• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.10
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• pp.725-732
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• 2017

Weight reduction is one of the important issues in the automotive industry and the development of internal combustion engines vehicles, future vehicles, and eco-friendly vehicles for improving fuel efficiency. The objective of this study is to investigate the improvement of driving performance by weight reduction and optimum design for a formula-type self-designed on-road vehicle. This study is divided into the four steps. Firstly, the engine room was replaced and designed with a lighter engine. Secondly, an optimization study was conducted to simplify and lighten the vehicle components with the design of the frame. Thirdly, the structure design was optimized and the suspension was analyzed with the design of the frame. Finally, the design of an upright and hub with reduced weight was carried out using lighter parts. As a result, we reduced the weight of the vehicle by 48.5kg compared to the previous year (19.5%) and increased the acceleration from 6.8 s to 5.8 s.s.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.4 no.4
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• pp.341-345
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• 2003

ZnWO$_4$shows excellent frequency selectivity due to its high quality factor(Q${\times}$f) at microwave frequencies. However, in order to use ZnWO$_4$as multilayered wireless communication components, its other properties such as sintering temperature(105$0^{\circ}C$). $$\tau$_f$(-70ppm/$^{\circ}C$) and $$\varepsilon$_r$(15.5) should be modified. In present study, TiO$_2$and LiF were used to improve the microwave dielectric and sintering properties of ZnWO$_4$. TiO$_2$ additions to ZnWO$_4$changed $\tau$$_{f}$ from negative to positive value, and also increased $$\varepsilon$_r$, due to its high $$\tau$_f$(＋400ppm$^{\circ}C$) and $$\varepsilon$_r$(100). At 20 mol% TiO$_2$ addition, $$\tau$_f$was controlled to near zero ppm/$^{\circ}C$ with $$\varepsilon$_r$=19.4 and Q${\times}$ f=50000GHz. However, the sintering temperature was 110$0^{\circ}C$. LiF addition to the ZnWO$_4$＋TiO$_2$ mixture greatly reduced the sintering temperature from 110$0^{\circ}C$ to 85$0^{\circ}C$ due to liquid phase formation. Also LiF addition decreased the $$\tau$_f$value due to its high negative $$\tau$_f$ value. Therefore, by controlling the TiO$_2$and LiF amount. temperature stable LTCC(Low Temperature Cofired Ceramics) material with low loss in the ZnWO$_4$-TiO$_2$-LiF system could be fabricated.d.d.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.4
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• pp.596-601
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• 2020

Silicon carbide is considered a potentially useful material for high-temperature electronic devices because of its large band gap energy and p-type or n-type conduction that can be controlled by impurity doping. Accordingly, the thermoelectric properties of -SiC powder prepared by refined diatomite were investigated for high value-added applications of natural diatomite. -SiC powder was synthesized by a carbothermal reduction of the SiO₂ in refined diatomite using carbon black. An acid-treatment process was then performed to eliminate the remaining impurities (Fe, Ca, etc.). n-Type semiconductors were fabricated by sintering the pressed powder at 2000℃ for 1~5h in an N2 atmosphere. The electrical conductivity increased with increasing sintering time, which might be due to an increase in carrier concentration and improvement in grain-to-grain connectivity. The carrier compensation effect caused by the remaining acceptor impurities (Al, etc.) in the obtained -SiC had a deleterious influence on the electrical conductivity. The absolute value of the Seebeck coefficient increased with increasing sintering time, which might be due to a decrease in the stacking fault density accompanied by grain or crystallite growth. On the other hand, the power factor, which reflects the thermoelectric conversion efficiency of the present work, was slightly lower than that of the porous SiC semiconductors fabricated by conventional high-purity -SiC powder, it can be stated that the thermoelectric properties could be improved further by precise control of an acid-treatment process.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2001.04a
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• pp.80-80
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• 2001

