• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.196-197
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• 2002

보편적으로 알려진 CoCr합금 수직기록매체의 경우, 기록매체에서 출력되는 신호의 크기가 작고 열적안정성이 떨어지는 문제점이 있다. 이러한 CoCr합금 수직기록매체를 대체할 기록 매체로 Co/Pd 다층박막에 관한 연구를 수행하였다. Co/Pt 및 Co/Pd계 다층박막은 수직배향성을 가지며 일찍부터 Magneto-optical 매체로 연구되었다. Co/Pd 다층박막은 자성재료와 비자성재료를 약 2~3개 원자층의 박막 두께(10$\AA$이하)로 번갈아 가며 진공증착한 것으로. CoCr합금계 수직기록매체에 비해 열적안정성이 뛰어나고 수직방향의 잔류 자화가 큰 장점을 가지고 있다. (중략)

• Journal of the Korean Ceramic Society
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• v.41 no.3
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• pp.229-234
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• 2004

In this study, we proposed new forming process for a porous ceramic body with unique pore structure. h tubular-type porous NiO-YSZ body with radially aligned pore channels was prepared by freeze-drying of aqueous slurry. A NiO-YSZ slurry was poured into the mold, which was designed to control the crystallization direction of the ice, followed by freezing. Thereafter the ice was sublimated at a reduced pressure. SEM observations revealed that the NiO-YSZ porous body showed aligned large pore channels parallel to the ice growth direction, and fine pores are formed around the outer surface of the tube. It was considered that the difference in the ice growth rate during the freezing process resulted in such a characteristic microstructure. Bilayer consisting of dense thin electrolyte film of YSZ onto the tubular type porous body has been successfully fabricated using a slurry-coating process followed by co-firing. It was regarded that the obtained bilayer structure is suitable for constructing electrode-support type electrochemical devices such as solid oxide fuel cells.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2000.11a
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• pp.42-42
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• 2000

패선/구부림 가공은 백판지의 후가공의 일부분으로서 통상적으로 고평량인 백판지를 소비 자에게 맞는 형태로 가공하는 한 공정으로서 접는 공정을 용이하게 하기 위하여 종이 표면 에 패선을 넣어 구부려 접게 되는데 이때 구부리는 면의 표면적의 증가와 내부에서 외부로 향하는 Stress 에 의하여 종이의 표면층이 터지는 현상이 발생하기도 한다.이러한 터짐을 방지하면서 구부립 가공을 하기 위하여 백판지에 요구되는 특성은 여러 가지가 있으며 특히 고평량인 경우에는 종이가 구부러지면서 변형이 크게되는 만큼 외부로 밀리는 힘이 더욱크 게 작용하게 되고 이 힘을 충분히 수용할 수 있는 종이 자체의 강도가 펼요하게 되는데 본 연구에서는 다층판지의 원료특성과 판지특성등이 패션/구부림 가공적성과 연관성을 밝혀내 어 향후 연구방향의 기초를 삼고자 한다. 본 실험에서는 실험실적 결과와 실제 제품에서와의 차이를 최소화 하기 위하여 현장에서 생산되는 백판지를 사용하였으며 백판지의 각층을 구성하는 원료특성과의 상관관계까지 고 려하여 대전공장에서 생산되는 원료의 특성을 분석하고 같은 시간대의 제품과 비교펑가하는 방법을 취하였다. 각각의 원료 특성과 제품특성 (구부러짐 특성) . 공정조건등의 자료를 일정기간 취합하여 S Statisca 를 사용한 통계분석을 하였으며 1차 분석 결과 종이무성에 미치는 영향이 큰 수분 함량과 표면층의 원료구성 (Softwood 함량) 이 일차적으로 영향을 크게 미치며 종이 특성 으로는 CD 방향 터짐과 관련하여 MD 방향 인장, 내절, CD방향 강성등이 상관관계지수 0 0.7 이상으로 비교적 관계가 깊은 것으로 나타나며 인장과 신장율의 곱인 Toughness는 상 대적으로 낮아 터짐 지수로 활용하기는 어려울 것으로 판단되며 또한 신장율도 0.5 수준으 로 나타나며 패선구부러짐에 따른 층간구조변화에 따른 층간결합력이 영향이 있을 것으로 추측은 되었으나 분석결과 0.5 수준인 것으로 나타났다. 또한 CD 방향과 MD 방향의 터짐 성 상관관계도 0.5 이상인 것으로 나타나 섬유배향성도 패선/구부림 가공적성과 관련이 있 는 것으로 나타남으로서 패선/구부림 적성향상은 원료뿐만 아니라 초지공정조건에서도 향상 될 수 있는 것으로 나타났다. 향후 보다 세분화한 분석 및 도공층의 역할이 펼요할 것으로 판단되며 또한 지층구조분석 을 통한 Modeling 도 필요한 것으로 판단된다.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.23-30
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• 1999

