• Fire Science and Engineering
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• v.33 no.3
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• pp.121-127
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• 2019

This study examined a fire accident caused by a defect in the vehicle ABS module. A large number of vehicles using the same manufacturer's ABS module in recent fire events showed a tendency to combust due to the same faults. As previously stated in the ABS module which shows the electrical breakdown between the power lines supplied to the constant power source by the battery. The electrical breakdown of the ABS module was caused by defects of the ABS module itself that were influenced by of the external flame. These results highlight the need to determine if there is a deficiency of the ABS module in the investigation of the cause of a fire in a vehicle which is produced by the same manufacturer.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.11
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• pp.1130-1137
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• 2009

This paper proposes a new clock routing design for suppressing clock harmonic effects in a Printed Circuit Board (PCB) for a terrestrial Digital Multimedia Broadcasting(DMB) system. Typical crystal reference frequencies that are widely used in DMB tuners are 16.384 MHz, 19.2 MHz, 24.576 MHz. When the high-order harmonic components of these reference frequencies fall near the RF channel frequencies, receiver sensitivity of the tuners is seriously degraded. In this work, we propose a new clock routing design in order to address the clock harmonic coupling issue. The proposed design incorporates two inductors for isolating the clock ground from the main ground, and adopts a new strip line-style routing instead of the conventional microstrip line style routing to minimize the overlap area with the main ground. As a result, the RF sensitivity of the T-DMB tuner is improved by 2 dB.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.95-99
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• 2008

Cu has been used for metallic interconnects in ULSI applications because of its lower resistivity according to the scaling down of semiconductor devices. The resistivity of Cu lines will affect the RC delay and will limit signal propagation in integrated circuits. We investigated the electrolyte effects of the electroplating solution in the resistivity value of Cu films grown by electroplating deposition (EPD). The resistivity was measured with a four-point probe and the material properties were investigated with XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope) and XPS (X-ray Photoelectron Spectroscopy). From these experimental results, we found that the electrolyte condition plays an Important role in formation of Cu film with lower resistivity by EPD.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.77-77
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• 2018

Panel level packaging (PLP) 공정은 차세대 반도체 패키징 기술로써 wafer level packaging 대비 net die 면적이 넓어 생산 단가 절감에 유리하다. PLP 공정에 적용되는 구리 재배선 층 (RDL, redistribution layer)은 두께 불균일도에 의해 전기 저항의 유동이 민감하게 변화하기 때문에 RDL의 두께를 균일하게 형성하는 것은 신뢰성 측면에서 매우 중요하다. 구리 RDL은 주로 도금 공정을 통해 형성되며, 균일한 도금막 형성을 위해 도금조에 평탄제를 첨가하여 도금 속도를 균일하게 한다. 도금막에 대한 흡착은 주로 평탄제의 imine 작용기에 포함된 질소 원자가 관여하며, imine 작용기의 4차화에 의한 평탄제의 흡착 정도를 제어하여 평탄제 성능을 개선할 수 있다. 본 연구에서는 도금 평탄제에 포함된 imine 작용기의 질소 원자를 4차화하여 구리 RDL의 도금 두께 불균일도를 제어하고자 하였다. 유기첨가제와 4차화 반응을 위해 알킬화제로써 dimethyl sulfate의 비율을 조절하여 각각 0, 50, 100 %로 4차화 반응을 진행하였다. 평탄제의 4차화 여부를 확인하기 위해 gel permeation chromatography (GPC) 분석을 실시하였다. 도금은 20 ~ 200 um의 다양한 배선 폭을 갖는 구리 RDL 미세패턴에서 진행하였으며, 4차화 평탄제를 첨가하여 광학 현미경과 공초점 레이저 현미경을 통해 도금막 표면과 두께에 대한 분석을 실시하였다. GPC 분석을 통해 4차화 반응 후 알킬화제에 의해 나타나는 GPC peak이 감소한 것을 확인하였다. 광학 현미경 및 공초점 레이저 현미경 분석 결과, 4차화된 질소 원자가 존재하지 않는 평탄제의 경우, 도금 시 도금막의 두께가 불균일하였으며 단면 분석 시 dome 형태가 관찰되었다. 또한 100 % 4차화를 실시한 평탄제를 첨가하여 도금 한 경우 마찬가지로 두께가 불균일한 dish 형태의 도금막이 형성되었다. 반면, 50 % 4차화를 적용한 평탄제를 첨가한 경우, 도금막 단면의 형태는 평평한 모습을 보였으며 매우 양호한 균일도를 가지는 것으로 확인되었다. 이로 인해 imine 작용기를 포함한 평탄제의 4차화 반응을 통해 구리 RDL의 단면 형상 및 불균일도가 제어되는 것을 확인하였으며, 4차화된 imine 작용기의 비율을 조절하여 높은 균일도를 갖는 구리 RDL 도금이 가능한 것으로 판단되었다.

