• Title/Summary/Keyword: 스크린 프린트 태양전지

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The formation of electrode using inkjet print for buried contact cell (Buried Contact Cell 제작을 위한 잉크젯 프린팅 전극 형성)

  • Ryu, Han-Hee;Bae, So-Ik
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.1326-1327
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    • 2011
  • 결정질 태양전지 제작 시 실리콘 기판 표면의 전극형성은 주로 스크린 프린트를 이용하여 형성되고 있다. 이는 squeeze 와 실리콘 기판과의 직접 접촉으로 인하여 기판의 파손이 야기 될 수 있으며, 보다 미세한 전극 형성이 어려운 단점이 있다. 본 연구에서는 비접촉식 잉크젯 프린팅을 이용한 태양전지의 전극형성에 관하여 기술하였으며, 고효율 태양전지를 제작하기 위해 레이저를 이용한 grooving 형성과 전극의 패턴에 따른 반사방지막층 제거를 통하여 Buried contact cell 제작을 연구하였다. 이를 통해 전극의 선 폭을 $45{\mu}m$로 구현하였으며, 나노 크기의 입자 형태를 띤 Ag 잉크를 이용하여 인쇄하였다.

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Characterization of Electric Properties of Ag Paste for Using Front Metal (전면 전극용 Ag paste의 전기적 특성 평가)

  • Oh, Donghae;Lee, Seungjik;Kim, Il;Kim, Kihyung
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.11a
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    • pp.45.1-45.1
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    • 2010
  • 소성 온도에 따른 전면 전극과 태양전지 에미터와의 계면에서 전기적 특성을 평가하였다. Ag 전극 형성 시 특정 온도 이상의 열처리 과정을 통해 에미터와 전극 간 양질의 전기적 접촉을 형성하기 위해 소성 온도에 따라 Ag paste 내의 siver가 결정화되어 에미터 내부로 성장함을 확인 하고 Ag 전극의 전기적 특성을 평가하였다. 소성 온도 $650{\sim}750^{\circ}C$에서 전기적 특성이 가장 좋았으며 silver의 결정 생성에 의해 Ag paste와 에미터 간 전기적 접촉이 잘 형성됨을 확인 하였다.

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Brief Review of Silicon Solar Cells (실리콘 태양전지)

  • Yi, Jun-Sin
    • Journal of the Korean Vacuum Society
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    • v.16 no.3
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    • pp.161-166
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    • 2007
  • Photovoltaic (PV) technology permits the transformation of solar light directly into electricity. For the last five years, the photovoltaic sector has experienced one of the highest growth rates worldwide (over 30% in 2006) and for the next 20 years, the average production growth rate is estimated to be between 27% and 34% annually. Currently the cost of electricity produced using photovoltaic technology is above that for traditional energy sources, but this is expected to fall with technological progress and more efficient production processes. A large scale production of solar grade silicon material of high purity could supply the world demand at a reasonably lower cost. A shift from crystalline silicon to thin film is expected in the future. The technical limit for the conversion efficiency is about 30%. It is assumed that in 2030 thin films will have a major market share (90%) and the share of crystalline cells will have decreased to 10%. Our research at Sungkyunkwan University of South Korea is confined to crystalline silicon solar cell technology. We aim to develop a technology for low cost production of high efficiency silicon solar cell. We have successfully fabricated silicon solar cells of efficiency more than 16% starting with multicrystalline wafers and that of efficiency more than 17% on single crystalline wafers with screen printing metallization. The process of transformation from the first generation to second generation solar cell should be geared up with the entry of new approaches but still silicon seems to remain as the major material for solar cells for many years to come. Local barriers to the implementation of this technology may also keep continuing up to year 2010 and by that time the cost of the solar cell generated power is expected to be 60 cent per watt. Photovoltaic source could establish itself as a clean and sustainable energy alternate to the ever depleting and polluting non-renewable energy resource.

Investigation of Al Back Contact and BSF Formation by In-situ TEM for Silicon Solar Cells

  • Park, Sungeun;Song, Jooyoung;Tark, Sung Ju;Kim, Young Do;Choi, Chel-Jong;Kwon, Soonwoo;Yoon, Sewang;Kim, Donghwan
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.11a
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    • pp.38.1-38.1
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    • 2010
  • The trend to thinner crystalline silicon solar wafers in production of solar cells investigates re-evolution of back surface field (BSF) formation. We have studied mechanisms of back contact formation in Al evaporation and screen printed Al paste for Si solar cells by TEM analysis. We observed that Si diffuse into Al during heat up. The Si diffusion process made vacancies in Si wafer. The Al began to seep into the Si wafer (Al spike). During heat down, the Al spike were shrink which causes the doped region (BSF).

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The present status and future aspects of the market for printed electronics (인쇄전자 산업시장의 현황과 전망)

  • Park, Jung-Yong;Park, Jae-Sue
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.2
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    • pp.263-272
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    • 2013
  • Printed electronics creates electrically functional devices by printing on variety of substrates. Printing typically uses common printing equipment or other low-cost equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography and inkjet. Compared to conventional manufacturing of microelectronics, printed electronics is characterized by simpler and more cost-effective fabrication of high and low volume products. Now there is huge effort towards printing many other more functional components, from displays to transistors to photovoltaic cells, using the full range of printing technologies - from inkjet to roll to roll analogue print techniques. The market for printed electronics will rise from $1.99 billion in 2010 to $55.10 billion in 2020. In 2030, this industry could be $300 billion - larger than the silicon semiconductor industry - from lighting to displays[8].