• Membrane Journal
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• v.30 no.1
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• pp.30-37
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• 2020

Polymer/inorganic composites were used as a protective layer of lihitum metal electrode for effective suppression of lithium dendrite. PVDF-HFP was used as an polymer material and TiO₂ nanoparticle was used as an inorganic material. PVDF-HFP is a highly flexible polymer that acts as a matrix of inorganic materials while TiO₂ nanoparticle improves the mechanical strength and ion conductivity of the protective layer. The as-synthesized protective hybrid membrane exhibited good dispersion of TiO₂ in the PVDF-HFP matrix by SEM, AFM and XRD analyses. Furthermore, the electrochemical analysis showed that the polymer-inorganic composite retained high coulombic efficiency of 80% and low overpotential, less than 20 mV until the 100^th cycles due to the improved mechanical properties and ion conductivity in comparison to the control sample (untreated and PVDF-HFP polymers/Cu).

• Transactions of the Korean hydrogen and new energy society
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• v.20 no.6
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• pp.455-463
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• 2009

코발트 보호막 코팅이 적용된 페라이트계 스테인리스 스틸인 STS 430과 STS 444 소재에 대해 고체산화물 연료전지용 금속연결재로서의 고온 산화 특성에 대해 살펴보았다. 코발트 코팅층은 $800^{\circ}C$ 고온 산화 후 코발트 산화물 및 $Co_2CrO_4$, $CoCr_2O_4$, $CoCrFeO_4$ 등과 같은 코발트가 함유된 스피넬 상을 형성하였다. 또한 페라이트계 스테인리스 스틸과 코발트 코팅의 계면에서 크롬과 철이 함유된 치밀한 산화층을 형성하여 금속연결재 표면의 스케일 성장속도를 감소시키고 금속연결재 내에 함유된 크롬의 외부 확산을 효과적으로 억제하였다. 한편 STS 430은 고온 산화 후 표면에 형성된 스케일 하부에 $SiO_2$와 같은 내부 산화물이 형성된 반면 STS 444는 표면 스케일 이외에 다른 내부 산화물은 확인되지 않았으며 고온에서의 면저항 측정 결과, 코발트가 코팅된 STS 444의 전기 전도성이 STS 430 보다 우수한 것으로 나타났다.

• Journal of Sensor Science and Technology
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• v.9 no.5
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• pp.389-395
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• 2000

In this paper, we propose the formation of an $Al_2O_3$ pre-layer using a protective Si-oxide layer and Al layer. Deposition of a thin film layer of aluminum onto a Si surface covered with a thin Si-oxide layer and annealing at $800^{\circ}C$ led to the growth of epitaxial $Al_2O_3$ layer on Si(111). And ${\gamma}-Al_2O_3$ layer was grown on the $Al_2O_3$ per-layer. Etching of the Si substrate by $N_2O$ gas could be avoided in the initial growth stage by the $Al_2O_3$ pre-layer. It was confirmed that the $Al_2O_3$ pre-layer was effective in improving the surface morphology of the very thin ${\gamma}-Al_2O_3$ films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.295-296
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• 2005

Poly-Silicon Thin Film Transistor 응용을 위한 $SiO_2$ 박막 성장에 관한 연구로서 기존의 ICP-CVD를 이용한 실험에서 $SiH_4$ 가스대신 유기 사일렌 반응물질인 TEOS(TetraethylOrthosilicate) Source를 이용하여 APCVD 법으로 성장시켰다. $SiO_2$ 박막은 반도체 및 디스플레이 분야에서 필드산화막, 보호막, 게이트 절연막 등으로 사용되며, 이러한 산화막 증착을 TEOS를 이용하였고, 빠른 증착과 더 좋은 특성을 갖는 박막 형성을 위하여 $O_2$ 반응가스를 이용하였고, Ellipsometor, XPS 등을 이용하여 계면 특성 분석을 하였다.

• Transactions of the Korean hydrogen and new energy society
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• v.17 no.2
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• pp.181-192
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• 2006

PEC전지 전극으로 사용될 수 있는 CdSe는 수용액상에서 광부식이 심하기 때문에 투명한 보호막이 필요하다. TiO2는 광부식이 심한 광전극의 보호막으로 적당하며 이 논문에서 화학적 방법(전기증착과 화학조증착)을 이용하여 산성용액이나 알칼리용액에서 TiO2 박막을 제조하여 광흡수나 광전류를 측정하였다. XRD를 이용해서 제조된 TiO2 박막의 결정성을 확인하였으며 막의 표면특성은 SEM으로 측정하였으며 광흡수 특성이 관찰되었다. 제조된 TiO2 박막의 광전류는 100 mw/cm2의 광세기를 가지는 제논 램프를 이용하여 측정하였다. CdSe에 TiO2박막을 코팅했을 때의 CdSe막의 광흡수와 광전류를 측정하여 TiO2 코팅효과를 관찰하였다.

