• Applied Chemistry for Engineering
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• v.9 no.5
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• pp.619-623
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• 1998

The influences of reaction temperature, HF/DCM mole ratio, contact time and catalyst type on activity and selectivity of difluoromethane synthesis via hydrofluoriation of dichloromethane over fluorinated catalyst have been studied. It has been found that fluorinated $Cr/Al_2O_3$ catalysts, show better performance compared to pure fluorinated $Al_2O_3$ catalyst and then, non-treated catalysts demonstrate better than catalysts pretreated with hydrogen and air. The results show that the optimum reaction conditions are found as follows : reaction temperature at $340^{\circ}C$, mole ratio of HF/DCM 5 or above and contact time 20 sec. or above. With these conditions the maximum attainable yield of difluoromethane has been found to be greater than 80%. In particular, the activity and the selectivity of difluoromethane do not change with the reaction time on stream up to 8 hours.

• Proceedings of the Korea Water Resources Association Conference
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• 2020.06a
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• pp.286-286
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• 2020

인공함양은 대수층함양관리 중 하나의 기법이며 하수처리장 방류수의 영향을 직·간접적으로 받은 물을 지하대수층에 함양하여 수질의 향상을 기대할 수 있다. 그러나 방류수의 영향으로 인해 다수의 미량유해물질들이 대수층으로 유입됨에 따라 함양 후 회수할 때 이들의 검출이 빈번해졌다. 이에 따라 이 미량유해물질의 제거를 위해 인공함양의 후속 공정으로 나노막 여과를 고려하여 인공함양과 나노막 공정을 통하여 미량유해물질의 거동을 파악하고자 하였다. 본 연구에서는 인공함양 지하저수지 모사 컬럼을 설계하여 실험하였다. 서울특별시 탄천 하류에서 샘플링한 물을 원수로 사용하였으며 인공함양에 앞서 염소, 과망간산염, 오존의 3종류 산화 전처리를 통하여 그 영향을 확인하고자 하였다. 함양기간은 2.5일이었으며 함양 후 나노막 장치를 통하여 최종 유출수를 획득하였다. 인공함양 결과 용존유기물은 45%~63% 수준에서 제거가 되어 인공함양시 용존유기물의 제거가 가능함을 확인하였다. 산화 전처리에 따른 동화가능유기탄소의 증가로 인하여 생분해가 주요 기작인 인공함양 처리를 통하여 동화가능유기탄소의 제거율이 유기용존탄소의 제거율에 직접적으로 영향을 주었음을 알 수 있었다. 미량유해물질로 알려진 과불화화합물의 경우 산화 전처리에 따른 제거는 관찰되지 않았으며 잔류의약물질의 경우 대상 물질의 물리·화학적 특성에 따라 산화시 제거가 가능함을 확인하였다. Iopromide와 같은 조영제의 경우 오존 산화를 통하여 98% 이상 제거되어 산화를 통한 제거가 가능함을 확인하였다. 인공함양시 과불화화합물은 분자량이 큰 PFNA, PFDA, PFOS 등이 제거되었으며 그 제거율은 각각 최대 >99%까지 도달하였다. 분자량이 작은 과불화화합물의 경우 인공함양을 통과하는 경향을 보였다. 잔류의약물질의 경우 생분해가 용이한 물질은 제거가 됨을 확인하였으며 carbamazepine 등 제거가 안 되는 물질은 제거율이 18% 미만으로 확인하였다. 나노막 여과 결과 과불화화합물이 최대 >99%까지 제거됨을 확인하였으며 미량유해물질의 경우에도 대부분의 물질이 제거됨을 확인하였다.

• Applied Chemistry for Engineering
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• v.10 no.2
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• pp.242-246
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• 1999

For the fluorination of $CF_2Cl_2$, the yield of $CF_4$ was found to be increased with the contact time and the reaction temperature. When the mole ratio of HF/$CF_2Cl_2$ is 3 or above, the yield of $CF_4$ was attained to 100% at $370^{\circ}C$ and contact time of 3 seconds. In the case of the fluorination of $CCl_4$ with HF, the yield of $CF_4$ was obtained above 90% at the reaction temperature of $500^{\circ}C$, the contact time of 3 seconds, and the mole ratio of HF/$CCl_4$ of 5.

