• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2005.05a
• /
• pp.383-388
• /
• 2005

In this paper Research development about a micro metal forming manufacturing system has been developed. A micro forming system has been achieved in Japan and it's developed micro press is limited to single forming process. To coincide with the purpose to be more practical, research and development is necessary about the press which the multi forming process is possible. We set the development of the equipment including micro deep drawing, micro punching and micro restriking process to the goal. To achieve this goal, Research about micro forming process to be related to multi process forming must be preceded first. Material selection and analysis about micro forming process are accomplished in this paper. And the basis research to make actual system is accomplished.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.05a
• /
• pp.379-382
• /
• 2007

The MEMS (Micro Electro Mechanical Systems) process is used in a micro/nano pattern manufacturing method. This method is based on the lithography technology. But the MEMS process has some problems such as complicated process, long processing time and high production costs. Many researchers are doing research in substitute manufacturing method to work out a solution to these problems. In this paper, we apply a dieless incremental forming technology to a substitute method of MEMS process. This dieless forming technology is using in the commercial scale sheet forming such as a prototype of automobile sheet parts. 5-axes CNC (Computerized Numeric Control) method are applied in this system to get a micro-scale dieless forming results. These 5-axes system are composed of precision AC servo motor stages (4-axes) and PZT actuator (1-axis). A PZT actuator is used in a precision actuating axis because it can be operated in the nano scale stroke resolution. This micro dieless incremental forming system has the advantage of minimization in manipulating distance and working space. As equipment and tools become smaller in size, minute inertia force and high natural frequency can be obtained. Therefore, high precision forming performance can be obtained. This allows the factory to quickly provide the customer with goods because the manufacturing system and process are reduced. To construct this micro manufacturing system, many technologies are necessary such as high stiffness frame, high precision actuating part, structural analysis, high precision tools and system control. To achieve the optimal forming quality, the micro dieless forming system is designed and made with high stiffness characteristic.

• Transactions of Materials Processing
• /
• v.14 no.5 s.77
• /
• pp.432-438
• /
• 2005

Among the most of manufacturing process, plastic deformation method offers a significant advantage in productivity and enable mass production with controlled quality and low cost. From the point of view, micro forming is a well suited technology in manufacturing very small metallic parts, in particular for mass production, as they are required in many industrial products. Meanwhile, Al 5083 superplastic alloy with very small grains has a great advantage in achieving micro deformation under low stress due to its relatively low strength at a specific high temperature range. This paper describes the micro formability of Al 5083 superplastic alloy and its application to die forging of micro patterns. Micro formability tests of Al 5083 superplastic alloy were carried out with the specially designed micro forging system by using V-grooved micro dies and pyramidal dies made of (100) silicon. With these dies, micro forging was conducted by varying the applied load, material temperature and forging time The micro formability of Al 5083 superplastic alloy was evaluated by comparing $R_f$ value, where $R_f\;=\;A_f/A_v$ ($A_v$ : cross-sectional area of the flowed metal, $A_v$ : cross sectional area of V-groove). The micro formability of 3 dimensional Patterns was also evaluated using Pyramidal type micro dies.

• Transactions of Materials Processing
• /
• v.21 no.3
• /
• pp.179-185
• /
• 2012

In this paper, it is proposed to produce high precision screws with a diameter of $800{\mu}m$ and a thread pitch of $200{\mu}m$ ($M0.8{\times}P0.2$) by means of a cold thread rolling process. In this part II of the study, the focus is on the production and reliability testing of the prototype $M0.8{\times}P0.2$ micro-screw. Designs for two flat dies were developed with the aid of the literature and previous studies. Process parameters during the cold thread rolling process were established through FE simulations. The simulation results showed that the threads of the micro-screw are completely formed through the rolling process. Prototype $M0.8{\times}P0.2$ micro-screw were fabricated with a high precision thread rolling machine. In order to verify the simulation results, the deformed shape and dimensions obtained from the experiment were compared with those from the simulations. Hardness and failure torque of the fabricated micro-screw were also measured. The values obtained indicate that the CAE based process design used in this paper is very appropriate for the thread rolling of micro-sized screws.

• Applied Chemistry for Engineering
• /
• v.2 no.3
• /
• pp.193-198
• /
• 1991

Thick film copper conductors are of considerable interest in thick film industries because of both the potential cost saving compared to the noble metal conductors and the favorable properties in electrical conductivity, solderability, solder leach resistance and wire bondability, However, formation of the excellent copper thick film is a lot complicated due to easily oxidizing property of copper at high temperature. In order to get favorable thick film copper conductor, hybrid microcircuit industry utilizes majorly three kinds of firing atmosphere, such as nitrogen atmosphere, reactive atmosphere and air atmosphere. The processes and the three atmospheres for firing thick film copper conductor were extensively reviewed in this article.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1995.10a
• /
• pp.247-250
• /
• 1995

The development and empirical validation of a mathematical model for predicting the depth of deformed layer in a machined surface are presented. The main assumption for develioping this model is that there is a linear relationship between plastic strain and the depth to which it extends. The model relates the work required to shear the workpice material to the work needed to compress the workpiece material ahead of the cutting tool. The results show that the percent difference between the calculated and the measured depth of deformed layer ranges form 4 percent to 19 percent. An improvement of the model is suggested through application of actual distribution data of plastic strain.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.11a
• /
• pp.40-40
• /
• 2003

