• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.57-62
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• 2011

The energy conversion efficiency of DSSCs (Dye-Sensitized Solar Cells) is dependent on the powder size, the structure, and the morphology of $TiO_2$ electrode. The higher efficiency is obtained with high surface area of the nanoanatase-$TiO_2$ powder adsorbed onto a lot more of the dye. Also, the enhancement of light scattering increases the efficiency with high adsorption of the dye. Powder size, crystalline phase, and shape of $TiO_2$ obtained by hydrothermal method have 15-20 nm, anatase and round. $TiO_2$ electrode has fabricated with the mixture of scattering $TiO_2$ particle with 0.4 ${\mu}m$ in nano-sized powder. Conversion efficiency of series of DSSCs was measured with volume fraction of scattering particle. Photovoltaic characteristics of DSSCs with 10% scattering particles are 3.51 mA for Jsc (short circuit current), 0.79 V for Voc(open circuit potential), filling factor 0.619 and 6.86% for efficiency. Jsc was improved by 11% and enhancement of efficiency by 0.77% compared with that of no scattering particles. The confinement of inserted light by light scattering particles has more increase of the injection of exiton(electron-hole pair) and decrease of moving path in electron. Efficiencies of DSSCs with more than 10% for scattering particles have reduced with increasing the pore in the $TiO_2$ electrode.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.93-99
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• 2016

In this paper, we investigated the mechanical and electrical reliability of silver nanowire (AgNW) films. In particular, the durability and reliability of AgNW films were studied when the AgNW film was subjected to the bending deformation under current flow. The electrical durability of AgNW was evaluated by observing changes in heat generation and current density occurring in AgNW through voltage and current tests. The AgNW film showed a constant resistance change up to a bending radius of 2 mm and 200,000 cycles in the bending fatigue tests. The over-coating layer has an effect of improving the durability of the AgNW film. In the case of AgNW with the over-coating layer, heat was uniformly dissipated on the surface of AgNW film, whereas in the case of AgNW film without the over-coating layer, heat was generated locally. In the bending test under the current flow, the current density of the AgNW film was continuously decreased up to 52.4%. During bending, the AgNW was deformed due to mechanical deformation such as tensile, bending and sliding of the AgNW, consequently contact resistance of the AgNW was increased, leading to a electrical breakdown of AgNW by Joule heating. It was found that the application of the over-coating layer can improve the electrical and mechanical reliability of the AgNW film.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.8
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• pp.930-936
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• 2007

In this paper, the high gain and broadband antenna operating for SDMB(Satellite Digital Multimedia Broadcasting) system is realized, The proposed antenna consists of the SAP(Shorted Annular Patch) structure, which inhibits surface-wave and the parasitic SAP element with spacing of $0.25 {\lambda}_0$ in order to improve gain, bandwidth and directivity. The RHCP(Right Hand Circular Polarization) is generated by two slits, which are made along the periphery of the circular patch at the diametrically opposite points, The simulated maximum gain of the proposed antenna is 12.6 dBi, which is better 5.22 dBi than maximum gain of the conventional microstrip patch antenna. The measured maximum gain is 10.5dBi at operating frequency 2.63GHz. Also, the measured impedance bandwidth$(VSWR{\leq}2)$ of the proposed antenna is $360MHz(2.488{\sim}2.848 GHz)$, which is better 300 MHz than the bandwidth of the conventional microstrip patch antenna. The measured HPBW(Half Power Beam Width) of the proposed antenna is $45.8^{\circ}$, and the measured FBR(Front to Back Ratio) is 15.49 dBi, The 3dB axial ratio bandwidth is 220 MHz$(2.54{\sim}2.76 GHz)$.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.27-36
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• 2006

We fabricated thermally evaporated 10 nm-Ni/(poly)Si, 10 nm-Ni/l nm-Ir/(poly)Si and 10 nm-Ni/l nm-Pt/(poly)Si films to investigate the thermal stability of nickel monosilicides at the elevated temperatures by rapid annealing them at the temperatures of $300{\sim}1200^{\circ}C$ for 40 seconds. Silicides of 50 nm-thick were formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to examine sheet resistance. A scanning electron microscope and field ion beam were employed for thickness and microstructure evolution characterization. An X-ray diffractometer and an Auger depth profiler were used for phase and composition analysis, respectively. Nickel silicides with platinum have no effect on widening the NiSi stabilization temperature region. Nickel silicides with iridium farmed on single crystal silicon showed a low resistance up to $1200^{\circ}C$ while the ones formed on polycrystalline silicon substrate showed low resistance up to $850^{\circ}C$. The grain boundary diffusion and agglomeration of silicides lowered the NiSi stable temperature with polycrystalline silicon substrates. Our result implies that our newly proposed Ir added NiSi process may widen the thermal process window for nano CMOS process.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.55-60
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• 2012

In order to develop electroless-plated Nickel Phosphate (Ni-P) as a contact material for high efficient low-cost silicon solar cells, we evaluated the effect of ambient thermal annealing on the degradation behavior of interfacial adhesion energy between electroless-plated Ni-P and silicon solar cell wafers by applying 4-point bending test method. Measured interfacial adhesion energies decreased from 14.83 to 10.83 J/$m^2$ after annealing at 300 and $600^{\circ}C$, respectively. The X-ray photoelectron spectroscopy analysis suggested that the bonding interface was degraded by environmental residual oxygen, in which the oxidation inhibit the stable formation of Ni silicide phase between electroless-plated Ni-P and silicon interface.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.13-19
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• 2009

