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Investigation of Leakage Currents of $BaTiO_3$ Thin Films Using Aerosol Deposition in Microscopic Viewpoint

  • O, Jong-Min;Kim, Hyeong-Jun;Kim, Su-In;Lee, Chang-U;Nam, Song-Min
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.114-114
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    • 2010
  • 최근 고용량의 디커플링 캐패시터를 기판에 내장하여 고주파 발생의 원인인 배선길이와 실장 면적을 획기적으로 줄이는 임베디드 디커플링 캐패시터에 대한 연구가 활발히 진행되고 있다. 하지만 기존의 공정들은 높은 공정온도와 같은 공정상의 한계를 가지고 있어 상온 저 진공 분위기에서 세라믹 분말을 기판에 고속 분사시켜 기공과 균열이 거의 없는 치밀한 나노구조의 세라믹 제작이 가능한 후막코팅기술인 Aerosol Deposition Method (ADM)에 착목하였으며, 이 ADM을 박막공정으로 응용하여 $BaTiO_3$ 박막을 제작하고 고용량의 디커플링 캐패시터 제작을 실현하고자 한다. 하지만, Cu 기판 상에 성막 된 $0.5\;{\mu}m$이하의 $BaTiO_3$ 박막에서는 $BaTiO_3$ 분말 내에 존재하는 평균입자 보다 큰 입자와 응집분말로 인해 발생하는 pore, crater, not-fully-crushed particles와 같은 거시적인 결함들에서의 전류 통전과 울퉁불퉁한 $BaTiO_3$ 박막과 기판 사이의 계면에서의 전계의 집중에 의한 전류의 증가로 인하여 큰 누설전류 발생하는 문제에 봉착하였다. 이러한 문제를 해결하기 위하여 제시된 효과적인 방법으로 Stainless steel 기판과 같이 표면경도가 높은 기판을 사용하는 것이며, 이를 통해 $0.2\;{\mu}m$의 두께까지 유전 $BaTiO_3$ 박막을 성막 할 수 있었으며, 치밀한 표면 미세구조와 줄어든 $BaTiO_3$ 박막과 기판 사이의 계면의 거칠기를 확인하였다. 하지만, $BaTiO_3$ 박막 내에 발생하는 누설전류의 근본원인을 확인하기 위해서는 누설전류에 대한 미시적인 접근이 더욱 요구된다. 이에 본 연구에서는 누설전류 발생원인의 미시적 접근을 위해 두께에 따른 $BaTiO_3$ 박막의 누설전류 전도기구에 대한 조사하였으며, 이를 통해 $BaTiO_3$ 박막내 발생하는 누설전류의 원인은 $BaTiO_3$막 내에서 donor로서 역할을 하는 oxygen vacancy와 불균일한 전계의 집중으로 인한 전자의 tunneling 현상임을 확인할 수 있었다. 또한, Nano-indenter와 Conductive atomic force microscopic를 이용한 정밀 측정을 통해 표면경도의 중요성을 재확인하였으며 $BaTiO_3$ 박막의 두께가 $0.2\;{\mu}m$이하로 더욱 얇아지게 되면 입자간 결합 문제 또한 ADM을 박막화 하는데 있어 중요한 요소임을 확인하였다.

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폴리이미드 기판을 이용한 유연 Cu(In,Ga)Se2 박막 태양전지 제작