The relationships between morphological structures and residual stress behaviors of polyimide thin films depending on isomeric diamines were investigated. For this study, Poly(phenylene biphenyltetracarboximide) (BPDA-PDA) and poly(oxydiphenylene biphenyltetracarboximide) (BPDA-ODA) films were prepared from their isomeric diamines: 1,3-phenylene diamine (1,3-PDA) 1,4-phenylene diamine (1.4-PDA), 3,4'-oxydiphenylene diamine (3,4'-ODA), and 4,4'-oxydiphenylene diamine (4,4'-ODA), respectively. For those films, residual stresses were detected in-situ during thermal imidization of the isomeric polyimide as a function of processing temperature over the range of 25~$400^{\circ}C$ using. Thin Film Stress Analyzer (TFSA). In comparison, residual stress of BPDA-1.4PDA having better in-plain orientation and chain order was the lowest value of 7MPa whereas those of BPDA-1,3-PDA, BPDA-3,4'-ODA, and BPDA-4,4'-ODA were in the range of 40-50MPa. Conclusively, the effect of morphological nature (chain rigidity, chain order, orientation) and chain mobility relating to the g1ass transition behavior on the residual stress of isomeric polyimide thin films wart analyzed.

• Journal of the Korean Electrochemical Society
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• v.6 no.3
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• pp.208-211
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• 2003

We have investigated the dimensional and microstructural dependence of magnetic properties of CoP nano-wire arrays fabricated by electrodeposition on AAO(anodic aluminum oxide) templates with different-size nanopores. Our results indicate that the magnetic properties of nanowire arrays can be varied with their dimensions and microstructures. As for the CoP nanowire arrays with the diameter of 20nm, it was found to have the coercivity more than 2.6kOe due to the shape anisotropy and squareness(Mr/Ms) of $\~0.8$. The CoP nanowire arrays with the diameter of 200m, however, showed very different magnetic properties depending on the current densities. Nanowires fabricated at $5mA/cm^2$ had stronger tendency to have the preferred crystallographic orientation of (002) parallel to the nanowire than those fabricated at $35mA/cm^2$ These microstructural differences are the reason why CoP nanowire arrays prepared at different current densities exhibited different magnetic properties.

• Journal of the Korean Wood Science and Technology
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• v.40 no.4
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• pp.287-293
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• 2012

This study was carried out in order to compare nail shear strength between domestic plywood and imported OSB for structural sheathing members as infill wall of wooden construction. The differences of nail shear strength between parallel-to-grain direction and perpendicular-to-grain direction of sheathing material to frame material were distinct at the plywood composition. The shear strengths of plywood and OSB with nail met current design values. The plywood of P-4 type, which uses MLH at surface layer and constructs 7 ply, showed greater than OSB regardless of grain direction of sheathing material to frame material. When the plywood as sheathing material to frame material was used, it was found out that the overall construction of perpendicular-to-grain direction of plywood had greater nail shear strengths than the construction of parallel-to-grain.