A 440MHz wireless and passive surface acoustic wave (SAW) based chemical sensor was developed on a $41^{\circ}YX\;LiNbO_3$ piezoelectric substrate for simultaneous measurement of $CO_2$ gas and relative humidity (RH) using a reflective delay line pattern as the sensor element. The reflective delay line is composed of an interdigital transducer (IDT) and several shorted grating reflectors. A Teflon AF 2400 and a hydrophilic $SiO_2$ layer were used as $CO_2$ and water vapor sensitive films. The coupling of mode (COM) modeling was conducted to determine optimal device parameters prior to fabrication. According to simulation results, the device was fabricated and then wirelessly measured using the network analyzer. The measured reflective coefficient $S_{11}$ in the time domain showed high signal/noise (S/N) ratio, small signal attenuation, and few spurious peaks. In the $CO_2$ and humidity testing, high sensitivity ($2^{\circ}/ppm$ for $CO_2$ detection and $7.45^{\circ}/%$RH for humidity sensing), good linearity and repeatability were observed in the $CO_2$ concentration ranges of $75{\sim}375ppm$ and humidity levels of $20{\sim}80%$RH. Temperature and humidity compensations were also investigated during the sensitivity evaluation process.

• Korean Journal of Optics and Photonics
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• v.14 no.3
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• pp.312-320
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• 2003

The basic mechanistic aspects of the interaction and practical considerations related to polymer ablation were briefly reviewed. Photochemical and photothermal effects, which highly depend on laser wavelength have close correlation with each other. In this study, multi-scanning laser ablation processing of polymer with a DPSS (Diode Pumped Solid State) 3rd harmonic Nd:YVO$_4$ laser (355 nm) was developed to fabricate a three-dimensional micro shape. Polymer fabrication using DPSSL has some advantages compared with the conventional polymer ablation process using KrF and ArF laser with 248 nm and 193 nm wavelength. These advantages include pumping efficiency and low maintenance cost. And this method also makes it possible to fabricate 2D patterns or 3D shapes rapidly and cheaply because CAD/CAM software and precision stages are used without complex projection mask techniques. Photomachinability of polymer is highly influenced by laser wavelength and by the polymer's own chemical structure. So the optical characteristics of polymers for a 355 nm laser source is investigated experimentally and theoretically. The photophysical and photochemical parameters such as laser fluence, focusing position, and ambient gas were considered to reduce the plume effect which re-deposits debris on the surface of substrate. These phenomena affect the surface roughness and even induce delamination around the ablation site. Thus, the process parameters were tuned to optimize for gaining precision surface shape and quality. This maskless direct photomachining technology using DPSSL could be expected to manufacture tile prototype of micro devices and molds for the laser-LIGA process.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.9-14
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• 2022

Silica aerogel is a porous material with a very low density and high specific surface area. Still, its application is limited due to its weak mechanical properties due to structural features. To solve this problem, a method of complexing it with various polymers has been proposed. We synthesized polyimide cross-linked silica aerogel by the sol-gel process to obtain high mechanical properties. Tetraethyl orthosilicate (TEOS) was used as a precursor to make silica aerogel, and 3- aminopropyltriethoxysilane (APTES) was used as a coupling agent for cross-linking polyimide. Polyimide was synthesized using pyromellitic dianhydride and 3,5-diaminobenzoic acid, and mechanical properties were improved by crosslinking polyimide with 10 repeating units in the polyimide chain using the reaction formula ${\frac{n_1}{n_2}}={\frac{n}{n+1}}$ To realize silica aerogel, polyimide having various weight ratios was added before gelation, resulting in a 19-fold or greater increase in maximum compressive strength compared to pure silica aerogel. From this study, an enhancement of silica aerogel could be enhanced through polymer cross-linking bonds.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.61-68
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• 2023

In this study, Sn-3.5Ag-15.0Fe composite solder was manufactured and applied to TLP bonding to change the entire joint into a Sn-Fe IMC(intermetallic compound), thereby applying it as a high-temperature solder. The FeSn₂ IMC formed during the bonding process has a high melting point of 513℃, so it can be stably applied to power modules for power semiconductors where the temperature rises up to 280℃ during use. As a result of applying ENIG surface treatment to both the chip and substrate, a multi-layer IMC structure of Ni₃Sn₄/FeSn₂/Ni₃Sn₄ was formed at the joint. During the shear test, the fracture path showed that cracks developed at the Ni₃Sn₄/FeSn₂ interface and then propagated into FeSn₂. After 2hours of the TLP joining process, a shear strength of over 30 MPa was obtained, and in particular, there was no decrease in strength at all even in a shear test at 200℃. The results of this study can be expected to lead to materials and processes that can be applied to power modules for electric vehicles, which are being actively researched recently.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.685-688
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• 2008

Planar antennas are very efficient for the use of the out-door data transmission applications due to their low-profile characteristics. But the size of the antenna in UHF band blocks the practical usage. In this paper, a miniaturized planar antenna is investigated for the application of AMR system in UHF band. The designed antenna is fabricated in the form of the microstrip patch on the FR-4 substrate. The miniaturization is achieved by slot-loading on the patch. First, effects of simple slots on the size reduction are analyzed, followed by the design using more complex slots resulting in the reduction ratio of 37.9% in 425.6 MHz and bandwidth of 3.8 MHz. The effect of epoxy coating for the protection is also investigated.