• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.2
• /
• pp.19-26
• /
• 2003

Plastic and creep deformations of a solder joint on thermal cycle play an important role in the reliability of optical telecommunication components. Solder joint strain is increased with the thermal cycle time and it causes mis-alignments and power loss in the optical component. Furthermore, the component can be failed since the deformation exceed the limitation of the fatigue life. We applied the finite element analysis method to solve the problem of the solder joint reliability on thermal cycle. Plastic and creep deformations are calculated by the finite element method. And, the fatigue lire is predicted by using creep-fatigue prediction models with calculated strains. The temperature conditon of the analysis was referred from the Telcordia reliability schedule (-40 to 75). Also, the three ramp renditions, 1/min, 10/min and 50/min, and dwelling time were considered to analyze the differences of results.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.2
• /
• pp.63-68
• /
• 1999

We have fabricated $WO_3$ thick film gas sensor under various firing conditions in order to study gas sensing properties in terms of the variation of microstructure and non-stoichiometric structure of gas sensing layer. $WO_3$ paste mixed homogeneously with organic vehicle was coated by screen printing method on alumina substrate composed of Au electrode and $RuO_2$heater on each side. To change filing condition, sensing materials were fared at 600-$800^{\circ}C$ for 1 hour and refired at $700^{\circ}C$ for 1 hour in the mixtures of $_Ar/O2$gas. In the result of heat-treatment, $WO_3$ gas sensor fared at $700^{\circ}C$ showed best gas sensing properties of 210 gas sensitivity and 2 second response time and the best firing environment was 40-50% of $Ar/O_2$gas.

• Journal of Korean Society of Steel Construction
• /
• v.18 no.2
• /
• pp.147-160
• /
• 2006

GA-based fuzzy optimum design algorithm incorporated with the refined plastic hinge analysis method is presented in this study. In the refined plastic hinge analysis method, geometric nonlinearity is considered by using the stability functions of the beam-column members. Material nonlinearity is also considered by using the gradual stiffness degradation model, which considers the effects of residual stresses, moment redistribution through the occurence of plastic hinges, and the geometric imperfections of the members. In the genetic algorithm, the tournament selection method and the total weight of the steel frames. The requirements of load-carrying capacity, serviceability, ductility, and constructabil ity are used as the constraint conditions. In fuzzy optimization, for crisp objective function and fuzzy constraint s, the tolerance that is accepted is 5% of the constraints. Furthermore, a level-cut method is presented from 0 to 1 at a 0 .2 interval, with the use of the nonmembership function, to solve fuzzy-optimization problems. The values of conventional GA optimization and fuzzy GA optimization are compared in several examples of steel structures.

• Transactions of Materials Processing
• /
• v.13 no.3
• /
• pp.216-224
• /
• 2004

In this study, we have developed a new UV$({\lambda}=355nm)$ laser micromachining technology by direct ablation method without masks. This technology allows that 3D micro parts can be fabricated rapidly and efficiently with a low price. And it has a benefit of reducing fabricating process simply. Due to micro parts' fabrication, such technologies need the control of XYZ stages with high precision, the design of optical devices to maintain micron spot sizes of laser beam and the control technology of laser focus. The developed laser manufacturing process for laser micromachining is that, after extracting coordinates of shape data from CAD model data, a beam path considering manufacturing features of laser beam is created by using genetic algorithm. This generated manufacturing process is sent to stage controller. In order to improve the surface quality of micro parts, we have carried out experiments on iteration manufacturing and beam step-over by using a minimum focus size. Moreover, we have fabricated a micro-channel through the developed laser micromachining technology and verified it through the results.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2009.05a
• /
• pp.176-179
• /
• 2009

Injection molding is one of the most general manufacturing processes of polymers. The deformation of final molded parts occurs because of the change of temperature and pressure during injection molding process. The deformation of injection molded parts depends on many operational conditions, such as, melt temperature, injection speed, mold temperature, packing pressure, and the structure of mold. In the present paper, injection molding experiments were performed to find the process conditions to affect the average shrinkage in thickness direction and the replication ratio of fine patterns on the surface for the final injection-molded LGP samples. As a results, in the cases of PC(Polycarbonate), when the melt temperature was under $285^{\circ}C$, both average shrinkage and replication ratios were mainly influenced by packing pressure. However, the replication ratio was more influenced by melt temperature than packing pressure for the cases of higher melt temperature.

