• Clean Technology
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• v.18 no.3
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• pp.287-294
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• 2012

In this study, performances of two cleaning methods were analyzed and a cleaning system was designed to develop a cleaning process of electronic components to remanufacture old laser copy machine. First, plasma cleaning as a dry cleaning method was executed to test cleaning ability. In cleaning of printed circuit board (PCB) by plasma, some damages were found near the metal parts, and considering the productivity, this method was not adequate for the cleaning of electronic components. With 4 different cleaning agents, ultrasonic cleaning tests were executed to select an optimal cleaning agent, aqueous agents showed superior cleaning performance compared to semi-aqueous and non-aqueous agents. Cleaning with aqueous cleaning agent A and 28 kHz ultrasonic frequency can be completed in 30 sec to 1 min. Finally, an ultrasonic cleaning system was constructed based on the pre-test results. Optimal cleaning conditions of 40 kHz and $50^{\circ}C$ were found in the field test. The productivity and economic efficiency in remanufacturing of laser copy machine are expected to increase by adapting developed ultrasonic cleaning system.

• Journal of Korean Society of Environmental Engineers
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• v.37 no.3
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• pp.152-158
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• 2015

This paper investigated the membrane fouling potential at the state of passive adsorption which is no permeation with the test modules on COD (Chemical oxygen demand) loading rates, examined the recovery rate and resistance on membrane fouling by three cleaning manners of hydrophobic membrane in a bioreactor. The results showed that high COD loading led to the increase of extra-cellular polymeric substances and filtration resistance. The permeability resistance from 1st day to 63rd day was getting increased, however, the value of permeability resistance after 63th day during the operation period was almost same level at three COD loading rates, it was due that the biomass adhesion on membrane surface at the state of passive adsorption reached to the critical state. Also, the final recovery rates after three cleaning manners were 78%, 72% and 69% at the COD loading concentrations of 250 mg/L, 500 mg/L and 750 mg/L respectively, and then recovery rate by physical cleaning at Run 2 and Run 3 was decreased after 40th day, it proved that biomass cake, which is not easily removed, was formed on the membrane surface because of high COD loading rate and EPS concentration.

• Clean Technology
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• v.14 no.2
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• pp.103-109
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• 2008

In this study, in order to develop evaluation method of the cleaning efficiency of residual flux which remains on the surface after soldering with solder paste, a specially designed metal tool is used to reduce spread uncertainty of flux while soldering. Using this tool, the measurement of cleaning efficiency of flux after soldering for some typical alternative semi-aqueous cleaners and 1,1,1-TCE by weighing method was conducted. As the test result of cleaning efficiency for each cleaner at several different cleaning times, the precision of the data is confirmed to within about 4% relative standard deviation (RSD) range. So, it is considered that this would be a good evaluation method for evaluating the cleaning efficiency of the residual flux which remains after solder paste soldering in the alternative cleaning. The results of this test method shows that the cleaning efficiency of ST 100SX and Neozal 750H in the cleaning of residual flux was better than other semi-aqueous cleaners, but its cleaning efficiency was clearly inferior to 1,1,1-TCE.

• Applied Chemistry for Engineering
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• v.16 no.4
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• pp.533-541
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• 2005

Non-aqueous cleaning agents were formulated with 2,2,2-trifluoroethanol (TFEA) and hydrofluoroether (HFE), and their physical properties and cleaning abilities were examined. TFEA-based aqueous cleaning agents were also formulated with nonionic surfactants, hydrotropes and builders, and their cleaning abilities were compared. Possibilities of these cleaning agents as substitutes for CFC-113 and 1,1,1-TCE were finally evaluated. In this work, fluxes, cutting oils, greases, and fluoric oils were selected as model contaminants for cleaning experiments. These contaminants have different properties of water-solubility or hydrophilicity, and fat-solubility or lypophilicity. Cleaning abilities of TFEA-based cleaning agents were analyzed and compared through the measurement of contaminant weight changes as a function of cleaning time, and their possibilities as alternative cleaning agents were evaluated. As a result, it was shown that TFEA and HFE-based non-aqueous cleaning agents have quite a good cleaning power for fluxes and fluorine soils but low one for greases. And TFEA-based agueous cleaning agents which consisted of nonionic surfactants, hydrotrope, and builders were very effective for cleaning fluxes and greases under certain formulation conditions. Thus, it was revealed that the TFEA-based cleaning agents were very effective for cleaning specific contaminants and can be used as substitutes for CFC-113 and 1,1,1-TCE in some industrial applications.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.32.2-32.2
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• 2011

