• Title/Summary/Keyword: 반도체전력증폭기

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S-Band Solid State Power Oscillator for RF Heating (RF 가열용 S-대역 반도체 전력 발진기)

  • Jang, Kwang-Ho;Kim, Bo-Ki;Choi, Jin-Joo;Choi, Heung-Sik;Sim, Sung-Hun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.29 no.2
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    • pp.99-108
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    • 2018
  • This paper presents a design study of a solid state power oscillator to replace the conventional magnetron. The operational conditions of a single-stage 300 W LDMOS power amplifier were fully characterized. The power module consisted of two amplifiers connected in parallel. A delay-line feedback loop was designed for self-oscillation. A phase shifter was inserted in the delay-line feedback loop for adjusting the round-trip phase. Experiments performed using the power oscillator showed an output power of 800 W and a DC-RF conversion efficiency of 58 % at 2.327 GHz. The measured results were in good agreement with those predicted by numerical simulations.

ASIC Implementation of Nuclear Radiation Detector Using Semiconductor Sensor (반도체 센서를 이용 방사선 검출기의 ASIC 구현)

  • Yi, Un-Kun;Baek, Kwang-Ryul;Sohn, Chang-Ho
    • Proceedings of the KIEE Conference
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    • 2004.07d
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    • pp.2353-2355
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    • 2004
  • 본 논문에서는 고정도의 방사선 측정이 가능한 능동형 전자선량계를 제작하기 위해 필수적으로 요구되는 반도체 방사선 검출기를 ASIC으로 구현하였다. 이는 전자선량계의 소형화와 저소비전력을 실현할 수 있도록 전치증폭기와 성형증폭기를 일체화한 것으로 방사선과 방사선 검출 소자인 상용 핀 포토다이오드의 상호작용으로 생성된 수 [nA]의 전류펄스를 측정할 수 있다. MOSIS 공정을 통하여 ASIC으로 구현된 방사선검출기는 $10{\mu}Ci$${\gamma}$-선 Ba-133, Cs-137 및 Co-60의 세 핵종에 대하여 방사선 조사시험을 수행하여 구현된 방사선 검출기의 유용성을 입증하였다.

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Radiation Effects on PWM Controller of DC/DC Power Buck Converter (DC/DC 전력 강압 컨버터의 PWM 제어기 방사선 영향)

  • Lho, Young-Hwan
    • Journal of the Korean Society for Railway
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    • v.15 no.2
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    • pp.116-121
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    • 2012
  • DC/DC switching power converters produce DC output voltages from different DC input sources. The converter is used in regenerative braking of DC motors to return energy back in the supply, resulting in energy savings for the systems containing frequent stops. The DC/DC converter is composed of a PWM-IC (pulse width modulation integrated circuit) controller, a MOSFET (metal-oxide semi-conductor field-effect transistor), an inductor, capacitors, and resistors, etc. PWM is applied to control and regulate the total output voltage. In this paper, radiation shows the main influence on the changes in the electrical characteristics of comparator, operational amplifier, etc. in PWM-IC. In the PWM-IC operation, the missing pulses, the changes in pulse width, and the changes of the output waveform are studied by the simulation program with integrated circuit emphasis (SPICE) and compared with experiments.

A Study on the Application of High-Power GaN SSPA for Miniature Radar (GaN 고출력 증폭기의 초소형 레이다 적용에 관한 연구)

  • Lee, Sang_yeop;Yi, Jaewoong
    • Journal of the Korea Institute of Military Science and Technology
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    • v.19 no.5
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    • pp.574-581
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    • 2016
  • Trend on high-power GaN(Gallium Nitride) SSPA(Solid-State Power Amplifier) and its availability in miniature radar systems are presented. There are numerous studies on high-power GaN devices since they have some characteristics of high-breakdown voltage, high power density, and high-temperature stability. Recent scaled GaN technology makes it possible to apply it in SSPAs for W- and G-band applications, with increasing its maximum frequency. In addition, it leads to downsizing and power-efficiency improvement of SSPAs, which means that GaN SSPAs can be available in miniature radar systems. This study also shows radar performance and comparison in the case of using such SSPAs at three frequency bands of Ku, Ka, and W. Finally, we demonstrate prospects of scaled GaN SSPAs in future miniature radar systems.

Design of X-Band High Efficiency 60 W SSPA Module with Pulse Width Variation (펄스 폭 가변을 이용한 X-대역 고효율 60 W 전력 증폭 모듈 설계)

  • Kim, Min-Soo;Koo, Ryung-Seo;Rhee, Young-Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.23 no.9
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    • pp.1079-1086
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    • 2012
  • In this paper, X-band 60 W Solid-State Power Amplifier with sequential control circuit and pulse width variation circuit for improve bias of SSPA module was designed. The sequential control circuit operate in regular sequence drain bias switching of GaAs FET. The distortion and efficiency of output signals due to SSPA nonlinear degradation is increased by making operate in regular sequence the drain bias wider than that of RF input signals pulse width if only input signal using pulsed width variation. The GaAs FETs are used for the 60 W SSPA module which is consists of 3-stage modules, pre-amplifier stage, driver-amplifier stage and main-power amplifier stage. The main power amplifier stage is implemented with the power combiner, as a balanced amplifier structure, to obtain the power greater than 60 W. The designed SSPA modules has 50 dB gain, pulse period 1 msec, pulse width 100 us, 10 % duty cycle and 60 watts output power in the frequency range of 9.2~9.6 GHz and it can be applied to solid-state pulse compression radar using pulse SSPA.