  • Park, Su-Jeong;Jo, Dae-Hyeong;Lee, U-Jeong;Wi, Jae-Hyeong;Han, Won-Seok;Jeong, Yong-Deok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.309.2-309.2
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    • 2013
  • Cu(In,Ga)Se2 (CIGS) 박막 태양전지는 일반적으로 Na을 함유하고 있는 소다회유리를 기판으로 사용하여 제작되며, 높은 광전 변환 효율로 인해 많은 연구가 이루어지고 있다. 특히 제조 비용 절감과 양산성 향상을 위해 현재 유연 기판 CIGS 박막 태양전지에 대한 연구가 활발히 이루어지고 있으며, 폴리이미드 기판에서 20.4%의 최고 효율이 보고되었다. 유연 기판은 유리 기판 대비 무게가 가볍기 때문에 유리 기판 태양전지보다 활용도가 높으며, 우주용으로 사용할 경우 단위 무게 당 발생되는 전력이 높은 장점이 있다. 본 연구에서는 폴리이미드 기판을 이용하여 유연 CIGS 박막 태양전지를 제작하였다. 후면 전극 Mo은 DC sputtering으로 증착하였으며, Mo의 증착 압력에 따라 폴리이미드 기판의 잔류 응력과 전기적 특성을 분석하여 증착 압력을 결정하였다. 광흡수층인 CIGS는 다단계 동시 증발 법으로 증착하였으며, 2nd stage 공정온도는 유리 기판 대비 저온인 $475^{\circ}C$로 공정을 진행하였다. 저온공정인 $475^{\circ}C$ 공정에서는 Ga의 함량이 높아질수록 성능이 감소하였으며, Na 공급을 통해 Voc와 FF가 향상되어 성능이 향상됨을 알 수 있었다. 버퍼층 CdS는 습식 공정인 CBD법으로 증착하였으며, 공정변수인 thiourea의 농도와 CdS 박막의 두께 변화를 통해 폴리이미드 기판 CIGS 박막 태양전지에서 CdS 버퍼층의 최적의 조건을 도출하였다. 최종적으로 제작된 폴리이미드 기판 유연 CIGS 박막 태양전지는 반사 방지막 없이 개방전압 0.511V, 단락전류밀도 32.31mA/cm2, 충실도 64.50%, 변환효율 10.65%를 나타내었다.

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Development of Atomic Nitrogen Source Based on a Dielectric Barrier Discharge and Low Temperature Growth GaN (유전체장벽방전에 의한 질소함유 활성종의 개발 및 저온 GaN 박막 성장)

  • Kim, Joo-Sung;Byun, Dong-Jin;Kim, Jin-Sang;Kum, Dong-Wha
    • Korean Journal of Materials Research
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    • v.9 no.12
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    • pp.1216-1221
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    • 1999
  • GaN films were deposited on sapphire [$Al_2O_3(0001)$] substrates at relatively low temperature by MOCVD using N-atom source based on a Dielectric Barrier Discharged method. Ammonia gas($NH_3$is commonly used as an N-source to grow GaN films in conventional MOCVD process, and heating to high temperature is required to provide sufficient dissociation of $NH_3$. We used a dielectric barrier discharge method instead of $NH_3$ to grow GaN film relatively low temperature. DBD is a type of discharge, which have at least one dielectric material as a barrier between electrode. DBD is a type of controlled microarc that can be operated at relatively high gas pressure. Crystallinity and surface morphology depend on growth temperature and buffer layer growth. With the DBD-MOCVD method, wurtzite GaN which is dominated by the (0001) reflection was successfully grown on sapphire substrate even at $700^{\circ}C$.

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Seeding Effects on Phase Transformation in Diol-Based Sol-Gel Derived PZT Film (졸-겔 공정에 의해 Diol을 기반으로 제조된 PZT막 상전이에 대한 종자 영향)

  • An, Byung-Hun;Whang, Chin-Myung
    • Korean Journal of Materials Research
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    • v.9 no.12
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    • pp.1181-1187
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    • 1999
  • PZT(53/47) precursor 1M sols were prepared using a diol based Sol-Gel process, and thin films were deposited by spin coating onto Pt/Ti/$SiO_2$/Si substrates. With a single coating, final film thickness of aproximately 0.9${\mu}m $ was achieved from diol-based PZT sol. Since PZT crystallized in a ferroelectric perovskite phase from an intermediate nonferroelectric pyrochlore phase, the effects of the presence of perovskite PZT seeds on the phase transformation of PZT were investigated. Seeded PZT films were prepared from the seeded PZT 1M sols in which seeds with less than 0.2${\mu}m $ in size and 1wt% were dispersed in n-propanol before mixing with the PZT stock solution. The seeding effects were confirmed by the fact that the formation temperature of perovskite phase decreased by 50$^{\circ}C$ with less than 1wt% seeds.