• Journal of the Korean Vacuum Society
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• v.1 no.2
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• pp.291-297
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• 1992

알루미늄 박막 stripe에 d.c. 전류를 인가하여 electromigration에 의한 결함을 분 석하였다. 6 $\times$ 10-8Torr의 진공동에서 전자빔 증착기를 사용하여 현미경을 유리기판에 $1000AA$의 두께로 알루미늄 박막을 증착하였다. Al/glass 박막의 초기 비저항은 2.7 $\pm$ 0.15($\mu$$\Omega$cm)이였다. 알루미늄 stripe에 electromigration에 의해 양극쪽에 물질 축적영역 (hillocks)과 음극쪽에는 물질 고갈영역(voids)이 형성되었다. SEM, EDAX와 Optical microscope로 hillocks과 voids를 분석하였다. 또한 결함에 대한 SiO2 보호막효과에 대하여 도 분석하였으며, SiO2 보호막에 의하여 Al 박막의 신뢰성은 향상되었다.

• Journal of the Korean Institute of Telematics and Electronics
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• v.22 no.6
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• pp.53-57
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• 1985

Comparisons and analyses were made of the properties of double or triple passivation layer structures composed of APCVD SiOt or PSG and PECVD SiN films with various layer combinations and layer thicknesses. As a result of the analyses of the pro.peHics such as threshold-voltage shift, crack resistance, pinhole density, and moisture reslstancei a con-clusion was reached that the proper passivation layer structure is the double layer consisting of a 4,00$\AA$ or thicker PSG film and a 6,000$\AA$ SiN film.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.166-174
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• 1993

Abstract The crack resistance of PSG(Phosphosilicate Glass) and PE-SiN(Plasma Enhanced CVD S${i_2}{N_4}$)films deposited on aluminium thin films on Si substrate was analyzed in this study. PSG was deposited by AP-CVD and PE- SiN by PE-CVD. All the films underwent repeated heat cycles at 45$0^{\circ}C$for 30 min. Crack formation and development were examined between each heat cycle. The crack behavior was found to be closely related to the stresses in the films. The stress induced by the difference in thermal expansion behavior between the passivation layers and underlying aluminum film may cause the crack. Crack resistance decreases as the thickness of PSG films increases due to the high tensile stress of the films. Phosphorus in the PSG films releases tensile stress and consequently the stress of the films tends to show compressive stress. As a result, crack resistance increased as the concentratin of P in the PSG films increased. Crack resistance in the PE-SiN films also increased with compressive stress. An experimental model to predict crack generation in the PSG and PE-SiN films during heat cycle was suggested.

• Applied Chemistry for Engineering
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• v.29 no.1
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• pp.49-55
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• 2018

In this study, we investigated the cellular protective effects and mechanisms of nicotiflorin and its aglycone kaempferol isolated from Annona muricata. The protective effect of these components against $^1O_2$-induced cell damage was also studied by using L-ascorbic acid and (+)-${\alpha}$-tocopherol as controls. Kaempferol exhibited the most potent protective effect, followed by (+)-${\alpha}$-tocopherol and nicotiflorin. L-Ascorbic acid did not exhibit any cellular protective effects. To elucidate the mechanism underlying protective effects, the quenching rate constant of the singlet oxygen, free radical-scavenging activity, ROS-scavenging activity, and uptake ratio of the erythrocyte membrane were measured. The results showed that the cell membrane penetration is a key factor determining the cellular protective effect of kaempferol and its glycoside nicotiflorin. The result from L-ascorbic acid demonstrated that the cellular protective effect of a compound depends on its ability to penetrate the cell membrane and is independent of its antioxidant capacity. In addition, it is suggested that cellular protective effects of kaempferol and (+)-${\alpha}$-tocopherol depend not only on the cell permeability, but also on free radical- and ROS-scavenging activities. These results indicate that the cell permeability and free radical- and ROS- scavenging activities of antioxidants are major factors affecting the protection of cell membranes against the oxidative damage induced by photosensitization reaction.

• Korean Journal of Materials Research
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• v.2 no.3
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• pp.180-190
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• 1992

Some solutions to several major problems in ZMR such as agglomeration of polysilicon, slips and local substrate melting are described. Experiments are performed with varying polysilicon thickness and capping oxide thickness. The aggmeration can be eliminated when nitrogen is introduced at the capping oxide layer-to-polysilicon interface and polysilicon-to-buried oxide layer interface by annealing the SOI samples at $1100^{\circ}$ in $NH_3$ ambient for three hours. The slips and local substrate melting are removed when the back surface of silicon substrate is sandblasted to produce the back surface roughness of about $20{\mu}m$. The subboundary spacing increases with increasing polysilicon thickness and the uniformity of recrystallized SOI film thickness improves with increasing capping oxide thickness, improving the quality of recrystallized SOI film. When the polysilicon thickness is about $1.0{\mu}m$ and the capping oxide thickness is $2.5{\mu}m$, the thickness variation of the recrystallized SOI film is about ${\pm}200{\AA}$ and the subboundary spacing is about $70-120{\mu}m$.