• Korean Chemical Engineering Research
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• v.48 no.5
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• pp.627-631
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• 2010

$\alpha$-Alumna particles were prepared by a precipitation method with metal fluoride additive. Aluminum nitrate and ammonia solution were used as starting materials. $AlF_3$, $CaF_2$, and $MnF_2$ were utilized as additives. The effects of precipitation solvent and metal fluoride on the phase transformation temperature, size and morphology of $\alpha$-alumna particles were investigated. The solvent for precipitation did not affect the phase transformation temperature, while it influenced the size of $\alpha$-alumna particles. The phase transformation temperature to $\alpha$-alumna was reduced by addition of metal fluoride and was different with metal cation in metal fluoride ($AlF_3(800^{\circ}C)$ < $MnF_2(900^{\circ}C)$ < $CaF_2(950^{\circ}C)$). The addition of each of three metal fluorides led to the formation of platelike particles and, among the three additives, $MnF_2$ additive resulted in the formation of relatively small particle.

• Korean Chemical Engineering Research
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• v.59 no.4
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• pp.632-638
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• 2021

With the copper interconnection in the semiconductor process, complex residues including copper oxide, fluoride, and polymeric fluorocarbon are formed by plasma etching. In this study, a cleaning solution was prepared with a component having an amine group (-NH₂) and a carboxyl group (-COOH), and the characteristics of removing post-etch residues in the copper wiring process were analyzed. In the cleaning solution containing an amine group, the length of the component substituted with nitrogen and the length of the carbon chain influenced the cleaning effect, and the etching rate of copper oxide increased as the pH of the cleaning solution increased. The activity of the amine group is in the basic region, and the activity of the carboxyl group is in the acidic region, and the cleaning process proceeds through complex formation with copper or copper oxide in each region.

• Clean Technology
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• v.14 no.3
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• pp.184-192
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• 2008

Fluoride-type cleaning agents such as 2,2,2-trifluoroethanol (TFEA) and hydrofluoroethers (HFEs) do not destroy ozone in the stratosphere and have low global warming potential compared to hydrofluorocarbons(HFCs) and hydrochlorofluorocarbons (HCFCs). Especially, HFEs which have no flash point are paid attention as next generation type of cleaning agents for chlorofluorocarbons (CFCs) since they are safe in handling and have excellent penetration ability compared to hydrocarbon cleaning agents with low flash point. Here, the physical properties and cleaning abilities of fluoride-type cleaning agents such as TFEA, HFE-7100, HFE-7200, HFE-476mec, HFE-449mec-f, AE-3000 and AE-3100E and silicide-type cleaning agents such as trifluoroetoxytrimethylsilane (TFES) and hexamethyldisilazane (HMDS) were measured and compared with those of ozone destruction substances such as CFC-113 and 1,1,1-trichloroethane. They were also compared with toxic methylene chloride (MC) and isopropyl alcohol (IPA) which are now being used as an alternative cleaning agents. As a result, TFEA and HFEs had lower cleaning ability for removal of various soils compared to chloride-type cleaning agents, but they showed excellent cleaning ability fur fluoride-type soils. TFES and HMDS also showed excellent cleaning ability for silicide-type soils.

• Applied Chemistry for Engineering
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• v.9 no.5
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• pp.629-633
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• 1998

The synthesis of 1,1-difluoroethane from acetylene as a function of HF/acetylene ratio, contact time and reaction temperature was studied on a fluorinated ${\gamma}-Al_2O_3$. The fluorination of ${\gamma}-Al_2O_3$ was treated with pure HF gas at high temperature. The crystallinity, the porosity, and the acid properties of the prepared samples were examined using XRD, the nitrogen adsorption, pyridine-IR and ammonia-TPD respectively. The activity was enhanced by further fluorination of alumina. The fraction of 1,1-difluoroethane was obtained above 90% at reaction temperature of about $200^{\circ}C$. The ratio of 1,1-difluoroethane to vinylfluoride over fluorinated ${\gamma}-Al_2O_3$ catalyst was increased with the mole ratio of HF/acetylene and contact time, and was found to be the highest ratio at reaction temperature of $200^{\circ}C$.

• Proceedings of the Korea Concrete Institute Conference
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• 1999.10a
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• pp.123-126
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• 1999

On this study, CaCO3(CF) treated with H2SiF6 as a fluorine copmpound and analyzed its basic property. When CF added with cement and mortar, we also examined effect of CF on the physical property of cement and mortar.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.3
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• pp.61-66
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• 1993

The interface properties of Fluoride/GaAs structures were investigated. It was foung that rapid thermal annealing(RTA) typically 800-850$^{\circ}C$for 1 min, was useful for improving the interface properties of that structures. The analysis by means of SIMS indicated that interdiffusion of each constitutional atom through the interface was negligible. The interfacial atom bonding model for RTA treatment was proposed. Bases on these results, inversion-type GaAs MISFET was fabricated using standard planar technologies.

• Korean Journal of Heritage: History & Science
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• v.19
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• pp.48-62
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• 1986