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Humidity Sensitive Properties of Humidity Sensor Using Reactive Copolymers (반응성 공중합체들을 이용한 습도센서의 감습 특성)

  • Kim, Jin-Seok;Bae, Jang-Sun;Gong, Myeong-Seon
    • Korean Journal of Materials Research
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    • v.11 no.2
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    • pp.126-131
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    • 2001
  • The mutually reactive copolymers poly[(vinylbenzyl chloride)-co-(n-butyl acrylate)-co-(2-hydroxyethyl methacrylate)] and poly[(4-vinylpyridine)-co-(n-butyl acrylate)-co-(2-hydroxyethyl methacrylate)] were synthesized for the humidity sensitive material by forming simultaneous quaternization. The humidity sensor showed an average resistance of 8.6 M$\Omega$, 310 k$\Omega$ and 12 k$\Omega$ at 30%RH, 60%RH and 90%RH, respectively. The hysteresis and temperature coefficient were $\pm$3%RH and -0.37~-0.40%RH/$^{\circ}C$. The introduction of n-BA and HEMA increased the resistance of the humidity sensor however it enhanced the adherence to the alumina substrate. The response time was 54 seconds changing from 33%RH to 85%RH and the difference of resistance was +0.2%RH after soaking in water for 2 hr.

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Influences of Target-to-Substrate Distance and Deposition Temperature on a-SiOx/Indium Doped Tin Oxide Substrate as a Liquid Crystal Alignment Layer (RF 마그네트론 스퍼터링에서 증착거리와 증착온도가 무기 액정 배향막의 물리적 성질에 미치는 영향에 대한 연구)

  • Park, Jeung-Hun;Son, Phil-Kook;Kim, Ki-Pom;Pak, Hyuk-Kyu
    • Korean Journal of Materials Research
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    • v.18 no.10
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    • pp.521-528
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    • 2008
  • We present the structural, optical, and electrical properties of amorphous silicon suboxide (a-$SiO_x$) films grown on indium tin oxide glass substrates with a radio frequency magnetron technique from a polycrystalline silicon oxide target using ambient Ar. For different substrate-target distances (d = 8 cm and 10 cm), the deposition temperature effects were systematically studied. For d = 8cm, oxygen content in a-$SiO_x$ decreased with dissociation of oxygen onto the silicon oxide matrix; temperature increased due to enlargement of kinetic energy. For d = 10 cm, however, the oxygen content had a minimum between $150^{\circ}\;and\;200^{\circ}$. Using simple optical measurements, we can predict a preferred orientation of liquid crystal molecules on a-$SiO_x$ thin film. At higher oxygen content (x > 1.6), liquid crystal molecules on an inorganic liquid crystal alignment layer of a-$SiO_x$ showed homogeneous alignment; however, in the lower case (x < 1.6), liquid crystals showed homeotropic alignment.

Optimization of Ar Reshape Process for 4H-SiC Trench MOSFET (4H-SiC Trench MOSFET 응용을 위한 Ar Reshape 공정 최적화)

  • Sung, Min-Je;Kang, Min-Jae;Kim, Hong-Ki;Kim, Seong-jun;Lee, Jung-Yoon;Lee, Wonbeom;Lee, Nam-suk;Shin, Hoon-Kyu
    • Journal of IKEEE
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    • v.22 no.4
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    • pp.1234-1237
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    • 2018
  • For 4H-SiC trench MOSFET which can reduce on-resistance and switching losses compared to 4H-SiC planar MOSFET, the optimization study for decrease of sub-trench was carried out. In order to decrease sub-trench, Ar reshape process was used and trench shapes were observed as a function of temperature and process time. As a result, it was confirmed that the process conditions for $1500^{\circ}C$ and 20 min were most effective for the suitable trench profiles. In addition, dry/wet oxidation was performed at the Ar reshaped-samples to observe the oxidation thickness with different crystal orientations.

