• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.179-179
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• 2006

산업기술의 고도화에 따른 IT 산업의 급속한 발전으로 각종 전자, 정보통신기기에 대해 더욱 소형화 고성능화를 요구하고 있다. 이와 같은 경향에 따라 더욱 향상된 기능을 가지고 각종 소자 부품의 개발과 동시에 유독 물질 발생이 없는 청정생산기술 개발에 대한 요구가 끊임없이 제기 되어 왔다. 이러한 요구에 부응하여 기술들이 개발되고 있으며 그 중의 하나로 잉크젯 프린팅 기술이 연구되고 있다. 특히 Dod(Drop on Demand) 방식의 잉크젯은 가정용 프린터로 개발되어 널리 보급된 기술이지만, 이 기술을 PCB 제조기술에 전용하면 친환경 생산공정으로 부품 성장밀도를 증대 시킬 수 있다. 기존의 PCB 제조기술은 전극과 신호 패턴을 형성시키기 위하여 노광공정과 에칭공정을 반복적으로 사용하고 있는데, 노광공정에서 쓰이는 마스크와 유틸리티 설비 유지 비용의 문제가 대두되고 있다. 노즐로부터 분사된 잉크 액적들의 집합으로 기판위에 점/선/면의 인쇄이미지를 구현하게 된다. 그러므로 인쇄 해상도는 잉크액적 및 인쇄 방법, 기판과의 상호작용에 크게 의존하게 된다. 잉크 액적과 기판의 상호작용에 영향을 미치는 요소로는 잉크의 물리화학적 물성(밀도, 점도, 표면장력), 잉크 액적의 충돌 조건(액적 지름, 부피, 속도), 그리고 기판의 특성(친수/소수성, Porous/Nonporous, 표면조도 등)을 들 수 있겠다. 우선적으로 노즐을 통과해서 분사되는 액적의 크기에 따라 기판위에 형성되는 라인의 두께 및 폭이 결정된다. 떨어진 액적이 기판위에서 퍼지는 것을 UV 조사를 통한 가경화 과정을 통해서 최종적으로 라인의 투께 및 폭을 조절하려고 한다. 따라서 선폭 $75{\mu}m$의 일정한 미세 배선을 형성시키기 위해 액적 크기 조절과 탄착 resist 액적 표면의 UV 가경화 조건으로 구현하려고 한다. 또한 DPI(Dot Per Inch) 조절을 통한 인쇄로 탄착 resist의 두께 확보 후 에칭시 박리되는 현상을 억제 시키려 한다.

• Elastomers and Composites
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• v.41 no.4
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• pp.252-259
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• 2006

A new route for making rubber/clay nanocomposites was suggested based on skim natural rubber latex (SNRL), which is a protein rich by-product obtained during the centrifugal concentration of natural rubber (NR) latex. NR/acrylonitrile butadiene rubber (NBR) based nanocomposites were prepared from SNRL and NBR latex of 26 % acrylonitrile content by blending of aqueous dispersion of organoclay (OC) followed by coagulation, drying, mill mixing and vulcanization. X-ray diffraction(XRD) studies revealed that NR/NBR blend nanocomposites exhibited a highly intercalated and exfoliated structure, especially for NBR-rich blends. Dynamic mechanical studies showed that more compatible behavior was observed for NBR-rich blends. The 25/75 NR/NBR blend nanocomposite showed the best mechanical properties.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.49-55
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• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

• Journal of the Korea Concrete Institute
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• v.17 no.1 s.85
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• pp.3-10
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• 2005

The purpose of this study is to investigate the properties of composite systems using polymer cement and epoxy resins for waterproofing and anti-corrosion to concrete structures such as water supply facilities and sewage-works. For the waterproofing and anti-corrosion of concrete structures, there can be required various properties such as absorption capacity and water permeability, adhesion and tensile strength, hair crack-resistance, impact-resistance, repeated low and high temperature test and chemical resistance, soundness for drinking water, soundness for drinking water and etc. In this study these engineering properties of composite systems using polymer-modified mortar and epoxy resins were examined and could be confirmed to satisfy the guidelines of KS. Especially, it was turn out that the adhesion properties was excellent and high crack-resistance up to 1.49 mm will be perform.

