• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.7-12
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• 2018

The effects of Ru deposition temperature and post-annealing conditions on the interfacial adhesion energies of atomic layer deposited (ALD) Ru diffusion barrier layer and Cu thin films for the advanced Cu interconnects applications were systematically investigated. The initial interfacial adhesion energies were 8.55, 9.37, $8.96J/m^2$ for the sample deposited at 225, 270, and $310^{\circ}C$, respectively, which are closely related to the similar microstructures and resistivities of Ru films for ALD Ru deposition temperature variations. And the interfacial adhesion energies showed the relatively stable high values over $7.59J/m^2$ until 250h during post-annealing at $200^{\circ}C$, while dramatically decreased to $1.40J/m^2$ after 500 h. The X-ray photoelectron spectroscopy Cu 2p peak separation analysis showed that there exists good correlation between the interfacial adhesion energy and the interfacial CuO formation. Therefore, ALD Ru seems to be a promising diffusion barrier candidate with reliable interfacial reliability for advanced Cu interconnects.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.69-74
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• 2010

A new package substrate for dynamic random access memory(DRAM) devices has been developed using selective aluminum anodization. Unlike the conventional substrate structure commonly made by laminating epoxy-based core and copper clad, this substrate consists of bottom aluminum, middle anodic aluminum oxide and top copper. Anodization process on the aluminum substrate provides thick aluminum oxide used as a dielectric layer in the package substrate. Placing copper traces on the anodic aluminum oxide layer, the resulting two-layer metal structure is completed in the package substrate. Selective anodization process makes it possible to construct a fully filled via structure. Also, putting vias directly in the bonding pads and the ball pads in the substrate design, via in pad structure is applied in this work. These arrangement of via in pad and two-layer metal structure make routing easier and thus provide more design flexibility. In a substrate design, all signal lines are routed based on the transmission line scheme of finite-width coplanar waveguide or microstrip with a characteristic impedance of about $50{\Omega}$ for better signal transmission. The property and performance of anodic alumina based package substrate such as layer structure, design method, fabrication process and measurement characteristics are investigated in detail.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Fire Science and Engineering
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• v.28 no.3
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• pp.87-91
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• 2014

This paper is aimed to find electrical fire danger for analyzing the characteristics of temperature, current and voltage signals for motor on electric fan. In order to attain this purpose, detected were the temperature, current and voltage signals on electric wire with free (normal state) and locked (abnormal state) motor. For voltage and current signals, voltage signal is no big difference with normal and abnormal states and current signal is higher in abnormal state (highest 309 mA) than the normal state (highest 203 mA). In the case of Temperature signal, the temperature distribution of the motor as a whole is different. It is difference in the case of the normal state $4^{\circ}C$ and the abnormal state $18^{\circ}C$. In particular, most of the electric wiring to the motor of the fan is attached to the fixture of motor back. Considering at allowable temperature ($60^{\circ}C$) of the electric wire could be accelerated to insulation deterioration. The results of this study will be effectively used in analyzing for electric fire and developing the preventive devices of electric fan.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.7
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• pp.1283-1289
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• 2016

Electrical energy is the essential resource for modern society. Recently, the demand for power was significantly increased. Increase of power demand has lead to a decrease in the power quality. Power quality in modern society has been an important factor that can cause a major problem throughout the home and general industry. Therefore, we need a system for preventing the power quality problems. To avoid power issues, it is important that the measurement of the power quality and initial response. In this paper, we propose real-time power quality measurement system and harmonics monitoring system. We design the system using DM240001 board include dsPIC33FJ256GP710A of microchip. This system can adapt three-phase three-wire system. And optimized the algorithm, we can measure momentary changes of the power system. In addition, designed system can measure harmonics distortion like to VTHD, ITHD and ITDD for 31th harmonics.