• Proceedings of the KSR Conference
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• 2008.06a
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• pp.588-595
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• 2008

Recently, it is caused by environment change that is increased the number of lightning occurrence and the strength of lightning current is coming to be strong little by little. The performance of grounding system depends on how to construct. Specially the common grounding systems which uses the buried earth cable must be constructed by very well qualities because it is difficult to measure earth resistance and to manage the buried earth cable. Common grounding systems and independence grounding systems could be composed different. Against railway signalling equipment which like this is used from the environment lower part which is various it presents a standard grounding systems, and very it is hard job. We will present improvement through this paper that review grounding systems configuration condition of railway signalling equipment.

• Electrical & Electronic Materials
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• v.3 no.3
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• pp.233-241
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• 1990

본 연구에서는 xPb(Zn$_{1}$3/Nb$_{2}$3/)O$_{3}$-yBa(Zn$_{1}$3/Nb$_{2}$3/)O$_{3}$-zPbTiO(0.50.leq.x.leq.0.60, 0.10.leq.y.leq.0.20, 0.20.leq.z.leq.0.40)세라믹을 1050.deg.C에서 2시간동안 유지시켜 일반소성법으로 제작하였다. 시편 제작시 조성은 조성변태 상경계부근을 선택하였으며 Ba(Zn$_{1}$3/ Nb$_{2}$3/)O$_{3}$ 고용량에 따른 purochlore상의 억제 및 그 영향을 조사하고 구조적, 유전적 및 압전적 특성을 측정하였다. X-선 회절분석 및 미세구조의 관찰 결과, Ba(Zn$_{1}$3/Nb$_{2}$3/)O$_{3}$의 고용량에 따라 pyrochlore상 및 미반응 물질등은 억제되어 0.20mol 고용된 시편에서는 균질한 perovskite상이 형성되었다. Ba(Zn$_{1}$3/Nb$_{2}$3/)O$_{3}$의 고용량이 증가함에 따라 유전상수는 증가하여 0.50PZN-0.20BZN-0.30PT시편의 경우 6880.9의 높은 값을 나타내었으며 정전용량의 온도계수는 감소하여 0.383[%/.deg.C]의 양호한 값을 나타내었다. 큐리온도는 PbTiO$_{3}$의 고용량이 0.20mol에서 0.40mol로 증가함에 따라 30.deg.C에서 170.deg.C로 증가하였다. 전기기계 결합계수 (K$_{p}$), 기계적 품질계수(Qm) 및 압전전하 계수 (d$_{33}$)는 조성변태 상경계 부근의 조성에서 크게 나타났으며 0.60PZN-0.15BZN-0.25PT 시편의 경우 각각 58.5%, 120.5, 150x$10^{-12}$[C/N]의 값을 나타내었다.다.다.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.43-48
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• 2022

Effect of temperature/humidity (T/H) treatment conditions on the peel strength of screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90° peel test. Initial peel strength was 25.99±1.47 gf/mm, and then decreased to 6.05±0.54 gf/mm after 500 h at 85℃/85% relative humidity T/H condition. And, the peeled locus was changed from Ag/PI interface to shallow cohesive inside PI near interface. X-ray photoelectron spectroscopy analysis on the peeled surfaces showed that the long-term moisture penetration into the Ag/PI interface during T/H treatment led to hydrolytic degradation of PI to form weak boundary layer inside PI near Ag/PI interface, which are responsible for large decrease in peel strength.

