Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석)
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- Journal of the Computational Structural Engineering Institute of Korea
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- v.14 no.3
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- pp.309-315
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- 2001