제지 공정의 효율적인 운영을 위한 수단으로 보류 및 탈수성의 분석은 매우 중요한 작 업 이 다. 보류 및 탈수 특성 을 평 가하기 위 하여 SR(Shopper-Riegler), CSF(Canadian S Standard Freeness tester) 그리고 원형 수초지기 등의 비난류 상태의 자연탈수 특성 평가 장치와 동적 조건의 감압식 탈수성 분석기 등이 사용되고 있다. 하지만 이것들은 제지 공정 에 보다 더 근접한 탈수 및 보류 특성을 평가하기에는 부족한 점이 있다. 특히 wet-end 첨 가제들의 효능을 보다 정확히 분석하는 것이 불가능하다. 이런 이유로 난류 발생과 감압 탈 수 둥을 유도한 탈수 특성 평가 장치 개발의 필요성이 커지고 있다. R RDA - HSF(Retention Drainage Analyzer- Handsheet Former)는 지료조성, 감압탈수 및 습지의 성형이 자동화되어 보류도와 탈수성, 종이지합 및 강도를 종합 평가 할 수 있는 새 로운 실험실용 초지기이다. 보다 현장에 가까운 초지 조건을 구현하기 위해서 지료의 농도 를 높이고 진공 탈수를 실시함에 따라 기존의 탈수성 분석기나 보류도 측정기의 단점을 보 완하게 되 었다. 본 연 구에 서 는 Canadian Standard Freeness test와 Dynamic Drainage Jar test 및 원 형 수초지기를 활용한 기존의 탈수성, 보류도 분석 결과와 RDA-HSF를 비교하여, 자연 탈수를 이용하는 기존의 탈수 및 보류 설비에 비해 현장 공정을 보다 현실적으로 재현할 수 있는 감압 탈수 초지 설비로서 RDA-HSF의 활용 가능성을 분석하였다. RDA-HSF를 활용한 실험실적 분석을 통해 현장의 상황올 유사하게 재현함에 따라 공정 운영 인자의 변화에 따른 제품의 품질 및 생산효율을 예측할 수 있게 된 바, 보다 효율적 인 공정 관리가 가능할 것으로 기대된다. 안료 입자의 경우 피인쇄체의 표면 공극을 채우고, 비히클의 경우 미세한 공극속으로 침투되어 경화됨으로써 피인쇄체가 지니고 있는 공극량을 감소시커 게 될 것이다. 그리고 피인쇄체의 각종 형태의 공극으로 침투된 잉크의 양에 반비례적으로 피인쇄체의 표변에 잉크가 잔류하게 될 것이다. 따라서 본 연구에서는 여러가지 안료를 사용하여 각각 다른 공극 특성을 지니는 도공지를 제조한 후 이들이 가지는 공극 특성과 잉크의 잔류 거동에 대해 고찰해 보고자 하였다.여 표면 유효층 일부만 오버레이시키며I 주조 및 단조가 불가능한 재료까지도 표면부에 오버레이 시킴으로 서 부품 및 설비의 제조에 있어 재료비의 절감과 제품의 수명이 획기적으로 개선될 수 있다. 그리고 최근에는 도금 빛 용사 둥과 같은 표면처리를 할 경우임의 소재 표면에 도금 및 용 사에 용이한 재료를 오버레이용접시킨 후 표면처리를 함으로써 보다 고품질의 표면층을 얻기위한 시도가 이루어지고 있다. 따라서 국내, 외의 오버레이 용접기술의 적용현황 및 대표적인 적용사례, 오버레이 용접기술 및 용접재료의 개발현황 둥을 중심으로 살펴봄으로서 아직 국내에서는 널리 알려지지 않은 본 기 술의 활용을 넓이고자 한다. within minimum time from beginning of the shutdown.및 12.36%, $101{\sim}200$일의 경우 12.78% 및 12.44%, 201일 이상의 경우 13.17% 및 11.30%로 201일 이상의 유기의 경우에만 대조구와 삭제 구간에 유의적인(p<0.05) 차이를 나타내었다.는 담수(淡水)에서 10%o의 해수(海水)로 이주된지 14일(日) 이후에 신장(腎臟)에서 수축된 것으로 나타났다. 30%o의 해수(海水)에 적응(適應)된 틸라피아의 평균 신사구체(腎絲球體)의 면적은 담수(淡水)에 적응된 개체의 면적보다 유의성있게 나타났다. 해수(海水)에 적응(適應

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.35.2-35.2
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• 2009

