate temperature. OLED cell with ITO films were fabricated by thermal evpoeartor. Properties of OLEDs cell referring to properties of ITO films.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.31-35
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• 2018

Tungsten disulfide($WS_2$) thin films were directly deposited by direct-current(DC) sputtering and annealed by rapid thermal processing(RTP) to materialize two-dimensional p-type transition metal dichalcogenide (TMDC) thin films on soda-lime glass substrates without any complicated exfoliation/transfer process. $WS_2$ thin films deposited at various DC sputtering powers from 80 W to 160W were annealed at different temperatures from $400^{\circ}C$ to $550^{\circ}C$ considering the melting temperature of soda-lime glass. The optical microscope results showed the stable surface morphologies of the $WS_2$ thin films without any defects. The X-ray photoelectron spectroscopy (XPS) results and the Hall measurement results showed stable binding energies of W and S and high carrier mobilities of $WS_2$ thin films.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.32-36
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• 2018

For various oxygen($O_2$) to argon(Ar) gas ratio, aluminum-doped zinc oxide(AZO) films were deposited for 3 min at different duty ratio by changing reverse pulse times. As the duty ratio increased, the thickness of the AZO film decreased and the sheet resistance increased. It can be concluded that When sputtering AZO Thin film, oxygen interfered with sputtering. When the reverse time was increased, the thickness of AZO was proportional to the real sputtering time and decreased. From the optical transmittance and sheet resistance, it was possible to obtain a higher figure of merits of AZO at a lower reverse pulse time. Even at the short reversed pulse time, it can be concluded that the accumulated charges on the AZO target are completely cleared. At a lower reverse pulse time, pulsed-DC sputtering of AZO is expected to be used instead of DC sputtering in the deposition of transparent conductive oxide(TCO) films without any degradation in thickness and structural/electrical characteristics.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.1-4
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• 2019

Reactive sputtering is widely used because of its high deposition rate and high step coverage. The deposition layer is often affected by target poisoning because the target conditions are changed, as well, by reactive gases during the initial stage of sputtering process. The reactive gas affects the deposition rate and process stability (target poisoning), and it also leads unintended oxide interlayer formation. Although the target poisoning mechanism has been well known, little attention has been paid on understanding the interlayer formation during the reactive sputtering. In this research, we studied the interlayer formation during the reactive sputtering. A DC magnetron sputtering process is carried out to deposit an aluminum oxide film on a silicon wafer. From the real-time process monitoring and material analysis, the target poisoning phenomena changes the reactive gas balance at the initial stage, and affects the interlayer formation during the reactive sputtering process.

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.250-255
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• 2011

The basic properties and electrical characteristics of sputtering films deposited with a commercial cast target and Spark Plasma Sintering (SPS) were compared and analyzed. From the results, the Cu film prepared heating $60^{\circ}C/min$ (SPS process) showed a similar specific resistance compared to the commercial cast Cu film. Also, auording to the results of XRD, SIMS, and TEM. There was not much difference in the crystal structure and impurities between the two films. Consequently, the SPS Cu target was found to have quite similar properties with the commercial one and it is expected to be applied in futare research to the metal wiring material for semiconductor/display devices.

• Journal of the Semiconductor & Display Technology
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• v.21 no.3
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• pp.105-109
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• 2022

For the realization of higher reliable transition metal dichalcogenide layer, molybdenum disulfide was formed on sapphire substrate by direct current sputtering and subsequent rapid thermal annealing process. Unlike RF sputtered MoS₂ thin films, DC sputtered showed no irregular holes and protrusions after annealing process from scanning electron microscope images. From atomic force microscope results, it was possible to investigate that surface roughness of MoS₂ thin films were more dependent on DC sputtering power then annealing temperature. On the other hand, the Raman scattering spectra showed the dependency of significant E¹_2g and A¹_g peaks on annealing temperatures.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.85-89
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• 2022

We reported on annealing effect on Ga₂O₃/Al₂O₃/SiC devices grown by radio frequency sputtering method. Post-deposition annealing at 900 ℃ was performed, which results in crystallization in the Ga₂O₃ films. The major peaks (-401) and (403) of Ga₂O₃ which was thermally treated at 900 ℃ appears in the x-ray diffraction (XRD) results. Auger electron spectroscopy (AES) shows that Ga and Al atoms seems to be diffused into the opposite direction Al₂O₃ and Ga₂O₃ after annealing. Transfer and output characteristics of back-gate transistor were analyzed where SiC substrate is used as gate material. On-state current and on/off ratio increased almost 10⁹ and 10⁶ times higher in the 900 ℃ annealed sample.