Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Development of a High-throughput Micronanopatterning System Based on the Plastic Deformation Driven by Continuous Rigid Mold Edge Inscribing on Flexible Substrates

마이크로나노그레이팅 경질 몰드 모서리의 연속적 각인 소성가공 기반 유연 마이크로나노패턴의 고속 연속 제작 공정시스템 개발

  • Lee, Seungjo (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology) ;
  • Oh, Dong Kyo (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology) ;
  • Park, Jaekyu (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology) ;
  • Kim, Jeong Dae (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology) ;
  • Lee, Jae Hyuk (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology) ;
  • Ok, Jong G. (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology)
  • Received : 2016.09.12
  • Accepted : 2016.10.14
  • Published : 2016.10.15
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Abstract

In this study, we develop a novel high-throughput micronanopatterning system that can implement continuous mechanical pattern inscribing on flexible substrates using a rigid grating mold edge. We perform a conceptual design of the process principle, specific modeling, and buildup of a real system prototype. This research also carefully addresses several important issues related to processing and controlling, including precision motion, alignment, heating, and sensing to enable a successful micronanopatterning in a continuous and high-speed fashion. Various micronanopatterns with the desired profiles can be created by tuning the mold shape, temperature, force, and substrate material toward many potential applications involving electronics, photonics, displays, light sources, and sensors, which typically require a large-area and flexible configurations.

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References

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