최근 본 연구실에서 무연 솔더를 위한 새로운 Cu-Zn 합금 젖음층을 개발하였다. 전해도금을 통하여 Cu-Zn 합금층을 형성한 뒤 그 위에 Sn-4.0wt% Ag-0.5wt% Cu (SAC 405) 솔더를 리플로 솔더링을 통해 솔더접합부를 형성하였으며 계면에서 생성된 금속간 화합물의 형성 및 성장 거동을 연구하였다. SAC/Cu 시스템의 경우, $150^{\circ}C$에서 시효 처리를 실시하는 동안 솔더와 도금된 Cu 계면에서 $Cu_6Sn_5$ 상과 미세한 공공이 형성된 $Cu_3Sn$ 상이 발견되었다. 반면에 SAC/Cu-Zn 시스템에서는 계면에서 $Cu_6Sn_5$ 상만이 형성되었다. 또한 큰 판상형의 $Ag_3Sn$ 상이 SAC/Cu 시스템에 비해 현저하게 억제되었다. SAC/Cu-Zn 계면에서의 금속간 화합물의 성장 속도가 SAC/Cu 계면에서 형성된 금속간 화합물의 성장 속도보다 느리게 나타났다. Cu-Zn 젖음층의 Zn가 솔더와 Cu-Zn 층 사이에서 Cu와 Sn 원자의 상호 확산을 방해하기 때문이다. 본 연구에서는 Cu와 Cu-Zn 층을 이용한 솔더 접합부의 낙하 충격 신뢰성을 연구하였다. 낙하 충격 시험 시편은 두 개의 인쇄 회로 기판을 SAC 405 솔더볼을 이용하여 리플로를 통해 상호연결 하여 제조되었다. 이 때, 각각의 인쇄 회로 기판의 패드에는 Cu 층과 Cu-Zn층을 전해도금을 통하여 각각 $10{\mu}m$두께의 젖음층을 형성하였다. 낙하 시험 시편을 제조한 뒤, 시효 처리에 대한 낙하 저항 신뢰성의 특성을 연구하기 위해 250, 500 시간동안 시효처리를 한 후 각 조건에서 계면에 형성된 금속간 화합물의 성장 거동을 관찰하였으며, 낙하 충격 시험을 실시하였다. 낙하 시험은 daisy chain으로 연결된 시편의 저항이 100 Ohm 이상 측정되었을 때 중단되도록 하였다. Cu-Zn/SAC/Cu-Zn 시편의 경우 초기 리플로를 하였을 때 불량이 발생하는 평균 낙하 수는 350이며, Cu/SAC/Cu 시편의 평균 낙하수는 200 미만으로 나타났다. Cu/SAC/Cu 시편의 경우, 시효처리 시간이 증가함에 따라 평균 낙하수는 큰 폭으로 감소하였지만, Cu-Zn/SAC/Cu-Zn 시편은 불량이 발생하는 평균 낙하수의 감소폭이 보다 완만하게 나타났다. Cu 층에 Zn를 첨가함으로써 솔더와 젖음층 사이에서 형성된 금속간 화합물의 성장 및 미세 공공의 형성이 억제되었고, 솔더 접합부의 과냉을 감소시킴으로써 큰 판상형의 $Ag_3Sn$ 상의 형성을 억제함으로써 Cu-Zn/SAC/Cu-Zn 솔더 접합부에서 Cu/SAC/Cu 솔더 접합부보다 낙하 충격에 대한 저항성 및 신뢰성이 향상되었다. 이는 무연 솔더에 Zn를 첨가하여 낙하 충격 신뢰성을 향상시킨 것과 동일한 효과를 나타냈음을 확인하였다. 본 연구는 한국 과학 기술 재단의 전자패키지 재료 연구 센터(CEPM)와 지식 경제부의 부품 소재 기술 개발 사업의 지원을 받아 수행되었습니다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.1
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• pp.121-127
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• 2013

With the continuing demand for lightweight bicycles, carbon fiber composite materials have been widely used in manufacturing bicycle frames and components. Unlike general isotropic materials, the structural characteristics of composite materials are strongly influenced by the staking directions and sequences of composite laminates. Thus, to verify the design process of bicycles manufactured using composites, structural analysis is considered essential. In this study, a carbon-fiber-reinforced plastic (CFRP) bicycle frame was designed and its structural behavior was investigated using finite element analysis (FEA). By measuring the failure indices of the fiber and matrix under various stacking sequences and loading conditions, the effect of the stacking condition of composite laminates on the strength of the bicycle structure was examined. In addition, the structural safety of the bicycle frame can be enhanced by reinforcing weak regions prone to failure using additional composite laminates.

• Polymer(Korea)
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• v.36 no.1
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• pp.59-64
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• 2012

The impact strength of material is considered the most important design factor for small and light products. Impact strength is a unique material property, thus the impact strength should not depend upon the geometry of specimen. However it varies according to specimen thickness, notching method, and notch shape. In this study, the variations of impact strength have been investigated according to thickness, notch shape, and notching method of specimen. Engineering plastics such as PC, ABS and POM have been used in this study. Experimental results showed impact strength increased as thickness decreasesd. PC showed the highest increment of impact strength when the thickness was thin. Fractured section of PC showed brittle fracture behavior when the specimen was thick. However it showed ductile fracture behavior when it was thin. The impact strength of in-mold notched specimen showed higher than that of milling notched specimen. PC showed the highest notch sensitivity among the materials used in this experiment.

