• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.83-88
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• 2020

The evolution of smartphones has led to numerous researches in the mechanical behavior of flexible devices. Due to the nano-size of the thin flexible film, nanoindentation is widely used to evaluate its mechanical behaviors, such as elastic modulus, and hardness. However, the commonly used Oliver-Pharr method is not suited for analyzing the indentation force-depth curves of hard films on soft substrates, as the effects of soft substrate is not considered theoretically. In this study, the elastic modulus of the thin film was evaluated with references to other reported models which include the substrate effect, and with calibration of the indentation depth for the pile-ups between the indenter and test surface. We fabricated test samples by deposition of amorphous metal film on polyimide and silicon wafers for verification of modified models.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.207-212
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• 2005

Al, Ti, Ta, and Cr thin films were deposited on a polyimide substrate using DC magnetron sputter to study the adhesion characteristics of metal films on polyimide substrates, while RF bias of 0 - 400 W was applied to the substrate during DC sputtering. The adhesion strength was evaluated using a 90-degree peel test. The peel tests showed that the adhesion strength was enhanced by applying the RF bias to the substrate in all specimens. Scanning electron microscopy and Auger depth profile of the fractured surfaces indicate that the polyimide underwent cohesive failure during peeling and heavy deformation was also observed in the metal films peeled from the polyimide substrate when the RF bias applied during the deposition. Cross-sectional transmission electron microscopy revealed that the metal/polyimide interface was not clear and complicated. This complicated interface, likely formed due to the RF bias applied to the substrate, was attributed to the adhesion enhancement observed during the bias sputtering.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.63-72
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• 2006

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.33-38
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• 2006

Aerosol slurry composed of dielectric materials, distilled water, and deflocculants was sprayed on the substrates, through a high-pressure spray gun as an aerosol. The coated layers were cofired together with $Al_{2}O_{3}$ substrates and green sheets on which the inner connectors were printed. Although the coating rate of coated layers strongly depended on slurry viscosity, spray shape, and the pressure of the spray gun, the coated density was not changed. Buried conductors were maintained as printed by high pressure spray coating method, because the pressing process was not used. At the optimum condition of air controller step 3-4 and slurry viscosity c.p 2000-4000, dense and uniform layers could be achieved. Comparing with conventional lamination process using green sheets, spray coating method enabled thin dielectric layers of $20{\sim}50{\mu}m$.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.5
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• pp.368-372
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• 2016

In this study, we develop a novel high-throughput micronanopatterning system that can implement continuous mechanical pattern inscribing on flexible substrates using a rigid grating mold edge. We perform a conceptual design of the process principle, specific modeling, and buildup of a real system prototype. This research also carefully addresses several important issues related to processing and controlling, including precision motion, alignment, heating, and sensing to enable a successful micronanopatterning in a continuous and high-speed fashion. Various micronanopatterns with the desired profiles can be created by tuning the mold shape, temperature, force, and substrate material toward many potential applications involving electronics, photonics, displays, light sources, and sensors, which typically require a large-area and flexible configurations.

• Journal of the Korea institute for structural maintenance and inspection
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• v.14 no.3
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• pp.144-151
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• 2010

In this study, it is investigated the mechanical chemical properties of cement matrix using phosphogypsum and kaolin as a admixture for the substitutive materials to silica fume which is so expensive. For the test, phosphogypsum is modified as dihydrate, hemihydrate, type III anhydrite, and type II anhydrite, respectively and furnaced kaolin at $900^{\circ}C$ was also manufactured into meta kaolin by air cooling and water cooling method. The chemical characteristic and mechanical properties of various type of blended cements contained above mentioned gypsum and meta kaolin materials analyzed and compared with those characteristics of cement matrix with silica fume. From the test, the cement mixed meta kaolin made in water cooling has more excellent quality than other material.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.63-69
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• 2019

Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.50-60
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• 2023

Ball Grid Array (BGA) is a widely used package type due to its high pin density and good heat dissipation. In BGA, solder balls play an important role in electrically connecting the package to the PCB. Therefore, understanding the inelastic deformation of solder balls under various mechanical loads is essential for the robust design of semiconductor packages. In this study, the geometrical effect on the inelastic deformation and fracture of solder balls were analyzed by finite element analysis. The results showed that fracture occurred in both tilted and hourglass shapes under shear loading, and no fracture occurred in all cases under compressive loading. However, when bending was applied, only the tilted shape failed. When shear and bending loads were combined with compression, the stress triaxiality was maintained at a value less than zero and failure was suppressed. Furthermore, a comparison using the Lagrangian-Green strain tensor of the critical element showed that even under the same loading conditions, there was a significant difference in deformation depending on the shape of the solder ball.

• Journal of Environmental Science International
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• v.29 no.11
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• pp.1025-1032
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• 2020

This work was performed to develop a dip injection wet scrubber (DIWS) system with chlorine dioxide as the oxidant. The exhaust pollutants from a lime kiln of paper-mill were introduced to the system. When NaClO₃ was used to oxidize NO into NO₂, the oxidation was unsatisfactory and the combination of HNO₃ or H₂SO₄ was required for 100% oxidation. ClO₂ is recommended to oxidize NO and SO₂ effectively. With the combination of 1^st stage of DIWS and ClO₂, 57.1% of NOx and 98% of SO₂ were effectively removed. In the case of 2^nd stage of DIWS and ClO₂, 93.5% of NOx and 99% of SO₂ were removed. The ClO₂+DIWS process was superior to the ClO₂+Scrubber process in terms of investment, running cost and NOx removal efficiency.