• Resources Recycling
• /
• v.12 no.2
• /
• pp.3-10
• /
• 2003

Copper oxychloride used as an agricultural fungicide has been recovered from copper-containing waste etchant by the neutralization with alkali hydroxides. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. Recycling process of copper oxychloride from the waste etchant is discovered through the our study. In the range of reaction temp. 2$0^{\circ}C$-4$0^{\circ}C$, pH 5-7, pure copper oxychloride was able to prepare and the yield of copper oxychloride was higher than 95%. Physical properties of the sample have been characterized using SEM, XRD, TGA, ICP and Atomic absorption spectroscopy.

• Journal of the Korean Ceramic Society
• /
• v.38 no.11
• /
• pp.1000-1007
• /
• 2001

In an evacuated tube solar collector, the stable sealing of the heat pipe to the glass tube is important for the collector to use for a long period of time. The sealing of copper tube to the glass is quite difficult because of the large differences in the physical and chemical properties of the two materials. In this study, therefore, a proper copper oxide layer was induced to improve the chemical bonding of the two materials, and the oxidation state of copper and the interface between copper and glass were examined by XRD, SEM and EDS. Its bonding strength was also measured. Cu$_2$O was formed when the bare copper was heat-treated under 600$^{\circ}C$, while CuO oxide layer was formed above that temperature. The bonding state of CuO to the copper was very poor. The borate treatment of the copper, however, extend the stable forming of Cu$_2$O layer to 800$^{\circ}C$. Borosilicate glass tube was sealed to a copper tube by Housekeeper method only when the sealing part was covered with Cu$_2$O layer. The bonding strength at the interface was measured 354.4N, its thermal shock resistance was acceptable.

• Korean Journal of Environmental Agriculture
• /
• v.16 no.1
• /
• pp.48-54
• /
• 1997

This study was performed to develop the biological treatment technology of wastewater polluted with heavy metals. The copper-tolerant bacteria, Pseudomonas stutzeri which possessed the ability to accumulate copper, was isolated from mine wastewaters polluted with various heavy metals. The characteristics of copper accumulation in the cells and the recovery of the copper from the cells accumulating zinc, were investigated. Removal rate of copper from the solution containing 100mg/l of copper by copper-tolerant bacteria was more than 78% at 2 days after inoculation with the cells. A large number of the electron-dense granules were found mainly on the cell wall and cell membrane fractions, when determined by transmission electron microscopy. Energy dispersive X-ray spectroscopy revealed that the electron-dense granules were copper complex with the substances binding copper. The copper accumulated into the cells was not desorbed by deistilled water, but more than 80% of the copper accumulated was desorbed by 0.1M-EDTA solution. The residues of the cells after combustion at $550^{\circ}C$ amounted to about 23.2% of the dry weight of the cells. EDS analysis showed that residues were relatively pure copper compound containing more than 78.4% of copper.

• Laser Solutions
• /
• v.17 no.3
• /
• pp.1-9
• /
• 2014

In this study, we analyzed fiber laser welding for the pure copper thin plates in a series of secondary lithium-ion batteries; and performed the experiment for the purpose of the preceding study to replace bolt joints method the with the laser welding method. We have changed the peak power of the laser from 5 to 6kW, the pulse duration by 4, 6, 8, and 10ms, the frequency by 10, 12, 16, and 25Hz, and the focal position by -3, 0, and +3. As a result, when the focal position is at +3, the peak power is 5kW, and the pulse duration and the Frequency are 4ms and 25Hz, respectively, we obtain 2.1 and 2.5 times better tensional strengths, respectively, than the highest values of tensional strengths obtained with the focal positions at 0 and -3.

• Journal of the Korean Chemical Society
• /
• v.19 no.6
• /
• pp.428-433
• /
• 1975

500 ml of a sample water was extracted with 10 ml of 0.01 % dithizone-$CHCl_3$three times. When $CHCl_3$ layer was back extracted with 10 ml of 0.1 N HCl containing mercuric ion, the free metal ions come into aqueous layer. The aqueous layer was added with 2 ml of 2 N KCl and was washed with 10 ㎖ of $CHCl_3$two times in order to remove the trace dithizone, and then was recorded square wave polarogram. The concentration of copper, lead and cadmium can be determined up to 3 ppb and that of zinc up to 14 ppb with an error of 10 %.

• Journal of the Korean Chemical Society
• /
• v.55 no.4
• /
• pp.620-625
• /
• 2011

A simple, rapid potentiometric back titration of Isoniazid (INH) in the presence of Rifampicin (RIF) in tablets and syrups is described. The method is based on the oxidation of INH by a known excess of copper (II) ion and the back titration of unreacted copper (II) ion potentiometrically with ascorbic acid using a lab-made Copper Based Mercury Film Electrode (CBMFE). The titration conditions have been optimized for the determination of 1.0-10.0 mg of INH in pure and dosage forms. The precision and accuracy of the method have been assessed by the application of lack-of-fit test and other statistical methods. Interference was not caused by RIF and other excipients present in dosage forms. Application of the method for INH assay in tablets and syrups was validated by comparison of the results of proposed method with that of the British Pharmacopoeia (BP) method using F- and t- statistical tests of significance.