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.3 no.4
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• pp.249-260
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• 1998

To understand the attachment of micro algae and their subsequent growths on artificial surfaces immersed in seawater, the relationship between attachment of diatoms on the immersed artificial substrates and species pool in the surrounding water was investigated. We used acryl slides for the study of diatom attachment and examined the surrounding water samples collected in Incheon Harbour from July 1995 to February 1997. Variations of species composition and abundances by exposure time in seawater were investigated during the early phase of biofilm formation on various substrates, e.g. glass, acryl, titanium, copper and antifouling paint-treated slides. Immigration rates of diatoms to acryl slides during spring and winter were significantly correlated with the abundance of benthic diatoms in surrounding water ($r^2$=0.78, p<0.01, n=42), suggesting that immigration rates were affected by variations of benthic diatom abundances in surrounding water. Immigration coefficient of monoraphid diatoms was 5 times higher than that of biraphid diatoms, but relative abundance of monoraphid diatoms was 3 times lower than that of biraphid diatoms on acryl slides in spring. In winter, immigration coefficient and relative abundance of centric diatoms were higher compared to other raphe forms. These results suggest that the attachment of diatoms seems to be caused by the abundance and immigration coefficients of benthic diatoms in surrounding water. Pennate diatoms predominantly attached to all artificial surfaces throughout all experimental periods. Interestingly, centric diatoms predominantly attached to all artificial surfaces in winter. Hantzschia virgata, Licmophora abbreviata and Melosira nummuloides appeared dominantly on antifouling paint-treated slides, probably being tolerant of the antifouling paint. During incubations, the abundance of attached diatoms increased exponentially on glass, titanium and acryl slides with exposure time. The maximum abundance was highest on glass slide, followed by acryl, titanium, copper and antifouling paint-treated slides. The growth rates of attached diatom community on all artificial surfaces were higher at temperature of $24-25^{\circ}C$ than that of $2-3^{\circ}C$. The growth rate of attached diatoms on glass slide was generally higher compared to other slides during the study period. Dominant morphotypes of observed species with exposure time in seawater were prostrate form Amphora coffeaeformis, fan shape Synedra tabulata, stalk type Licmophora paradoxa and chain type M. nummuloides. A micro-succession in the attached microalgal community was observed. The composition of dominant species seems to be the result of species-specific response to gradually limited space with development of microalgal film.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.1 no.2
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• pp.79-93
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• 1991

With the advent of ULSI, many problems in previous metallization techniques and interconnection materials have become more serious. In this work, selective deposition of copper to fill the submicron contact has been tried. After forming electro-deposited copper films on p-type (100) silicon wafer using 0.75M $CuSO_4{\cdot}$5H_2O$ as an electrolyte, the effect of deposition time, current density and concentration of an additive on film properties were investigated. Film thickness, particle size and resistivity were analyzed by Alpha Step, SEM and 4 - point probe measurement respectively. The deposition rate was about $0.5-0.6\mu\textrm{m}$/min at $2A/dm^2$ and the particle size increased with increasing current density. The resistivities of electro-deposited copper films were about $3-6{\mu}{\Omega}{\cdot}$cm for the particle size above $4000{\AA}$. By the addition of 0.2 g/l gelatin, the particle size was reduced to less than $0.1{\mu}m $ and selective plugging of copper on submicron contacts could be successfully achieved.

• The Journal of Korean Society for Radiation Therapy
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• v.22 no.1
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• pp.19-24
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• 2010

Purpose: To study the efficacy of marker match with using kilovoltage (KV) X-ray among multiple image guidance that referring tree fiducial marker in radiation therapy for prostate cancer patients. Materials and Methods: KV two-dimantional images (anterior-posterior, right-left) and cone-beam CT volumetric images were acquired after setup for patients with three fiducial markers. Compare the position of the fiducial marker of reference plan computed tomography (CT) and of KV, CBCT images; then decide the shift score of X, Y, and Z. This study executed 5 times on 10 patients and analyzed the shift value. Results: In the radiation therapy using fiducial marker, The function of marker match showed the same direction tendency as the CBCT, and showed X, Y, Z difference of about 0.6, 0.7, and 0.8 (unit: mm). Conclusion: Comparing to this, the result of shift value using 2D marker match showed less than 1.0 mm difference. The function of marker match is considered more useful in time-wise and effective dose rather than CBCT. Therefore, Both methods are used to treat patients for prostate cancer.