• Journal of the Korean Geotechnical Society
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• v.39 no.11
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• pp.63-70
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• 2023

Underground carbon dioxide (CO₂) storage emerges as a pivotal strategy for mitigating atmospheric CO₂ emissions and addressing global warming concerns. This study investigates techniques to optimize storage efficiency in aquifers, which stand out for their superior capacity compared to other geological layers. The focus is on the application of nonionic and anionic surfactants to enhance CO₂ storage efficiency within confined spaces. A specialized micromodel facilitating fluid flow observation was employed for the evaluation. Experimental results revealed a noteworthy minimum 40% increase in storage efficiency at the lowest injection rate when utilizing nonionic and anionic surfactants, in comparison to pure water injection. Interestingly, no significant variations in storage efficiency were observed based on the ionicity and concentration of the surfactants under investigation. These findings have implications for guiding the selection and concentration determination of surfactants in future underground CO₂ storage endeavors.

• Clean Technology
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• v.18 no.3
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• pp.295-300
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• 2012

Synthesis of well-defined particle with tunable size, shape, and functionalities is strongly emphasized for various applications such as chemistry, biology, material science, chemical engineering, medicine, and biotechnology. This study presents micromolding method for the fabrication of anisotropic particles with elegant control of curvature of covex roof. For the demostration of rapid fabrication of the particles, we have applied polydimethylsiloxane (PDMS) micromold as structure guiding template and wetting fluid to control curvature of roof of the particles. Based on this approach, we can control the radius of curvature from $20{\mu}m$ to $70{\mu}m$ with different aspect ratio of mold. In addition, wetting fluids with different wetting properties can also modulate the height and radius of curvature of the particles. We envision that this methodology is promising tool for precise control of particle shape in 3-dimensional space and new synthetic route for anisotropic particles with cost effective, simple, easy, and fast procedure.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.54-62
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• 2024

SICM (Scanning Ion Conductivity Microscopy) is a technique for measuring surface topography in an environment where electrochemical reactions occur, by detecting changes in ion conductivity as a nanopipette tip approaches the sample. This study includes an investigation of the current response curve, known as the approach curve, according to the distance between the tip and the sample. First, a simulation analysis was conducted on the approach curves. Based on the simulation results, then, several measuring experiments were conducted concurrently to analyze the difference between the simulated and measured approach curves. The simulation analysis confirms that the current squeezing effect occurs as the distance between the tip and the sample approaches half the inner radius of the tip. However, through the calculations, the decrease in current density due to the simple reduction in ion channels was found to be much smaller compared to the current squeezing effect measured through actual experiments. This suggests that ion conductivity in nano-scale narrow channels does not simply follow the Nernst-Einstein relationship based on the diffusion coefficients, but also takes into account the fluidic hydrodynamic resistance at the interface created by the tip and the sample. It is expected that SICM can be combined with SECM (Scanning Electrochemical Microscopy) to overcome the limitations of SECM through consecutive measurement of the two techniques, thereby to strengthen the analysis of electrochemical surface reactivity. This could potentially provide groundbreaking help in understanding the local catalytic reactions in electroless plating and the behaviors of organic additives in electroplating for various kinds of patterns used in semiconductor damascene processes and packaging processes.