• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.405-406
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• 2006

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.1
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• pp.15-18
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• 2011

Up to now the incomplete texture have been manufactured through the 2D surface treatment like simple painting process or printing process. But in order to obtain 3D texture like natural object, micro scales' 3D surface structure on the surface of plastic part must be formed. In this study plastic smart phone case with 3D texture was produced by developing the surface duplication technology of natural object used electro-forming technology, by developing the press forming technology converted plane stamper to curved surface stamper and by developing the injection mold and molding technology which have been installed the curved surface stamper.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.50-50
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• 2009

본 연구에서는 차체 부품의 경량소재 대체에 따른 Panel Assembly Rear Seat Back 부품 제작에 최신 저입열 미그용접공정을 적용한 TWB(Tailor Welded Blank) 공정기술을 확보하기 위해 최적 용접조건 도출에 관한 연구를 진행하였다. 용접 후 성형이 이뤄지는 제조공정의 특성 상 성형강도에 중점을 둔 실험을 진행하였으며, 이를 위해 각 와이어에 따른 용접부의 기계/금속학적 특성이 평가되었다. 대상 시편은 6천계열 열처리형 합금이며, 두께는 각각 1.6t, 1.4t로 이를 맞대기 용접 후 그 특성을 평가하였다. 용접은 저입열 GMA용접 공법 중 하나인 CMT 용접법(Cold Metal Transfer)을 사용하였으며, 평가 대상 와이어로는 4043, 4047, 5183 및 5356이 사용되었다. 특성평가는 마크로 및 마이크로 조직, 경도, 인장강도, 기공 및 결함, 성형강도 등에 대해 이뤄졌으며, 희석된 와이어의 조성이 용접부 특성에 미치는 영향에 대해서도 검토되었다. 실험 결과, 5천계열 와이어가 성형강도에 비교적 더 강인한 결과를 나타냈으며 성형강도는 용접조건 및 초기 갭에 대한 영향은 받았으나, 비드형상과 강도간의 연관성은 찾을 수 없었다. 이에 따라 TWB 적용을 위한 와이어로는 5356이 가장 우수한 것으로 판명되었다.

• Journal of the Korean Chemical Society
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• v.54 no.5
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• pp.594-602
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• 2010

Since the requirement of the high density integration and thin package technique of semiconductor have been increasing, the main package type of semiconductor will be a chip scale package (CSP). The changes of diffusion coefficient and moisture content ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were investigated. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The micro-sized and nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler size. The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these EMC according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these EMC were calculated in terms of modified Crank equation based on Ficks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volume with Tg. In the EMC with filler, the changes of Tg and maximum moisture absorption ratio with the filler content can be hardly observed, however, the diffusion coefficients of these systems with filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMC with micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.4
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• pp.21-27
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• 2014

The injection molding process has several advantages enabling it to produce large quantities of molded plastic products using a repetitive process. In recent years, it has been necessary to develop an injection molding process with micro/nano-sized patterns for application to the semiconductor industry and to the bio/nano manufacturing industry. In this study, we apply gas pressure to the inside of a mold and consider the gas dissolution phenomenon for a resin filling into a micro pattern with a line structure. Using numerical analysis, we calculate the filling ratio with respect to time for various internal gas pressures and various aspect ratios of the micro-patterns.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.5
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• pp.575-582
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• 2010

In recent years, several rapid-mold-heating techniques that can be used for the injection molding of thin-walled parts or micro/nano structures have been developed. High-frequency induction heating, which involves heating by electromagnetic induction, is an efficient method for the rapid heating of mold surfaces. The present study proposes an integrated numerical model of the high-frequency induction heating process and the resulting injection molding process. To take into account the effects of thermal boundary conditions in induction heating, we carry out a fully integrated numerical analysis that combines electromagnetic field calculation, heat transfer analysis, and injection molding simulation. The proposed integrated simulation is extended to the injection molding of a thin-wall part, and the simulation results are compared with the experimental findings. The validity of the proposed simulation is discussed according to the ways of the boundary condition imposition.

• Elastomers and Composites
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• v.44 no.4
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• pp.384-390
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• 2009

Roll-to-roll forming process is one of important metal processing technology because the process is simple and economical. These days, with these merits, roll-to-roll forming process is tried to be employed in manufacturing the circuit board, barrier ribs and solar cell plate. The solar cell plate may have millions of patterns, and the analysis of forming considering all the patterns is impossible due to the computational costs. In this study, analyses are carried out for various numbers of patterns and the results are compared. It is shown that the analyses results with four row patterns and twelve row patterns are same. So, it is considered that the analysis can be carried out for only four rows of pattern for the design of incremental roll-to-roll forming process. Also formability is analysed for various number of mesh, protrusion shapes and forming temperature.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.717-718
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.1075-1076
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.315-316
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• 2012