• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.3
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• pp.7-17
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• 2010

In this paper, an innovative low-power SRAM based on 4-transistor latch cell is described. The memory cells are composed of two cross-coupled inverters without access transistors. The sources of PMOS transistors are connected to bitlines while the sources of NMOS transistors are connected to wordlines. They are accessed by totally new read and write method which results in low operating power dissipation in the nature. Moreover, the design reduces the leakage current in the memory cells. The proposed SRAM has been demonstrated through 16-kbit test chip fabricated in a 0.18-${\mu}m$ CMOS process. It shows 17.5 ns access at 1.8-V supply while consuming dynamic power of $87.6\;{\mu}W/MHz$ (for read cycle) and $70.2\;{\mu}W/MHz$ (for write cycle). Compared with those of the conventional 6-transistor SRAM, it exhibits the power reduction of 30 % (read) and 42 % (write) respectively. Silicon measurement also confirms that the proposed SRAM achieves nearly 64 % reduction in the total standby power dissipation. This novel SRAM might be effective in realizing low-power embedded memory in future mobile applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.2
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• pp.1339-1347
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• 2015

This study discusses a remote control torch system equipped with a GMAW double wire reel. The welding machine is 30m away from the wire feeder at the industrial site and the feeder is three to five meters away from the torch. Accordingly, the welders cannot control the current and voltage that meets the welding condition during work when they are working at a place that prevents them from seeing the control panel, such as inside a vehicle or tank or at a far work site. They also have no choice but to stop working to change the wire reel when it is burned out completely. Such work suspension resulting from frequent moves to adjust the current and voltage as well as to replace the wire and subsequent cooling causes welding defects. This study produced a remote control torch equipped with a double wire reel by simplifying and streamlining the existing GMAW functions to reduce the troubling issue. The remote control torch equipped with a double wire reel and the existing $CO_2$ /MAG welding torch were applied as a V-groove butt in the vertical position using 6mm rolled steel for a SM50A welding structure. After welding, the condition of welded surface beads underwent a visual inspection and radiographic inspection to analyze the welding quality inside the welded part. This study also evaluated the reduction of welding defects, cost saving, the replacing performance against the existing commercial welders, and the effects on possible compatibility.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.234-234
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• 2010

최근 CMOS 소자 크기가 축소됨에 따라 소스와 드레인 영역에서의 접촉저항을 줄이기 위하여, 실리사이드 공정이 많이 연구되고 있다. 실리사이드 물질로서 NiSi는 낮은 저항률과 낮은 실리콘 소모, 낮은 공정온도, 등의 장점을 가지고 있다. 그러나, 실리사이드 형성으로 인한 나노소자의 소오스/드레인에서정션(junction) 누설전류의 증가는 큰 문제가 되므로 실리콘과 실리사이드 계면의 특성이 중요하다. 본 연구에서는 니켈을 이용한 실리사이드 형성시 계면 활성제인 에틸 요오드를 이용하여 실험을 진행하였다. 금속 유기 전구체인 MABONi을 사용하여 ALD 방식으로 증착 한 니켈 박막과 니켈 핵 형성시 계면활성제인 에틸요오드의 처리 방법에 따른 Ni-silicide 박막의 특성을 비교, 분석하였다. 먼저 자연산화막을 건식식각으로 제거한 뒤, 첫 번째 샘플에서는 10회의 주기로 초기 니켈을 증착한 뒤, 에틸요오드로 니켈의 표면 위를 처리하고, 다시 200회의 주기로 니켈을 증착하였으며, 두 번째는 첫 번째 방식에서 에틸요오드 주입 시 동시에 수소도 함께 주입하였다. 세 번째는 비교를 위해 에틸요오드 처리를 하지 않고 니켈 박막만을 증착 하였다. 이어서, 각 샘플을 급속 열처리 장비에서 $400^{\circ}C$부터 $900^{\circ}C$까지 각각 30sec간 열처리를 진행후, 반응하지 않은 잔여 니켈을 제거한 후, XRD(x-ray diffraction), AES(auger), 그리고 4-point probe 등을 이용하여 형성된 실리사이드의 특성을 분석하였다. 에틸요오드와 함께 수소를 주입한 경우 계면에서의 산소 불순물과 카본 성분이 효과적으로 제거되어 $400^{\circ}C$에서 $2.9{\Omega}/{\Box}$ 의 낮은 면저항을 가지는 NiSi가 형성되었고 모든 온도구간에서 다른 샘플에 비하여 가장 낮은 면저항 분포를 보였다. 이는 분해 흡착된 요오드에 의한 계면 특성 향상과 카본 성분이 포함된 잔여물들이 수소처리에 의해 효율적으로 제거되어 실리사이드의 특성이 향상되었기 때문이다. 계면활성제를 사용하지 않은 경우에는 $500^{\circ}C$에서 NiSi가 형성되었다. 반면에 에틸요오드로만 표면을 처리한 경우에는 니켈과 실리콘 계면에서의 카본 성분에 의하여 silicidation 이 충분히 일어나지 않았다. 이러한 결과는 향후 45nm 이하의 CMOS 공정상에서 소스와 드레인의 낮은 누설전류를 가지고, 접촉저항을 줄이기 위한 니켈 실리사이드 형성에 큰 도움을 줄 것으로 기대된다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.3
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• pp.517-526
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• 2008