반도체 생산공정에서 CMP (Chemical-mechanical planarization) 공정은 우수한 전기전도성 재료인 Cu의 사용과 다층구조의 소자를 형성하기 위해서 도입되었으며, 최근 소자의 집적도가 증가함에 따라 CMP 공정 비중은 점점 높아지고 있다. Cu CMP 공정에서 연마제인 슬러리는 금속 표면과의 물리적 화학적 반응을 동시에 사용하여 표면을 연마하게 되며, 연마특성을 향상시키기 위해 산화제, 부식방지제, 분산제 및 다양한 계면활성제가 첨가된다. 하지만 슬러리는 Cu 표면을 평탄화하는 동시에 오염입자, 유기오염물, 스크레치, 표면부식 등을 발생시키며 결과적으로 소자의 결함을 야기시킨다. 특히 부식방지제로 사용되는 BTA (Benzotriazole)은 Cu CMP 공정 중 Cu-BTA 형태로 표면에 흡착되어 오염원으로 작용하며 입자오염을 증가시시고 건조공정에서 물반점 등의 표면 결함을 발생시킨다. 이러한 문제점을 해결하기 위해 Cu 표면에서 식각과 부식반응을 최소화하며, 오염입자 제거 및 유기오염물을 효과적으로 제거하기 위한 Post-CMP 세정 공정과 세정액 개발이 요구된다. 본 연구에서는 오염입자 및 유기물 제거와 동시에 표면 거칠기와 부식현상을 제어할 수 있는 post Cu CMP 세정액을 개발 평가하였다. 오염입자 및 유기오염물을 제거하기 위해서 염기성 용액인 TMAH 사용하였으며, Cu 이온을 용해할 수 있는 Chelating agent와 표면 부식을 억제하는 부식 방지제를 사용하여 세정액을 합성하였다. 접촉각 측정과 FESEM(field Emission Scanning Electron Microscope) 분석을 통하여 CMP 공정에서 발생하는 유기오염물과 오염입자의 흡착과 제거를 확인하였으며 Cu 웨이퍼 세정 전후의 표면 거칠기의 변화와 식각량을 AFM(Atomic Force Microscope)과 4-point probe를 사용하여 각각 평가하였다. 또한 세정액 내에서의 연마입자의 zeta-potential을 측정 및 조절하여 세정력을 향상시켰다. 개발된 세정액과 Cu 표면에서의 화학반응 및 부식방지력은 potentiostat를 이용한 전기화학 분석법을 통해서 chelating agent와 부식방지제의 농도를 최적화 시켰다. 개발된 세정액을 적용함으로써 Cu-BTA 형태의 유기오염물과 오염입자들이 효과적으로 제거됨을 확인하였다.

• Journal of the Korean Chemical Society
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• v.47 no.6
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• pp.608-613
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• 2003

In order to remove particles on surface of post-oxide CMP wafer, new cleaning solution was prepared by mixing with DHF (Diluted HF), nonionic surfactant PAAE (Polyoxyethylene Alkyl Aryl Ether), DMSO (Dimethylsulfoxide) and D.I.W.. Silicone wafers were intentionally contaminated by silica, alumina and PSL (polystylene latex) which had different zeta potentials in cleaning solution. This cleaning solution under megasonic irradiation could remove particles and metals simultaneously at room temperature in contrast to traditional AMP (mixture of $NH_4OH,\;H_2O_2$ and D.I.W) without any side effects such as increasing of microroughness, metal line corrosion and deposition of organic contaminants. This suggests that this cleaning solution would be useful future application with copper CMP in brush cleaning process as well as traditional post CMP cleaning process.

• Journal of Naturopathy
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• v.11 no.1
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• pp.31-38
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• 2022

Background: New beauty soaps are always subject to evaluation. Purposes: This study performed a human application test and safety evaluation on the cleaning effect of the fine dust mimic of the test product, Daziwar soap bar, on 52 women. Methods: The quantitative change measured the cleaning effect of fine dust before and after washing immediately after spraying the fine mimetic dust on the forearm of 22 women. In addition, the safety was evaluated at 30 minutes, 24 hours, and 48 hours after 24 hours after applying the patch to the woman's back. Results: After one time washing with the soap immediately after spraying dust on the inside of the arm, the amount of the remaining mimetic was statistically significantly decreased in both the test group and the control group (p < .001). However, the washing rate was 99.96% in the experimental group and 75.58% in the control group. The questionnaire was evaluated as 'Good' or higher in terms of efficacy. In the evaluating of adverse reactions after washing fine dust by a dermatologist, there were no reports or observations of specific skin adverse reactions or abnormal findings in the subjects. The safety evaluation was judged as non-irritating in the skin reaction evaluation at 30 minutes, 24 hours, and 48 hours after instillation on the back for 24 hours. Conclusions: The test product, Daziwar soap, was found to be very helpful in cleaning fine dust on the human body and was found to be safe for the human body.

