• The KIPS Transactions:PartA
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• v.8A no.4
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• pp.479-488
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• 2001

As the SoC designs complexity constantly increases, the simulation that uses their software models simply takes too much time. To solve this problem, FPGA-based logic emulators have been developed and commonly used in the industry. However, FPGA-based logic emulators are facing with the problems of which not only very low FPGA resource usage rate due to the very limited number of pins in FPGAs, but also the emulation speed getting slow drastically as the complexity of designs increases. In this paper, we proposed a new innovative emulation architecture and its software that has high FPGA resource usage rate and makes the emulation extremely fast. The proposed emulation system has merits to overcome the FPGA pin limitation by pipelined ring which transfers multiple logic signal through a single physical pin, and it also makes possible to use a high speed system clock through the intelligent ring topology. In this topology, not only all signal transfer channels among EPGAs are totally separated from user logic so that a high speed system clock can be used, but also the depth of combinational paths is kept swallow as much as possible. Both of these are contributed to achieve high speed emulation. For pipelined singnals transfer among FPGAs we adopt a few heuristic scheduling having low computation complexity. Experimental result with a 12 bit microcontroller has shown that high speed emulation possible even with these simple heuristic scheduling algorithms.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.1-10
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• 2016

This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.10
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• pp.1044-1051
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• 2003

In this paper, a compact planar microwave duplexer on the high dielectric substrate is presented. As the Ba(Mg$\sub$1/3/Ta$\sub$2/3/)O$_3$(BMT) has good dielectric performances with a high dielectric constant of $\varepsilon$$\sub$r/=23, it is suitable to apply to a printed circuit board fur reducing its circuit size. The BMT substrate is fabricated by using a tape casting fabrication process, and circuit patterns are screen-printed on it by suing silver paste. The open-loop ring type duplexer is designed and implemented on the BMT substrate, and it achieves the smaller size by 80% than one on a commercial substrate($\varepsilon$$\sub$r/=6.15) without degenerating its performance. Therefore the proposed BMT substrate has provided the miniaturization of the duplexer, moreover it can make a contribution towards reducing the size of microwave passive circuits.

• Transactions of the Korean hydrogen and new energy society
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• v.24 no.2
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• pp.142-149
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• 2013

Carbon materials are mainly used as catalyst supports for polymer exchange membrane fuel cell (PEMFC). Catalyst supports are required specific characteristics of the carbon materials, such as large surface area and high electrical conductivity. Attempted were to improve electrical conductivity and to maintain high surface area of carbon materials using a microwave treatment. Microwave treatment, as a relatively new technique, takes short reaction time and reduce the consumption of the gases used for carbon treatment compared to a traditional heat treatment. Hybrid carbon (ACF/Graphene) as catalyst supports by microwave-irradiation method for PEMFC increase the cell performance because of increased electrical conductivity resulting in triple-phase contact and reduced the interfacial resistance. Scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-Ray Diffraction (XRD) were employed to analyze carbon materials. The performance of microwave-treated carbon materials was evaluated by measuring current-voltage (I-V) characteristics and electrode impedance.

• Journal of the Institute of Convergence Signal Processing
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• v.9 no.2
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• pp.146-153
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• 2008

Integrated humidity sensor system with two stages operational amplifier has been designed and fabricated by $0.8{\mu}m$ analog mixed CMOS technology. The system (28 pin and $2mm{\times}4mm$) consisted of Wheatstone-bridge type humidity sensor, resistive type humidity sensor, temperature sensors and operational amplifier for signal amplification and process in one chip. The poly-nitride etch stop process has been tried to form the sensing area as well as trench in a standard CMOS process. This modified technique did not affect the CMOS devices in their essential characteristics and gave an allowance to fabricate the system on same chip by standard process. The operational amplifier showed the stable operation so that unity gain bandwidth was more than 5.46 MHz and slew rate was more than 10 V/uS, respectively. The drain current of n-channel humidity sensitive field effect transistor (HUSFET) increased from 0.54 mA to 0.68 mA as the relative humidity increased from 10 to 70 %RH.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.1
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• pp.61-72
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• 1999