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.5
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• pp.426-431
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• 2007

When a high-energy ultrasound propagates through a solid body that contains a crack or a delamination, the two faces of the defect do not ordinarily vibrate in unison, and dissipative phenomena such as friction, rubbing and clapping between the faces will convert some of the vibrational energy to heat. By combining this heating effect with infrared imaging, one can detect a subsurface defect in material in real time. In this paper a realtime detection of the brazing defect of thin Inconel plates using the UIR (ultrasonic infrared imaging) technology is described. A low frequency (23 kHz) ultrasonic transducer was used to infuse the welded Inconel plates with a short pulse of sound for 280 ms. The ultrasonic source has a maximum power of 2 kW. The surface temperature of the area under inspection is imaged by an infrared camera that is coupled to a fast frame grabber in a computer. The hot spots, which are a small area around the bound between the two faces of the Inconel plates near the defective brazing point and heated up highly, are observed. And the weak thermal signal is observed at the defect position of brazed plate also. Using the image processing technology such as background subtraction average and image enhancement using histogram equalization, the position of defective brazing regions in the thin Inconel plates can be located certainly.

• Journal of the Korean Arthroscopy Society
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• v.14 no.1
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• pp.49-52
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• 2010

Purpose: We introduce arthroscopically assisted mini-open rotator cuff repair using anterolateral approach. Operative Technique: Placing lateral decubitus position on general anesthesia, a standard arthroscopic glenohumeral examination is performed to evaluate lesions of shoulder joint through posterior and anterior portal. And then arthroscope is placed in the subacromial space and we evaluate the size of the torn tendon and perform arthroscopic acromioplasty through lateral portal. A 3 to 4 cm skin incision is performed from anterolateral edge of acromion to distal and dissected along to raphe between anterior and middle deltoid. A deltoid retractor is then placed, allowing direct visualization of the rotator cuff and humeral head. As torn tendon is tagged by traction suture, we try to anatomical reduction on the footprint and then perform single row or double row repair of the rotator cuff using suture anchors. To prevent avulsion of the deltoid from the acromion, additional sutures by bone tunnel with acromion and deltoid is performed. Conclusion: This technique is useful procedure to get direct approach to anterior portion of supraspinatus tendon and to need lesser deltoid retraction than portal extension approach due to dividing along to raphe between anterior and middle deltoid. Also it provide better visualization of the superior portion of subscapularis and infraspinatus.

• Journal of the Korean Wood Science and Technology
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• v.41 no.1
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• pp.64-76
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• 2013

In this study, eco-friendly hybrid composite boards were manufactured from green tea, three kinds of charcoals and wood fiber for developing interior materials to reinforce the strength performances and the functionalities in addition to performances of the green tea-wood fiber hybrid boards. The effects for the kind and the component ratio of raw materials on mechanical properties were investigated. Bending strength performances of hybrid composite boards were highest in the hybrid composite boards composed of green tea, fine charcoal and wood fiber on average. However, the difference caused by the kind of charcoals was not large. These values were was markedly improved than those of green tea - wood fiber hybrid composite boards reported in previous researches. And it was found that the bending strength performance decreased with increasing component ratios of green tea and charcoals. The difference between urea resins used as the binder showed the higher value in hybrid composite boards using $E_1$ grade urea resin than in those using $E_0$ grade urea resin, but the difference between hybrid composite boards manufactured by both resins decreased markedly than the green tea - wood fiber hybrid composite boards reported in previous research. The internal bond strength of hybrid composite boards was in the order of hybrid composite boards with fine charcoal, activated charcoal and black charcoal, and it was found that the hybrid composite boards with fine charcoal had a similar values to control boards composed of only wood fiber.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.65-74
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• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.45-50
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• 2014

Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.75-81
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• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.