• Transactions of Materials Processing
• /
• v.11 no.2
• /
• pp.103-107
• /
• 2002

With the great demand for WDM (Wavelength Division Multiplexing) optical communications, optical switches are expected to become one of the dominant components in future networks. Conventional mechanical switches suffer from poor reliability and large size; however, many micromachined optical switches with moving mirrors have been proposed for high scale OXC (Optical Crossconnect) or ADM (Add/Drop Multiplex) because of the low power consumption and high reliability of these switches. In this paper, we introduce the technological trends of optical switches using MEMS, related micromachining technologies and their characteristics.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1995.06a
• /
• pp.55-63
• /
• 1995

Press accidents are one of the most popular industrial accidents. Two factors are considered to lead to press accidents, one is human, the other press machine itself. Accident itself is analyzed and concluded to be due to incomplete interaction between press and human. A press design considering safety as a methodology is introduced to reduce the industrial accidents by press machine, that is micro-inching locking system.

• Journal of the Microelectronics and Packaging Society
• /
• v.3 no.1
• /
• pp.1-10
• /
• 1996

반도체 산업의 급속한 발전에따라서 모든 전자산업부품의 경박단소화와 신호처리 속도가 고속화되는 추세에 있다. 특히 중대형 컴퓨터의 연산 처리가 고속화 됨에 따라서 반 도체 실장 재료로서 널리 사용되었던 Al2O3/Mo계 세라믹 소재로는 요구조건을 만족시킬수 없게 되었다. 따라서 저 유전율 절연 재료와 고밀도 배선이 가능한 고전도성 도체 재료의 개발이 요구되고 있다. Cu는 높는 전도성 뿐만 아니라 내 migration 특성 미세패턴의 적합 성 및 고주파 특성 등이 우수하여 저온 소성용 세라믹 기판용 전극 재료로서 유망하다.

• Journal of the Microelectronics and Packaging Society
• /
• v.3 no.1
• /
• pp.49-56
• /
• 1996

저유전 상수와 저온 소성이 가능한 기판 재료의 제조를 위해 sol-gel법으로 borosilicate/Si3N4 Microcomposite 분말을 합성하였다. Microcomposite 분말의 조성은 borosilicate/Si3N4의 부피비로 50/50, 60/40 및 70/30을 선택하였다. Microcomposite의 성형 체는 건식가압법으로 성형하여 700~100$0^{\circ}C$에서 2시간 동안 소결하였다. Microcomposite 의 미세구조는 SEM과 TEM으로 관찰하였고 소결체의 유전 상수와 밀도를 측정하였다. Microcomposite은 85$0^{\circ}C$ 근처에서 치밀화가 일어나고 유전상수는 약 4.2였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.1 no.1
• /
• pp.41-50
• /
• 1994

RuO2 분말의 비표면적이 후막저항체의 전기적 특성에 미치는 영향을 규명하기 위하 여 비표면적이 서로다른 RuO2 분말을 이용하여 RuO2 함량을 다양하게 후막저항을 형성하 고 그들의 전기적 특성을 저항체 막의 미세조직과 관련하여 고찰하였다. 그 결과 후막저항 체의 전기적 특성은 소성과정에서 RuO2 의 비표면적과 함량에 따라 도전통로를 통하여 발 달하여 소결접촉과 비소결접촉의 수와 그 비에 크게 의존함을 확인하였다.