• Communications for Statistical Applications and Methods
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• v.2 no.2
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• pp.434-444
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• 1995

외국산 통계패키지를 대체할만한 국산 통계패키지를 개발하려는 움직임이 현재 국내에서 활발히 전개되고 있다. 본 논문은 일반인을 대상으로하는 통계패키지 개발연구에 대한 경험을 토대로 통계전문가들이 많이 사용하는 모듈인 생존분석, 베이지안 분석, 보험통계분야 등에 관한 한국형 통계패키지 모듈에 대한 설계를 소개하고자 한다.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.63-67
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• 2021

In order to detect fires that may not be visible to the naked eye, an IoT module that uses changes in Carbon dioxide (CO₂) levels and temperature to effectively identify ambers (dying flames) was developed. Finite element analysis was then used to optimize the packaging for this module. Given the nature of ambers, the low power long range LoRa (Long Range) technology was used in the development of this module. To protect the module, a number of packages were designed, and comparative analysis performed on the stress generated when they fall. The results of which show that Model C showed the lowest stress. In addition, unlike other models in which stress concentration was predicted in the module mounting part of the package, in this model the stress concentration phenomenon was predicted in the wing part. It was therefore determined that this approach is ideal for protecting the internal module, and a package to which this was applied was manufactured.

• Proceedings of the Korea Information Processing Society Conference
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• 2001.10a
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• pp.375-378
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• 2001

패키지 소프트웨어의 품질시험을 통해 패키지 소프트웨어 구매자들의 요구에 부합되는 소프트웨어를 선택할 수 있도록 지원할 수 있다. 지금까지 일반적인 SI 소프트웨어에 대한 품질평가 방법론이나 평가 기법, 평가 도구 등이 개발된 사례가 있으나 패키지 소프트웨어의 경우에는 아직까지 국내에서 활용할 수 있는 구체적인 체계가 구축되어 있지 않은 실정이다. 패키지 소프트웨어는 하나의 소프트웨어 유형에 대해 다수의 제품이 개발되어 경쟁하게 되는 만큼 그 소프트웨어들 중에서 요구에 맞는 소프트웨어를 선택하기 어려우므로 이를 지원한 수 있는 방법의 개발이 중요한 의미를 가지고 있다. 본 연구에서는 패키지 소프트웨어 시험을 위한 표준인 ISO/IEC 12119를 기반으로 소프트웨어 패키지를 시험하여 결과를 산출한 수 있는 시험모듈과 품질검사표를 개발하여 패키지 소프트웨어 시험에 적용할 수 있도록 하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1011-1019
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• 2015

Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.10
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• pp.31-39
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• 2004

This paper illustrates the noise characteristics under chip's core operations according to types of packages and modules for DDR DRAM For analyzing this, the impedance profiles and power noises are analyzed with DRAM chips having commercial TSOP package and commercial FBGA package on TSOP-based DIMM and FBGA-based DIMH In controversy with common concepts, we find that the noise-isolation characteristics of FBGA package are more weak and sensitive on transferred noises than those of the TSOP package. In addition, the simulated results show that the decoupling capacitor locations of modules are more important to control the self and transfer noise characteristics than the lead inductance of the packages. Therefore, satisfying the target spec of the noise suppression and isolation can be achieved through the design of power distribution systems only with considering not only the package types but also the whole module system.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.10
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• pp.687-698
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• 2001

This paper presents a three dimensional stacked pad area away (PAA) package configuration as an implementation method of radio frequency (RF) circuits. 224MHz RF circuits of intelligence traffic system(ITS) were constructed with the stacked PAA RF pakage configuration. In the process of manufacturing the stacked PAA RF pakage, RF circuits were partitioned to subareas following their function and operating frequency. Each area of circuits separated to each subunits. The operating characteristics of RF PAA package module and the electrical properties of each subunits were examined. The measurement of electrical parameters for solder balls which were interconnects for stacked PAA RF packages showed that the parasitic capacitance and inductance were 30fF and 120pH, respectively, which might be negligible in PAA RF packaging system. HP 4396B network/spectrum analyzer revealed that the amplification gain of a receiver and transmitter at 224 MHz was 22dB and 27dB, respectively. The gain was 3dB lower than designed values. The difference was probably generated from fabrication process of the circuits by employing commercial standard

• Journal of Engineering Education Research
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• v.2 no.1
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• pp.10-16
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• 1999

In this paper, we developed the internet-based educational software package (DVLab) for design and virtual experiment of the digital logic circuits. The DVLab consists of the LogicSim module for design and simulation of digital combinational/sequantial logic circuits, micro-controller application circuits and the BreadBoard module for virtual experiment and the Theory module for lecture and the Report/ReportChecker module and some other utility modules. All developed modules can be run as application programs as well as applets in the Internet. The LogicSim and the BreadBoard support real time clock function, output verification function on the designed circuits, trace function of logic values, copy-protection function of designed circuits and provide various devices including logic gates, TTLs, LED, buzzer, and micro-controller. The educational model of digital logic circuit design and experiment using the DVLab is also presented in this paper.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.5
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• pp.1029-1034
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• 2012

This paper presents a cost-effective and high-performance film bulk acoustic resonator (FBAR) duplexer module for US-PCS handset applications. The FBAR device uses a glass wafer level packaging process, which is a more cost-effective alternative to the typical silicon capping process. The maximum insertion losses of the FBAR duplexer at the Tx and Rx bands are of 1.9 and 2.4 dB, respectively. The total thickness of the duplexer module is 1.2 mm, including the glass-wafer bonded Tx/Rx FBAR devices, PCB board, and transfer molding material.

• Proceedings of the Korea Information Processing Society Conference
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• 2006.05a
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• pp.223-226
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• 2006

산업용 소프트웨어의 유형은 크게 패키지형, 내장형, 시스템형으로 구분할 수 있다. 패키지형 소프트웨어는 산업용 ERP를 의미하며, 내장형 소프트웨어는 산업용 기기에 내장되어 사용되고, 시스템형은 제조 및 생산 시스템의 전반적인 제어를 위한 소프트웨어이다. 본 연구에서는 산업용 내장형 소프트웨어를 대상으로 하여 품질시험 및 평가를 수행할 수 있는 평가모듈의 개발에 관해 기술하였다. 평가모듈의 객관성 및 타당성을 제고하기 위해서는 국제표준을 기반으로 한 체계 구축이 필수적이다. 관련된 국제표준으로는 소프트웨어 제품의 요구사항 및 평가에 관한 표준인 ISO/IEC 12119와 9126이 있으며, 평가모듈의 구성 형식을 규정하고 있는 ISO/IEC 14598-6이 있다. 이러한 표준들을 기반으로 하여 산업용 내장형 소프트웨어의 품질 요구사항을 추출하고 품질 요구의 만족 수준을 평가할 수 있는 평가 모듈을 구축하였다.