• Korean Journal of Materials Research
• /
• v.9 no.11
• /
• pp.1148-1152
• /
• 1999

An organometallic precursor, hfac(hexafluoroacetylacetonate) Cu(I) DMB (3,3-dimethyl- 1-butene) was synthesized, evaluated and compared with other precursors for metal organic chemical vapor deposition of copper thin films. It was found that at $40^{\circ}C$, the vapor pressure was an order of magnitude higher (about 3 torr) than (hfac) Cu vinyltrimethylsilane (VTMS) and films could be deposited at the substrate temperature of 100-$280^{\circ}C$ with deposition rate substantially higher. The copper films contained no detectable impurities as measured by Auger electron spectroscopy and had a resistivity of about 2.0$\mu\Omega$-cm in the deposition temperature range of 150 to $250^{\circ}C$. From the thermal analysis, (hfac)Cu(I)(DMB) is believed to be quite stable and no appreciable amount of precipitation was observed at $65^{\circ}C$ heating for more than a month.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.1
• /
• pp.67-71
• /
• 2021

In this study, graphene layer was grown on metal microwire using chemical vapor deposition. The difference of carbon solubility between copper and nickel resulted in the formation of mono-layer and multi-layer graphene were formed on the surfaces of copper and nickel microwires, respectively. During the growth of graphene at high temperature, copper and nickel were recrytallized and the grain size increased. The ampacity of graphene/copper microwire was improved by approximately 27%, 1.91×105 A/㎠, compared to pristine copper microwire. Similar to this behavior, the ampacity of multilayer graphene/nickel microwire was 4.41×104 A/㎠ which is about about 36% improved compared to the pure nickel microwire. The excellent electrical properties of graphene/metal composites are beneficial for supplying the electrical energy to the high-power electronic devices and equipment.

• Membrane Journal
• /
• v.23 no.1
• /
• pp.92-99
• /
• 2013

In this study the nanofiltration (NF) membrane treatment of a sulfuric acid waste solutions containing copper ion ($Cu^{+2}$) discharging from the etching processes of the printed circuit board (PCB) manufacturing industry has been studied for the recycling of acid etching solution. SelRO MPS-34 4040 NF membrane from Koch company was tested to obtain the basic NF data for recycling of etching solution and separation efficiency (total rejection) of copper ion. NF experiments were carried out with a dead-end membrane filtration laboratory system. The pure water flux was increased with the increasing storage time in sulfuric acid solution and lowering pH of acid solution because of the enhancement of NF membrane damage by sulfuric acid. The permeate flux of acid solution was decreased with the increasing copper ion concentration. Total rejection of copper ion was decreased with the increasing storage time in sulfuric acid solution and copper ion concentration, and lowering the pH of acid solution. The total rejection of copper ion was decreased from initial 37% to 15% minimum value.

• Proceedings of the KWS Conference
• /
• 2010.05a
• /
• pp.80-80
• /
• 2010

전자제품의 소형화, 경량화, 고집적화가 심화됨에 따라 전자제품을 구성하는 회로의 미세화 또한 요구되고 있다. 이러한 요구는 경성회로기판 (rigid printed circuit board, RPCB) 뿐만 아니라 연성회로기판 (flexible printed circuit board, FPCB) 에도 적용되고 있으며 이에 대한 많은 연구 또한 이루어지고 있다. 연성회로기판은 일반적으로 절연층을 이루는 폴리이미드 (polyimide, PI)와 전도층을 이루는 구리로 이루어져 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 우수한 기계적 특성, 연속공정이 가능한 장점을 가지고 있으나, 고온다습한 환경하에서 높은 흡습성으로 인해 전도층을 이루는 구리와의 접합특성이 저하되는 단점 또한 가지고 있다. 또한 전도층을 이루는 구리는 고온다습한 환경하에서 산화 발생이 용이하기 때문에 접합특성의 감소를 야기할 수 있다. 따라서 본 연구에서는 고온다습한 조건하에서 sputtering and plating 공정을 통해 순수 Cr seed layer를 가지는 연성회로기판의 seed layer의 두께와 시효시간의 변화로 인해 발생하는 접합특성의 변화를 관찰하고 분석하였다. 본 연구에서는 두께 $25{\mu}m$의 일본 Kadena사(社)에서 제작된 폴리이미드 상에 sputtering 공정을 통해 순수 Cr으로 이루어진 각각 두께 100, 200, $300{\AA}$의 seed layer를 형성한 후 전해도금법을 이용, 두께 $8{\mu}m$의 구리 전도층을 형성한 시료를 사용하였다. 제작된 시료는 고온다습한 환경하에서의 접합 특성의 변화를 관찰하기 위하여 $85^{\circ}C$/85%RH 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효처리 한 후, Interconnections Packaging Circuitry (IPC) 규격에 의거하여 접합강도를 측정하였다. 시료의 전도층은 폭 3.2mm 길이 230mm의 패턴을 가지도록, 절연층은 폭 10mm, 길이 230mm으로 구성되었으며 이를 50.8mm/min의 박리 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 파면의 형상과 화학적 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 관찰 분석하였다.