• Journal of the Korean Vacuum Society
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• v.10 no.1
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• pp.22-26
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• 2001

Microstructures of AlN thin films on Si substrates grown by plasma assisted molecular beam epitaxy were analyzed with various growth temperatures and substrate orientations. Reflection high energy electron diffraction (RHEED) patterns were checked for the in-situ monitoring of the growth condition. X-ray diffraction(XRD), double crystal X-ray diffraction (DCXD), and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the microstructure of the films after growth. On Si(100) sub-strates, AlN thin films were grown mostly along the hexagonal c-axis orientation at temperature higher than $850^{\circ}C$. On the other hand the AlN films on Si(111) were epitaxially grown with directional coherencies in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112). The microstructure of AlN thin films on Si(111) substrates, with a full width at half maximum of almost 3000 arcsec at 2$\theta$=$36.2^{\circ}$, showed that the single crystal films were grown, even if they includ a lot of crystal defects such as dislocations and stacking faults.

• Journal of the Korean Wood Science and Technology
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• v.16 no.2
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• pp.1-41
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• 1988

For the purpose of utilizing the sawdust having poor combining properties as board raw material and resulting in dimensional instability of board, polypropylene chip (abbreviated below as PP chip) or oriented PP thread was combined with sawdust particle from white meranti(Shorea sp.). The PP chip was prepared from PP thread in length of 0.25, 0.5, 1.0 and 1.5 cm for conventional blending application. Thereafter, the PP chip cut as above was combined with the sawdust particle by 3, 6, 9, 12 and 15% on the weight basis of board. Oriented PP threads were aligned with spacing of 0.5, 1.0 and 1.5cm along transverse direction of board. The physical and mechanical properties on one, two and three layer boards manufactured with the above combining conditions were investigated. The conclusions obtained at this study were summarized as follows: 1. In thickness swelling, all one layer boards combined with PP chips showed lower values than control sawdustboard, and gradually clear decreasing tendendy with the increase of PP chip composition. Two layer board showed higher swelling value than one layer board, but the majority of boards lower values than control sawdustboard. All three layer boards showed lower swelling values than control sawdustboard. 2. In the PP chip and oriented thread combining board, the swelling values of boards combining 0.5cm spacing oriented thread with 1.0 or 1.5cm long PP chip in 12 and 15% by board weight were much lower than the lowest of one or three layer. 3. In specific gravity of 0.51, modulus of rupture of one layer board combined with 3% PP chip showed higher value than control sawdustboard. However, moduli of rupture of the boards with every PP chip composition did not exceed 80kgf/cm2, the low limit value of type 100 board, Korean Industrial Standard KS F 3104 Particleboards. Moduli of rupture of 6%, 1.5cm-long and 3% PP chip combined boards in specific gravity of 0.63 as well as PP chip combined board in specific gravity of 0.72 exceeded 80kgf/$cm^2$ on KS F 3104. Two layer boards combined with every PI' chip composition showed lower values than control sawdustboard and one layer board. Three layer boards combined with.1.5cm long PP chip in 3, 6 and 9% combination level showed higher values than control sawdustboard, and exceeded 80kgf/$cm^2$ on KS F 3104. 4. In modulus of rupture of PP thread oriented sawdustboard, 0.5cm spacing oriented board showed the highest value, and 1.0 and 1.5cm spacing oriented boards lower values than the 0.5cm. However, all PP thread oriented sawdustboards showed higher values than control saw-dustboard. 5. Moduli of rupture in the majority of PP chip and oriented thread combining boards were higher than 80kgf/$cm^2$ on KS F 3104. Moduli of rupture in the boards combining longer PP chip with narrower 0.5cm spacing oriented thread showed high values. In accordance with the spacing increase of oriented thread, moduli of rupture in the PP chip and oriented thread combining boards showed increasing tendency compared with oriented sawdustboard. 6. Moduli of elasticity in one, two and three layer boards were lower than those of control sawdustboard, however, moduli of elasticity of oriented sawdustboards with 0.5, 1.0 and 1.5cm spacing increased 20, 18 and 10% compared with control sawdustboard, respectively. 7. Moduli of elasticity in the majority of PP chip and oriented thread combining boards in 0.5, 1.0 and 1.5cm oriented spacing showed much higher values than control sawdustboard. On the whole, moduli of elasticity in the oriented boards combined with 9% or less combination level and 0.5cm or more length of PP chip showed higher values than oriented sawdustboard. The increasing effect on modulus of elasticity was shown by the PP chip composition in oriented board with narrow spacing. 8. Internal bond strengths of all one layer PP chip combined boards showed lower values than control sawdust board, however, the PP chip combined boards in specific gravity of 0.63 and 0.72 exceeded 1.5kgf/$cm^2$, the low limit value of type 100 board and 3kgf/$cm^2$, type 200 board on KS F 3104, respectively. And also most of all two, three layer-and oriented boards exceeded 3kgf/$cm^2$ on KS F. 9. In general, screw holding strength of one layer board combined with PP chip showed lower value than control sawdustboard, however, that of two or three layer board combined with PP chip did no decreased tendency, and even screw holding strength with the increase of PP chip composition. In the PP chip and oriented PP thread combining boards, most of the boards showed higher values than control sawdustboard in 9% or less PP chip composition.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.49.1-49.1
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• 2010