• Journal of the Economic Geographical Society of Korea
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• v.22 no.3
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• pp.291-303
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• 2019

This study analyzed the changes in the industrial environment surrounding the Gumi region and the status of the industrial crisis in the Gumi area amid such changes. The Gumi region is experiencing a more turbulent period than ever in the environment changes at the international, national and local levels, such as the transition to the Fourth Industrial Revolution, the weakening of the competitiveness of key industries including mobile devices and displays, and the moving-out of core companies such as Samsung and LG Group. Accordingly, efforts have been made to diversify the industrial structure by fostering industry of automobile parts, high-tech medical devices and carbon materials to cope with and adapt to environmental changes at the regional level. However, the Gumi region is still locked in to the mono-cultural, large enterprise-dependent industrial structure centering on the mobile and display sectors, failing to overcome the regional industrial crisis and stagnating the overall local economy. The relocation of large companies began to increase in the 2010s, reducing the protection of large corporations against environmental changes at the corporate level. As a result, the crisis factors of small and mediumsized enterprises are gradually expanding to the national and international scale and working more complexly, which is beyond the level they can afford. So it is highly likely that the current industrial crisis will deepen. Therefore, it is necessary to strengthen the resilience to adapt to changes in the environment when it comes to overcoming the industrial crisis in Gumi region. To this end, it is necessary to improve innovation capabilities and diversify businesses based on convergence and complex technologies at the enterprise level, and to be selected as a special crisis response area aimed at creating an innovative ecosystem through autonomous resonance of companies and industries at the local level.

• Journal of Adhesion and Interface
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• v.22 no.3
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• pp.98-105
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• 2021

In this study, we prepared a silver nanoparticle transferable adhesive composition with transparency and adhesive properties using UV-curable urethane acrylate containing silane groups. The urethane-based adhesive composition was applied between the Ag/PET film in which silver nanoparticles were patterned on PET and the PC film to be transferred. Immediately after UV-curing with UV, PET was removed to complete the manufacture of Ag/PC film. UV-curable urethane acrylate containing silane groups was synthesized using polycaprolactone diol (PCL), isophrone diisocyanate (IPDI), 2-hydroxyethyl methacrylate (HEMA), and (3-aminopropyl) triethoxysilane (APTES). The silane group of APTES can improve interfacial adhesion by reacting with the specially treated silver nanoparticle surface of the Ag/PET film. In addition, we improved the adhesion between silver nanoparticle and PC film by mixing UV-curable urethane acrylate containing a silane group and a functional acrylic diluent used as a diluent. We analyzed the synthesis process of urethane acrylate using FT-IR, and compared the adhesive properties, optical properties, and transfer properties according to the molar ratio of APTES and the acrylic diluent composition. As a result, the best transfer properties were confirmed in the adhesive composition prepared under the conditions of PUA2S1_0.5.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.3
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• pp.29-34
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• 2019

Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its large energy band gap and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, electric conductivity of porous n-type SiC semiconductors fabricated from ${\beta}-SiC$ powder at $2000^{\circ}C$ in $N_2$ atmosphere was comparable to or even larger than the reported values of SiC single crystals in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$, while thermal conductivity was kept as low as 1/10 to 1/30 of that for a dense SiC ceramics. In this work, for the purpose of decreasing sintering temperature, it was attempted to fabricate porous reaction-sintered bodies at low temperatures ($1400-1600^{\circ}C$) by thermal decomposition of polycarbosilane (PCS) impregnated in n-type ${\beta}-SiC$ powder. The repetition of the impregnation and sintering process ($N_2$ atmosphere, $1600^{\circ}C$, 3h) resulted in only a slight increase in the relative density but in a great improvement in the Seebeck coefficient and electrical conductivity. However the power factor which reflects the thermoelectric conversion efficiency of the present work is 1 to 2 orders of magnitude lower than that of the porous SiC semiconductors fabricated by conventional sintering at high temperature, it can be stated that thermoelectric properties of SiC semiconductors fabricated by the present reaction-sintering process could be further improved by precise control of microstructure and carrier density.