• Clean Technology
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• v.11 no.3
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• pp.129-139
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• 2005

Fluoride-type cleaning agents such as TFEA (2,2,2-trifluoroethanol) and HFE (hydrofluoroether) are noticed to be next generation cleaning agents alternative to CFCs since they do not destruct ozones in the stratosphere due to no containment of chloride in the molecule, have lower global warming potential compared to HFCs and HCFCs, and are thermally stable compounds. Thus, the physical properties and cleaning agents were measured and compared with those of CFC-113, 1,1,1-TCE and HCFC-141b which are ozone destruction substances. They were also compared and evaluated with those of IPA and methanol which are currently employing as alternative cleaning agents. And TFEA-based cleaning agents consisted of TFEA and alcohols or HFEs were formulated, their physical properties and cleaning abilities were measured and their utilization as alternative cleaning agents was evaluated. As a result, TFEA and HFEs have lower cleaning ability for their removal of various soils compared to chloride-type cleaning agents, but theyshow excellent cleaning ability for Fluoride-type soils. And it is observed that the formulated cleaning agents of TFEA and alcohols or HFEs caused to increase cleaning ability of flux and unsoluble cutting oil more than 100% compared to their individual component. Therefore, the fluoride-type cleaning agents are expected to be utilized for development of environmental-friendly non aqueous cleaning agents with excellent cleaning ability if they are formulated with proper solvents or additives.

• Korean Chemical Engineering Research
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• v.48 no.3
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• pp.401-404
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• 2010

A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study. In cleaning of electronic and semiconductor equipment, a substrate(IPC-A-36) was used to test the jet forces of the agent. And according to the jet forces time of the cleaning agent, the corresponding moving distances were compared with the spray times, and for the pollutants of iron powder and dust, the cleaning efficiency was tested with the IPC-A-36 by a weight method. The moving distance increased with the spray cleaning time longer. For a spray cleaning time of 3sec, the cleaning efficiency decreased with the amount of dust and the iron powder. It was also observed that the dust was remarkably removed, compared to the iron powder.

• Clean Technology
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• v.19 no.3
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• pp.219-225
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• 2013

Environment-friendly and surfactant-free aqueous cleaning agents have been developed in order to solve various problems generated by surfactants in the aqueous cleaning agents. Aqueous surfactant-free cleaning agents, S-1 and S-2 have been formulated with water-soluble solvents such as propylene glycol and propylene glycol ether on their main components and with some additives. These solvents were chosen because of their good solubility in water and excellent solubility of fluxes which are major contaminants of printed circuit board in the electronic industry. Physical properties of the formulated and the imported cleaning agents were measured to predict their cleaning performance, and their cleaning abilities of flux and solder contaminants were evaluated under the various ultrasonic frequencies by a gravimetric method. The measurement results show that the physical properties of cleaning agent V are generally similar with those of formulated cleaning agents S-1 and S-2. Both the cleaning agent V and the formulated cleaning agents S-1 and S-2 showed similar trends that their pH decrease in the beginning and then increases later on with the increase of their dilution in water. It is considered that the wetting indices of the cleaning agents calculated with experimental values do not not have any influence on their cleaning ability. In ultrasonic cleaning tests under three ultrasonic frequencies of 28, 45, and 100 kHz, their best performances of cleaning solder and flux were obtained at 45 kHz and 28 kHz, respectively, and the cleaning performance of the formulated cleaning agents S-1 and S-2 was better than that of the cleaning agent V. However, in the case of the recommended diluted concentration of 25 wt% cleaning solution, the cleaning performance of the cleaner V for solder and flux was better in the initial stage of cleaning compared to the formulated cleaners. And it may be concluded that the formulated cleaning agents S-1 and S-2 can be applied to cleaning of solder and flux in the industry, based on the experimental results in this study.