• Journal of the Korea Computer Industry Society
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• v.10 no.4
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• pp.143-150
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• 2009

Remote control service, monitoring, gear service of information electronic appliance, various services of security service and so on of Home network that is by link of Ubiquitous environment are offered. These services need verification process through priority test to use and are changed. If test using actuality information electronic device for test, much expenses and time may be invested. Home network test bed offers softness of research using control model and simulator, in this paper, Wish to design and embody home network test bed to do environment construction of home network and test of application service. Because use istent power line just as it is without necessity to establish circuit in addition by solution of home network testbed, expense costs to be less and establishment used easy PLC. Also, propriated Wireless sensor network that use Zigbee by solution of home network testbed. Appliance check and monitor square do by Home Auto that know embodied, and embodied by Home Gateway that interlink terminals of Home Auto and out of.

• Journal of the Korean Vacuum Society
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• v.16 no.6
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• pp.439-445
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• 2007

SiGe integrated circuits are being used in the field of high-speed wire/wireless communications and microwave systems due to the RF/high-speed analog characteristics and the easiness in the fabrication. Reducing the resistance variation in SiGe thin film resistors results in enhancing the reliability of integrated circuits. In this paper, we investigate the causes that generate the resistance nonuniformity after the silicon-based thin film resistor was fabricated, and consider the counter plan against that. Because the Ti-B precipitate, which formed during the silicide process of the SiGe thin film resistor, gives rise to the nonuniformity of SiGe resistors, the boron ions should be implanted as many as possible. In addition, the resistance deviation increases as the size of the contact hole that interconnects the SiGe resistor and the metal line decreases. Therefore, the size of the contact hole must be enlarged in order to reduce the resistance deviation.

• Analytical Science and Technology
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• v.10 no.5
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• pp.362-369
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• 1997

Chemometric technique was applied to the sugar composition in five honeys of known botanical or geographical origin following HPLC. Fructose and glucose were predominant carbohydrates in honeys, and small amount of sucrose was also detected in one sample. Sugar contents in honeys samples were compared by the geographical or botanical origin. Fructose/glucose ratio ranged from 0.99 to 1.55 was obtained and these results are in good agreement with the ratio of literature. The plot of principal components analysis(PCA) showed that different honey samples grouped into distinct cluster by the geographical or botanical origin. Increasing the first or second principal component score, higher amount of sugar or less fructose/glucose ratio was observed in PCA plot. Chemometric approach was very useful to provide pattern recognition of sugar profile or quality indices of honey sample and to detect adulteration.

• Journal of Korea Multimedia Society
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• v.14 no.9
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• pp.1152-1164
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• 2011

Stock price is stream data to change continuously. The characteristics of these data, stock trends according to flow of time intervals may differ. therefore, stock price should be continuously prediction when the price is updated. In this paper, we propose the new prediction system that continuously predicts the stock price according to the predefined time intervals for the selected stock item using HTM model. We first present a preprocessor which normalizes the stock data and passes its result to the stream sensor. We next present a stream sensor which efficiently processes the continuous input. In addition, we devise a storage node which stores the prediction results for each level and passes it to next upper level and present the HTM network for prediction using these nodes. We show experimented our system using the actual stock price and shows its performance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05b
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• pp.79-83
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• 2001

In order to compare the barrier properties of Ta-N/Si(001) with those of Ta-N/Ta/Si(001), we studied structural properties of films grown by RF magnetron sputtering with various $Ar/N_2$ ratios. To evaluate the barrier properties, the samples were annealed in a vacuum chamber. Ex-situ x-ray scattering measurements were done using an in-house x-ray system. With increasing nitrogen ratio in Ta-N/Si(001), the barrier property of Ta-N/Si(001) was enhanced, finally failed at $750^{\circ}C$ due to the crystallization and silicide formation. Compared with Ta-N/Si(001), Ta-N/Ta/Si(001) forms silicides at $650^{\circ}C$. However it does not crystallize even at $750^{\circ}C$. With increasing nitrogen composition in Ta-N/Ta/Si(001), the formation of tantalum silicide was reduced and the surface roughness was improved. To observe the surface morphology of Ta-N/Ta/Si(001) during annealing, we performed an in-situ x-ray scattering experiment using synchrotron radiation of the 5C2 at Pohang Light Source(PLS). Addition of Ta layer between Ta-N and Si(001) improved the surface morphology and reduced the surface degradation at high temperatures. In addition, increasing $N_2/Ar$ flow ratio reduced the formation of tantalum silicide and enhanced the barrier properties.