The present study experimentally investigated the effect of refrigeration lubricant on the heat transfer performance in the straight sections and U-bend of a microfin tube evaporator by using R-22/mineral oil and R-407C/POE oil. The apparatus consisted of test section with U-bend, preheater, condenser, oil injection and sampling devices, magnetic pump, mass flow meter etc. The experimental parameters were oil concentration of 0 to 5 wt%, inlet quality of 0.1 to 0.5, mass flux of 219 and $400kg/m^2s$ and heat flux of 10 and $20kW/m^2$. The effects of parameters on the heat transfer coefficients were large in the order of inlet quality, mass flux and heat flux as oil concentration got increased. As oil concentration was increased, heat transfer coefficients were continuously decreased for R-22 and increased by 3% up to the concentration of 1% and then decreased for R-407C under the condition of large inlet quality, and small mass flux and heat flux. But, the heat transfer coefficients were increased up to the concentration of 3% and then decreased for both R-22 and R-407C refrigerants under the opposite conditions. The variation of enhancement factors for R-407C was under 50% of that for R-22 and the variation with respect to the positions in the test section was small. The pressure drops were increased for both R-22 and R-407C refrigerants as oil concentration was increased. The pressure drops for R-407C were smaller by the maximum of 18% than those for R-22.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.3 no.3
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• pp.509-516
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• 1999

In this paper, it is designed a microstrip U-slotted patch antenna with double resonances to enhance the bandwidth. In the design of an U-slotted patch antenna, there are considered the input impedance, the width of patch, the total length of the slot, the height of foam, the position of the probe and the radius of feed pin. The broadband behavior of antenna can be obtained by adjusting the length and width of the slot. The radiation from the antenna is linear polarized with the E-paine parallel to the vertical slots and the H plane parallel to horizontal slot. The radiation pattern, impedance locus, and VSWR of the antenna are calculated using "ENSEMBLE" software, and compared with the experimental results. Experimental results show that the bandwidth for VSWR $\le$ 2:1 is about 28.6%, a directivity 14.18dBi at 6.040GHz. 6.040GHz.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.939-940
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• 2015

In this paper, a design method for a quasi-Yagi antenna (QYA) suitable for UHF band is studied. Due to the mutual coupling between a coplanar strip (CPS)-fed planar dipole and a conducting strip director placed close to the dipole, the dipole obtains broadband characteristics. A ground reflector improves gain in the lower frequency band, and the antenna size might be reduced by employing a bent reflector. The balun between the CPS line and the microstrip(MS) line is constructed by connecting the end of MS line and the CPS line through a shorting pin. In addition, a ring-type conductor connects the CPS line and reflector. The effects of various geometrical parameters and balun on the antenna characteristics are examined. An antenna, as an design example for the proposed antenna, is designed for the operation in the frequency band of 470-806 MHz for terrestrial DTV.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.88-93
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• 2023

As the demand for High Bandwidth Memory (HBM) increases and the handling capability of larger wafers expands, ensuring reliable Total Thickness Variation (TTV) measurement for stacked wafers becomes essential. This study presents the design of a measurement module capable of measuring TTV across the entire area of a 300mm wafer, along with estimating potential mechanical measurement errors. The module enables full-area measurement by utilizing a center chuck and lift pin for wafer support. Modal analysis verifies the structural stability of the module, confirming that both the driving and measuring parts were designed with stiffness exceeding 100 Hz. The mechanical measurement error of the designed module was estimated, resulting in a predicted measurement error of 1.34 nm when measuring the thickness of a bonding wafer with a thickness of 1,500 ㎛.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.5 no.7
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• pp.1210-1218
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• 2001

In this paper, A X-band voltage-controlled hair-pin resonator oscillator(VCHRO) is able to a local oscillator or a signal source in transmitter/receiver of a microwave communication system for mobile radar, is designed and fabricated In order to apply mobile radar system is used the hair-pin resonator stronger on shock or vibration than the dielectric resonator, and also, in order to improvement the phase noise and output power is used a system of serial feedback format A hair-pin resonator was simulated by momentum method of HP ADS and then a oscillator circuit was designed that operates at 10.525 GHz by nonlinear method in harmonic balance simulation. The HRO generated output power of 6.93 dBm at 10.525 GHz, phase noise of -57.74 dBc at 100 kHz offset from carrier and the 2'nd harmonic was suppressed -23.90 dBc.