Development of Molecular Dynamics Model for Water Electrolysis Ionomer (수전해용 이오노머 분자동역학 모델 개발)

  • Kang, Hoseong;Park, Chi Hoon;Lee, Chang Hyun
    • Membrane Journal
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    • v.30 no.6
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    • pp.433-442
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    • 2020
  • In this study, in order to build a molecular dynamics simulation model of ionomer for water electrolysis, an ionomer model that reflects the characteristics of a water electrolysis system in which excess water molecules exist was compared to an ionomer built according to the conventional simulation method of the fuel cells membrane. The final ionomer MD models have a strong phase separation and water channel that is one of the important characteristics of the perfluorinated ionomer, and are stable and water-insoluble under excessive water and high temperature conditions. In the ionomer MD models built in this study, the excess water molecules decrease an ion conductivity due to the dilution of ions, but increase a hydrogen diffusivity. Therefore, it is necessary to design the molecular structure of ionomers for water electrolysis in experimental studies as well as molecular dynamics studies according to the characteristics of the water electrolysis system reported in this study.

Design Optimization of Hydrated Liquid Crystalline Vesicles Containing a High Content of Ceramide Using DOE (실험 계획법을 적용한 세라마이드 고함량의 수화 액정형 베시클의 최적설계)

  • Shin, Juyeong;Jin, Byung-Suk
    • Journal of the Korean Applied Science and Technology
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    • v.39 no.5
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    • pp.623-631
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    • 2022
  • Using the design of experiment (DOE), factors affecting the particle size of hydrated liquid crystalline vesicles containing a high content of ceramide were analyzed and the mixture composition was optimized. Manufacturing temperature, amount of ethanol, and ultrasonic time were selected as the main variables affecting the droplet size of the vesicles, and the effect of these variables on the droplet size was examined through the signal to noise (S/N) ratios of Taguchi method and ANOVA analysis. In addition, mixture composition experiments of three lipid components constituting the vesicle membrane, hydrogenated phosphatidyl choline (HPC), cholesterol (Chol), and ceramide (Cer), were performed according to the simplex central design matrix of the mixture. Regression analysis was conducted with the experimental data to obtain a model equation, and the optimal mixing composition of the three lipid components to minimize the vesicle droplet size was determined as HPC (0.6), Chol (0.1), and Cer (0.3).

Effects of pH and Plating Bath Temperature on Formation of Eco-Friendly Electroless Ni-P Plating Film on Aluminum (알루미늄 위 친환경적 무전해 Ni-P 도금막 형성에 pH와 도금조 온도가 미치는 영향)

  • Gee, Hyun-Bae;Bin, Jung-Su;Lee, Youn-Seoung;Rha, Sa-Kyun
    • Korean Journal of Materials Research
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    • v.32 no.9
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    • pp.361-368
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    • 2022
  • The overall process, from the pre-treatment of aluminum substrates to the eco-friendly neutral electroless Ni-P plating process, was observed, compared, and analysed. To remove the surface oxide layer on the aluminum substrate and aid Ni-P plating, a zincation process was carried out. After the second zincation treatment, it was confirmed that a mostly uniform Zn layer was formed and the surface oxide of aluminum was also removed. The Ni-P electroless plating films were formed on the secondary zincated aluminum substrate using electroless plating solutions of pH 4.5 and neutral pH 7.0, respectively, while changing the plating bath temperature. When a neutral pH7.0 electroless solution was used, the Ni-P plating layer was uniformly formed even at the plating bath temperature of 50 ℃, and the plating speed was remarkably increased as the bath temperature was increased. On the other hand, when a pH 4.5 Ni-P electroless solution was used, a Ni-P plating film was not formed at a plating bath temperature of 50 ℃, and the plating speed was very slow compared to pH 7.0, although plating speed increased with increasing bath temperature. In the P contents, the P concentration of the neutral pH 7.0 Ni-P electroless plating layer was reduced by ~ 42.3 % compared to pH 4.5. Structurally, all of the Ni-P electroless plating layers formed in the pH 4.5 solution and the neutral (pH 7.0) solution had an amorphous crystal structure, as a Ni-P compound, regardless of the plating bath temperature.