• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.177-177
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• 2004

최근 높은 복잡한 형상의 고정밀도와 고성능을 갖는 제품들을 생산할 수 있게 하기 위하여 고속 가공기의 공구 셋팅 모니터링 시스템의 사용은 고속 가공기를 이용하여 생산하는 여러 제품 공정에 절대적으로 요구되고 있다. 가공물의 형상이 고정밀화 되어가고 있으며 이들의 가공 정밀도와 생산성을 향상시키고 공구들의 파손을 방지하고 공구의 셋팅 시간을 단축하는 것이 매우 중요하다.(중략)

• 프린팅코리아
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• v.10 no.9
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• pp.68-69
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• 2011

현재 어느 회사든 제품 생산에 들어가는 원재료비 및 공정 기본 탄가는 거의 변함이 없다. 이런 무한 경쟁 시장에서 살아남기 위한 최선의 방법은 좀 더 빠르고 정확한 셋팅을 통해 완벽한 제품의 생산성을 향상시키는 것과 남과 차별화된 제품을 생산하는 것이다. 이런 고민을 해결하고자 썬엔지니어링(주)(대표이사 곽인효)은 멀티형 컴퓨터 접착기(트윈 휘더 부착)를 개발하고 8월 8일부터 9일까지 이틀간 썬엔지니어링 부천공장에서 신제품 시연회를 가졌다.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.14 no.4
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• pp.323-327
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• 2021

This paper produced SUS MASK, which is used for OLEDs, using an automatic liquid management system. The SUS MASK was tested by setting the hole diameter to 0.4 mm. The additive F300 was found to be excellent as the hole diameter was close to 0.4 mm and the error range was measured to be 0.08 on average. And as a result of measuring the weight reduction amount of CuCl2 and FeCl3 according to the change in oxidation-reduction potential (ORP), FeCl3 is relatively sensitive to ORP changes. Experiments were conducted on whether ORP (610 mV) and specific gravity (1.463) were automatically controlled while continuously etching the SUS Mask. Experimental results show that the automatic liquid management system is well controlled because the setting value is not significantly changed. After setting the hole diameter to 0.4 mm as the target, the experiment results were measured from 0.36 to 0.44. Therefore, it is expected that etching processing in the manufacturing process of SUS MASK can be improved with higher precision by applying the manufactured automatic liquid management system.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2022.05a
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• pp.27-30
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• 2022

The plasma process, which has many advantages in terms of efficiency and environment compared to conventional process methods, is widely used in semiconductor manufacturing. Plasma Sheath is a dark region observed between the plasma bulk and the chamber wall surrounding it or the electrode. The Plasma Sheath Monitoring Sensor (PSMS) measures the difference in voltage between the plasma and the electrode and the RF power applied to the electrode in real time. The PSMS data, therefore, are expected to have a high correlation with the state of plasma in the plasma chamber. In this study, a model for predicting the state of nitrogen ions in the plasma chamber is training by a deep learning machine learning techniques using PSMS data. For the data used in the study, PSMS data measured in an experiment with different power and pressure settings were used as training data, and the ratio, flux, and density of nitrogen ions measured in plasma bulk and Si substrate were used as labels. The results of this study are expected to be the basis of artificial intelligence technology for the optimization of plasma processes and real-time precise control in the future.

• Journal of the Korean Society of Clothing and Textiles
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• v.30 no.2 s.150
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• pp.275-285
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• 2006

The purpose of this study was to examine the change of dyeing ability by K/S values, when dyed in different twisting processes and by one bath system and two bath system, to find possible ways of minimizing the color difference between cotton and polyester in composite yarn. The two types of composite yarn, which had one setting process(CP1) and two setting processes(CP2) were dyed with reactive/disperse dyes in both one bath dyeing system and two bath system. The dyeing ability according to the two different twisting processes was measured, and the values of the CP1 were higher compare to the values of CP2 in both one and two bath dyeing systems. This is because CP1 applied only one setting could shrink dyeing process at 130$^{circ}C$. This shrinkage increased the number of twists in the unit length and increased the yarn density, and this is the reason that the K/S values were measured higher than those of CP2. In wet shrinkage test, in opposition to CP2 only had 0.76$\%$ of the shrinkage rate, CP1 had 3.00$\%$ of the shrinkage rate. Also, the dyeing ability according to the two different dyeing methods was measured, and the values of CP1 and CP2 were both higher when dyed in two bath system. On the other hand, the color differences between cotton and polyester in composite yarns, were smaller for CP2 than that for CP1 and were also smaller in two bath dyeing system than in one bath dyeing system. Therefore, the ways of minimizing color difference between cotton and polyester in composite yarn are to apply enough setting in order to minimize shrinkage in dyeing process and to choose two bath dyeing system.

• Journal of IKEEE
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• v.26 no.3
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• pp.422-429
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• 2022

A light sensor chip requires a small capacity eFuse (electrical fuse) OTP (One-Time Programmable) memory IP (Intellectual Property) to trim analog circuits or set initial values of digital registers. In this paper, 128-bit eFuse OTP IP is designed using only 3.3V MV (Medium Voltage) devices without using 1.8V LV (Low-Voltage) logic devices. The eFuse OTP IP designed with 3.3V single MOS devices can reduce a total process cost of three masks which are the gate oxide mask of a 1.8V LV device and the LDD implant masks of NMOS and PMOS. And since the 1.8V voltage regulator circuit is not required, the size of the illuminance sensor chip can be reduced. In addition, in order to reduce the number of package pins of the illumination sensor chip, the VPGM voltage, which is a program voltage, is applied through the VPGM pad during wafer test, and the VDD voltage is applied through the PMOS power switching circuit after packaging, so that the number of package pins can be reduced.