• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.6
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• pp.771-780
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• 2010

This paper describes the design process of a six-component force/torque (F/T) sensor. The new six-component F/T sensor having leaf spring ends has been developed using a cross beam structure as the basic sensing element. Fundamental strain analysis of both ends fixed beam having a leaf spring structure is performed by finite element analysis. In order to obtain similar output sensing strains from the six component loads and minimize coupling strains, the optimal location of strain gages is determined and the strain gages are connected so that the bridge circuits with four strain gages would be balanced. Using leaf spring ends instead of rigid fixed ends, remarkable increment in output sensing strain can be achieved for two component forces. Several modifications in design result in a similar sensing strain of approximately $400\;{\mu}m/m$ for the six-component forces and moments, and a reduced coupling strain of $0\;{\mu}m/m$ between the forces and moments.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2009.04a
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• pp.93-96
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• 2009

바퀴동력계는 차량에 지면으로부터 전달되는 힘과 모멘트를 측정하는 로드셀이다. 본 연구에서 개발한 바퀴동력계는 스트레인 게이지식 로드셀로써 이러한 로드셀을 설계하는데 있어서 몇가지 고려해야 하는 사항이 있다. 우선 스트레인 게이지를 부착하기 쉬운 구조가 되어야 하고 조립시의 오차를 줄이기 위하여 한 몸체로 제작되어야 한다. 이와 동시에 가장 중요하게 고려되어야 하는 인자로 감도를 위해 재료가 허용하는 응력내에서 되도록 큰 변형률이 발생해야 하고 상호 간섭 오차가 발생하지 말아야 한다. 본 연구에서는 수식을 이용하여 이론적으로 상호 간섭 오차를 0으로 만들 수 있었다. 또한 설계 변수 및 재료 물성치의 산포를 고려한 신뢰성 기반 최적설계 기법을 사용하였으며, 이를 통해 허용 응력하에서 최대의 변형률이 발생하는 바퀴동력계를 설계하였다.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.131-137
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• 2007

Electronic Speckle Pattern Interferometry(ESPI) is a common method for measuring out-of-plane deformation and in-plane deformation and applied for vibration analysis and strain/stress analysis. However, ESPI is sensitive to environmental disturbance, which provide the limitation of industrial application. On the other hand, Shearography based on shearing interferometer which is insensitive to vibration disturbance can directly measure the first derivative of out-of-plane deformation. In this paper a technique that extract out-of-plane deformation from results of shearography by numerical processing is proposed and measurement results of ESPI and Shearoraphy are compared quantitatively.

• Korean Journal of Optics and Photonics
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• v.10 no.2
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• pp.128-137
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• 1999

We found the point-spread function (PSF) including the recording and reconstruction systems of the modified triangular interferometer. We also derived the resolutions of the modified and Cochran's triangular interferometers, then the resolutions of both systems for amplification factor, wavelength, and hologram size were found and analyzed. Also, to demonstrate the feasibility of incoherent holography, the formation of an incoherent hologram using a mercury lamp and its optical reconstruction were presented.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.12 no.2
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• pp.115-123
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• 1987

It is known that conventional spread spectrum communication systems have a characteristics of non-synchronous multiple access. However, because the system has a interchannel interference, the number of channels that can communicate at the same time is small as compared with TDM. This paper presents a new synchronous sprea spectrum mulitple access communication system using a modified M sequence as a spread sequence. The system was constructed and through experiment we confirmed that a modified M sequence is superior to a M sequence in the area of interchannel interference, And we also confirmed that received waveforms are better with a increase of transmission bandwidth.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1987-1989
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• 2003

3차원 형상을 측정하는 측정법으로는 접촉식과 비접촉식이 있는데 최근에는 물체의 표면을 손상 시키지 않으면서 물체의 변형 상태 등을 정밀하게 측정할 수 있는 비접촉식 측정법이 주로 사용되어 지면서 변형, 진동, 결함 등의 다양한 측정 분야에 찰용되고 있다. 이는 광학 간섭의 하나인 Twyman-Green 간섭계를 이용하여 간섭 무의 패턴을 PZT Controller로 위상 이동하여 CCD 카메라로 물체의 영상을 얻어 위상 지도를 추출, 이미지를 분석하여 3차원 물체를 해석하고자 한다. 하지만 이미지 측정시 미세 진동 및 조명 등에 의한 노이즈가 발생하게 되어 물체의 정확한 정보를 얻기가 어려워 노이즈 제거를 위한 이미지 처리 알고리즘 개발과 Unwrapping 처리, 위상이동 알고리즘 개발 등을 통하여 좀더 정확한 정보를 얻고자 한다.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.3 s.192
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• pp.40-46
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• 2007

• Korean Journal of Optics and Photonics
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• v.4 no.4
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• pp.496-501
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• 1993

We review the basic principles of laser speckle interferometry and its applications to the measurement of surface displacement and deformation and to the analysis of resosnant vibrational modes.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.1
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• pp.53-63
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• 2016

Wheel dynamometers are used to measure dynamic load that is conveyed from the road to a vehicle while driving. In this paper, two types of six-component wheel dynamometers utilizing shear deformation and bending deformation were designed and evaluated. Prior to designing the shear and bending type wheel dynamometers, the shear and bending deformation behaviors of the basic structure of the wheel dynamometer itself were analyzed using finite element analysis. Strain analysis was performed repeatedly in order to obtain a similar output sensing strain for each load component. The design was modified with a bridge circuit in order to minimize coupling strain. The results indicated that the shear type dynamometer was expected to obtain stable characteristics due to uniform strain distribution while the bending type dynamometer was expected to obtain high-quality sensitivity performance due to consistent output sensitivity.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.