Electrical Characteristics of Power Switching Sensor IC fabricated in Bipolar-CMOS-DMOS Process (BCD 프로세스를 이용한 파워 스위칭 센서 IC의 제작과 특성 연구)

  • Kim, Sunjung
    • Journal of IKEEE
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    • v.20 no.4
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    • pp.428-431
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    • 2016
  • Power semiconductor devices had been producted with bipolar only processes, but Bipolar-CMOS-DMOS(BCD) processes have been adapted recently to fabricate these devices since most foundry companies have provided BCD processes instead of Bipolar only processes. In this study, Regulator and OP Amp are used as most popular design IPs and BCD processes for the designing are converted from bipolar only processes. Power Switching Sensor(PSS) ICs are designed specifically and fabricated on a silicon chip. The operation results of the packaged chip show the good matching with test results of the simulation.

Miniaturized DBS Downconverter MMIC Showing a Low Noise and Low Power Dissipation Characteristic (저잡음ㆍ저소비전력 특성을 가지는 위성방송 수신용 초소형 다운컨버터 MMIC)

  • Yun, Young
    • Journal of Navigation and Port Research
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    • v.27 no.4
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    • pp.443-447
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    • 2003
  • In this work. using 0.2 GaAs modulation doped FET(MODFET), a high performance DBS downconverter MMIC was developed for direct broadcasting satellite (DBS) application. Without LNA, the downconverter MMIC showed a very low noise of 4.8 dB, which is lower by 3 dB than conventional ones. A low LO power of -10 dBm was required for the normal DBS operation of the downconverter MMIC. which reduced the power consumption via a removal of LO amplifier on MMIC. It required only a low power consumption of 175 mW, which is lower than 70 percent of conventional ones. The LO leakage power at IF output was suppressed to a lower level than 30 dBm, which removes a bulky LO rejection filter on a board. The fabricated chip, which include a mixer, If amplifiers. LO rejection filter, and active balun, exhibited a small size of $0.84{\times}0.9\textrm{mm}^2$.

TID and SEL Testing on OP-Amp. of DC/DC Power Converter (DC/DC 컨버터용 OP-Amp.의 TID 및 SEL 실험)

  • Lho, Young Hwan
    • Journal of the Korean Society of Radiology
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    • v.11 no.3
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    • pp.101-108
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    • 2017
  • DC/DC switching power converters are commonly used to generate a regulated DC output voltage with high efficiency. The advanced DC/DC converter uses a PWM-IC with OP-Amp. (Operational Amplifier) to control a MOSFET (metal-oxide semiconductor field effect transistor), which is a switching component, efficiently. In this paper, it is shown that the electrical characteristics of OP-Amp. are affected by radiations of ${\gamma}$ rays using $^{60}Co$ for TID (Total Ionizing Dose) testing and 5 heavy ions for SEL (Single Event Latch-up) testing. TID testing on OP-Amp. is accomplished up to the total dose of 30 krad, and the cross section($cm^2$) versus LET($MeV/mg/cm^2$) in the OP-Amp. operation is evaluated SEL testing after implementation of the controller board.

A Study on Bond Wire Fusing Analysis of GaN Amplifier and Selection of Current Capacity Considering Transient Current (GaN증폭기의 본드 와이어 용융단선 현상분석과 과도전류를 고려한 전류용량 선정에 대한 연구)

  • Woo-Sung, Yoo;Yeon-Su, Seok;Kyu-Hyeok, Hwang;Ki-Jun, Kim
    • Journal of IKEEE
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    • v.26 no.4
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    • pp.537-544
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    • 2022
  • This paper analyzes the occurrence and cause of bond wires fusing used in the manufacture of pulsed high power amplifiers. Recently GaN HEMT has been spotlight in the fields of electronic warfare, radar, base station and satellite communication. In order to produce the maximum output power, which is the main performance of the high-power amplifier, optimal impedance matching is required. And the material, diameter and number of bond wires must be determined in consideration of not only the rated current but also the heat generated by the transient current. In particular, it was confirmed that compound semiconductor with a wide energy band gap such as GaN trigger fusing of the bond wire due to an increase in thermal resistance when the design efficiency is low or the heat dissipation is insufficient. This data has been simulated for exothermic conditions, and it is expected to be used as a reference for applications using GaN devices as verified through IR microscope.

FEM MMIC Development based on X-Band GaAs for Satellite Terminals of Phase Array Structure (위상배열구조 위성단말용 X대역 GaAs 기반 FEM MMIC 국산화 개발)

  • Younghoon Kim;Sanghun Lee;Byungchul Park;Sungjin Mun
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.24 no.4
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    • pp.121-127
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    • 2024
  • In this paper, FEM (Front-End Module) MMIC, a key component for the application of the satellite communication terminal transmission and reception module of the multi-phase array structure, was designed and verified as a single chip by designing the Power Amplifier (PA) and the Low Noise Amplifier (LNA). It was manufactured using the GaAs PP10 (100nm) process, a compound semiconductor process from Win-semiconductors, and the operating frequency band of 7.2-10.5GHz operation, output 1W, and noise index of 1.5dB or less were secured using a dedicated test board. The developed FEM MMIC can be used as a single chip, and the components PA and LNA can also be used as each device. The developed device will be used in various applications of Minsu/Gunsu using the X band and the localization of overseas parts.