A one-chip DC-DC converter circuit for OLED(Organic Light-Emitting Diode) display module of automotive clusters is newly proposed. OLED panel driving voltage circuit, which is a charge-pump type, has improved characteristics in miniaturization, low cost and EMI(Electro-Magnetic Interference) compared with DC-DC converter of PWM(Pulse Width Modulator) type. By using bulk-potential biasing circuit, charge loss due to parasitic PNP BJT formed in charge pumping, is prevented. In addition, the current dissipation in start-up circuit of band-gap reference voltage generator is reduced by 42% and the layout area of ring oscillator is reduced by using a logic voltage VLP in ring oscillator circuit using VDD supply voltage. The driving current of VDD, OLED driving voltage, is over 40mA, which is required in OLED panels. The test chip is being manufactured using $0.25{\mu}m$ high-voltage process and the layout area is $477{\mu}m{\times}653{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.565-568
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• 2014

This paper presents a 0.2V DC/DC boost converter with regulated output for thermoelectric energy harvesting. To use low voltages from a thermoelectric device, a start-up circuit consisting of native NMOS transistors and resistors boosts an internal VDD, and the boosted VDD is used to operate the internal control block. When the VDD reaches a predefined value, a detector circuit makes the start-up block turn off to minimize current consumption. The final boosted VSTO is achieved by alternately operating the sub-boost converter for VDD and the main boost converter for VSTO according to the comparator outputs. When the VSTO reaches 2.4V, a buck converter starts to operate to generate a stabilized output VOUT. Simulation results shows that the designed converter generates a regulated 1.8V output from an input voltage of 0.2V, and its maximum power efficiency is 60%. The chip designed using a $0.35{\mu}m$ CMOS process occupies $1.1mm{\times}1.0mm$ including pads.

• Journal of Korea Society of Industrial Information Systems
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• v.19 no.4
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• pp.17-24
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• 2014

In this paper, we propose a CMOS FM RX front-end structure with an automatic tunable input matching network and implement it using a 65nm CMOS technology. The proposed FM RX front-end is designed to change the resonance frequency of the input matching network at the low noise amplifier (LNA) according to the channel frequency selected by a phase-locked loop (PLL) for maintaining almost constant sensitivity level when an embedded antenna type with high frequency selectivity characteristic is used for FM receiver. The simulation results of implemented FM front-end show about 38dB of voltage gain, below 2.5dB of noise figure, and -15.5dBm of input referred intercept point (IIP3) respectively, while drawing only 3.5mA from 1.8V supply voltage including an LO buffer.

• The Journal of the Acoustical Society of Korea
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• v.16 no.4
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• pp.76-84
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• 1997

In this paper, one of the core components of a mobile communication system, VCO(Voltage Controlled Oscillator) IC is designed. The VCO IC was designed, have realized as LC turned oscillator using varicap. LC sinusoidal tuned oscillator generally requires external inductors and thus remainding circuit is implemneted in monolithic IC. The circuit is fabricated using an 15 mask IC process and has a die size of 1150um${\times}$780um. The tests showed that VCO was operated at frequencies in the regions between 880MHz-915MHz in the control voltage range of 1V to 3V at 5V supply voltage and as the power supply was varied from 4.5V to 5.5V, the frequency varied 425KHz/V. The VCO IC has frequency shift of 1.97MHz/T, carrier level of -7dBm and power consumption of 16.7mA. Also it has phase noise of -80dBc/Hz, offset at 50KHz and harmonic response of center frequency is -41dBm. For the future development of the transceiver 1 chip, the previously mentioned external devices need to be incorporated into Si MMIC.

• Journal of Korean Society of Coastal and Ocean Engineers
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• v.3 no.4
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• pp.255-260
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• 1991

A voltage measuring system specified for the voltage fluctuation of the Pusan-Hamada submarine cable is developed by adding circuits of differential amplification and analog-to-digital conversion to a microprocessor-based data logger with a data modem. This system is charaterized by its small size. no power failure. fully unmanned operation. and precise instrumental drift correction. In addition to the cable voltage and current it measures an ambient temperature and a mercury cell voltage in order to calibrate temperature effect and check its long-term stability. The data acquired by this system show that the voltage signal. comprising fast random noises with a constant width of about 0.2V. fluctuates within a range of about 1V and the fluctuation frequency is similar to that of tidal motion. The source voltage of power feeding equipment (PFE) for the cable system seems to be affected when the room temperature changes rapidly.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.8
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• pp.41-46
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• 2012

A quadrature voltage controlled oscillator(QVCO) for X-band is presented in this paper. The QVCO has fabricated in Charted $0.13{\mu}m$ CMOS process. The QVCO consists of two cross-coupled differential VCO and two differential buffers. The QVCO is controlled by 4 bit of capacitor bank and control voltage of varactor. To have a linear quality factor of varactors, voltage biases of varactors are difference. The QVCO generates frequency tuning range from 6.591 GHz to 8.012 GHz. The phase noise is -101.04 dBc/Hz at 1MHz Offset when output frequency is 7.150 GHz. The supply voltage is 1.5 V and core current 6.5-8.5 mA.