본 연구에서는 증착법에 의해 제조된 다결정 실리콘을 이용한 태양전지 제작과 관련하여 다결정 실리콘 씨앗층 제조를 위한 기판에 대하여 연구를 수행하였다. 다결정 실리콘 씨앗층을 제조할 수 있는 기술중 aluminum-induced layer exchange(ALILE) 공정을 이용하여 다결정 실리콘 씨앗층을 제조하였다. glass/Al/oxide/a-Si 구조로 알루미늄과 비정질 실리콘 계면에 알루미늄 산화막을 다양한 두께로 형성시켜, 알루미늄 유도 결정화에서 산화막의 두께가 결정화 특성에 미치는 영향, 결정결함, 결정크기에 대하여 연구하였다. 형성된 다결정 실리콘 씨앗층 막의 특성은 OM, SEM, FIB, EDS, Raman spectroscopy, XRD, EBSD 을 이용하여 분석하였다. 그 결과 산화막의 두께가 증가할수록 결함도 함께 증가하였다. 16nm 두께의 산화막 구조에서 <111> 방향의 우선배향성을 가진, $10{\mu}m$의 sub-grain 결정립을 갖는 씨앗층을 제조 하였다.

• Korean Journal of Materials Research
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• v.6 no.5
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• pp.475-482
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• 1996

초음파분무를 이용한 MOCVD법으로 강유전 BaTiO3 박막을 제조하였다. 초음파 분무 MOCVD법은 비교적 저온에서도 후열처리없이 결정화된 박막의 제조가 가능하다. 증착한 박막은 기판온도가 증가할수록 (110) 우선 배향성을 가졌으며, 기판온도에 따라서 서로 다른 결정상을 나타내었다. 기판온도가 55$0^{\circ}C$인 경우에 증착한 박막은 결정화가 완전히 진행되지 않았으며, 결정립의 크기도 매우 작아 상온에서 입방정상의 특성을 보였다. $600^{\circ}C$에서 증착한 박막은 결정화가 진행되어 입자의 크기는 성장하였으나 의사 입방정상을유지하고 있었다. 반만 $650^{\circ}C$에서 증착한 박막은 결정화뿐만 아니라 주상으로 성장하여 수직 방향으로는 박막 두께의 크기를 가져 CV 특성에서 이력곡선을 보였으며, 정전용량의 온도 변화에 따른 특성에서도 상전이의 특성을 나타내었다.