최근 나노기술의 발달과 더불어 나노재료에 대한 특성평가 요구가 높아지고 있고, 따라서 나노스케일에서 재료의 기계적 거동을 분석할 수 있는 나노인덴테이션 기법이 심도있게 연구되고 있다. 본 연구에서는 나노인덴테이션, 주사탐침현미경(SPM), 투과전자현미경(TEM) 기법을 이용하여 여러가지 재료의 탄성 소성 변형 거동과 팝인/괍아웃 현상을 조사하고 해석하였다. 나노인덴테이션 기법으로는 50 마이크로뉴턴 (5 mg) 이하의 매우 작은 하중 하에서는 접촉 응력조건이라도 인장시험에서 관찰되는 영구변형이 제로인 완전탄성 변형 거동을 관찰할 수 있었다. 또한, 50-250 마이크로 뉴턴의 하중 범위에서 재료는 탄성변형 이후에 갑작스런 항복거동과 더불어 수십-수백 나노미터를 미끌어지듯 변형하는 팝인(pop-in), 또는 탈선(excursion) 현상을 관찰할 수 있었다. 이 현상은 하중을 가하는 동안에 여러 번 발생하였으며 재료의 표면상태와 전위밀도와 밀접한 상관관계를 보였다. 반복 압입 시험에서는 전형적인 가공경화 현상으로 항복점이 높아지고 새로운 항복점 이후에야 다시 팝인 발생함을 보였다. 한편, 하중을 가할 때 발생하는 팝인과는 달리 하중을 제거할 때 급격히 회복하는 팝아웃 현상 또한 관찰되었다.

• Journal of the Microelectronics and Packaging Society
• /
• v.1 no.2
• /
• pp.113-124
• /
• 1994

MOD법을 마이크로회로용 티탄산 바륨 콘덴서 박막형성에 적용하였다. Barium decanoate barium 2-ethylhexanoate titanium dimethoxy didecanoate 및 titanium dimethoxy di-2-ethylhexanoate와 같은 여러 가지 금속유기화합물들을 합성하고 동정한 다 음 공통용매에 대한 용해도를 시험하였다. 이금속유기화학물들 가운데 barium 2-ethylhexanoate와 titanium dimethoxy di-2-ethylhexanoate가 xylene-pyridine 혼합용매에 잘녹고 MOD법에 의한 BaTiO3 박막형성에 매우 안정한 조성을 이룸을 확인하였다. 이 조 성을 스핀코팅에 의하여 백금박과 실리콘 웨이퍼상에 금속유기화학물 막을 형성하고 최고 온도와 유지시간에 따라 소성하여 형성된 유전체 박막들의 전기전 특성을 측정하고 고찰하 였다.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.11a
• /
• pp.81-85
• /
• 2000

마이크로파대역에서 우수한 유전적 특성을 가지며 소결이 90$0^{\circ}C$ 이하에서 가능하여 Ag와 동시 소결이 가능한 유전체 조성을 개발하여 RF MCM-C(Multi-chip Module on Ceramic) 제조를 위한 유전체 테잎 제조에 대한 기초적인 실험과 Ag 전극과 동시소성에 대한 반응성 실험을 하였다. 본 실험에 앞서 개발된 유전체 조성의 마이크로대역에서의 유전특성은 유전율 24, 품질계수 30,000 이상, 공진주파수 온도계수 37 ppm/$^{\circ}C$ 이었고 소결온도는 85$0^{\circ}C$이었다. 이 유전체를 이용결함 없는 테잎 제조를 위한 유기용매의 선택, 바인더 및 가소제의 량 및 비에 따른 테잎의 소결 전 .후의 상태를 비교.분석하여 최적의 조성비를 결정하였다. 테잎과 은전극과의 반응성 실험결과 은과 유전체의 상호확산은 거의 이루어지지 않음을 확인하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.2 no.1
• /
• pp.35-48
• /
• 1995

마이크로회로내에서 티탄산바륨 중 바륨의 일부가 납으로 치환됨에 따른 전기적 특 성의 변화를 확인하기 위하여 MOD(금속유기화합물 분해법)공정에 의 barum 2-ethylhexanoate, barium neodecanoate, lead 2-ethylhexanoate 및 titanium dimethoxy 야 -2-ethylhexanoate 와 같은 MOC(금속 유기화합물) 들을 합성하고 공통 용매에 대한 용해 도를 시험하였다. 그 결과 barium 2-ethylhexanoate 만 p-xylene에 대한 용해도가 낮았으며 그 외의 다른 MOC들은 모두 p-xylene 단일 용매에 매우 잘 용해되었다. 바륨의 일부가 납 으로 치환된 티탄산 납바륨 박막은 MOC 혼합용액을 ITO/glass, Pt/SiO2/Si 및 Pt/Ti/SiO2/Si 웨이퍼 기판 위에 spin coating 하고 소성하여 얻었다. 이와 같이 얻어진 박막 의 전기적 특성을 측정하고 그 결과를 비교 고찰하였다.