• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.2026-2028
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• 2002

본 논문에서는 실리콘 기판상의 전송선로 특성을 개선하기 위하여 표면 마이크로머시닝 기술을 이용하여 $10{\mu}m$ 두께의 다공질 실리콘 산화막으로 제조된 기판 위에 에어브리지를 가진 CPW 전송선로와 phase shifter를 제작하였다. 간격이 $30{\mu}m$, 신호선이 $80{\mu}m$인 CPW 에어브리지 전송선의 삽입손실은 4 GHz에서 -0.25 dB이며, 반사손실은 -28.9 dB를 나타내었다. CPW phase shifter의 크기는 S-W-$S_g$ = 100-30-400 ${\mu}m$로 설계되었다. "ㄷ" 모양을 가진 에어브리지의 폭은 $100{\mu}m$. 길이는 400-460-400 ${\mu}m$이다. 낮은 손실을 얻기 위한 Step된 에어브리지를 가진 phase shifter 구조가 step이 없는 에어브리지를 가진 구조보다 삽입손실이 보다 더 향상되었다. 제작된 CPW phase shifter의 위상특성은 28 GHz의 넓은 주파수 범위에서 $180^{\circ}E 의 천이를 타나내었다. 이상과 같은 결과로부터 두꺼운 다공질 실리콘은 고 저항 실리콘 집적회로 공정에서 고성능 저가의 마이크로파 및 밀리미터파 회로 응용에 충분히 활용 될 수 있으리라 기대된다.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.21 no.2
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• pp.49-56
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• 1995

Chitosan microcapsules and microbeads were prepared by W/O emulsion method, and their morphologies were observed through SEM. The microcapsules have skin layer of 8 Um and 250 Um of mean diameter, The swelling test showed higher s welling ability in protic solvents than in aphotic solvents. After containing moth-yl violet in the microcapsules, the release patterns were investigated. The results sho wed that the addition of Iysozyme in pH 5.1 acetate buffer accelerated the re-lease rate. In case of the microbeads, the mean diameter was about 70 Um. The surface of the microbeads showed porous structures. The swelling ability of the beads revealed two times higher than the one of the microcapsules.

• Polymer(Korea)
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• v.39 no.1
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• pp.40-45
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• 2015

Simple poor-cosolvent casting was used to surface treat biodegradable elastic poly(L-lactide-co-${\varepsilon}$-caprolactone) (PLCL; 50:50) copolymer films that presented lotus-leaf-like structures. We evaluated whether the lotus-leaflike-structured PLCL (L-PLCL) films could be used as a biomaterial for artificial vascular grafts. The surface morphology, hydrophobicity, and antithrombotic efficiency of the films were examined while immersed in platelet-rich plasma (PRP) using scanning electron microscopy (SEM) and a contact angle meter. The recovery and crystallinity of the films were measured using a tensile-strength testing machine and an X-ray diffractometer, respectively. The solvent containing acetic acid, as a poor co-solvent, and methylene chloride mixed in a 1:2 ratio produced an optimal PLCL film with a water contact angle of approximately $124^{\circ}$. Furthermore, the surface of the L-PLCL films immersed in PRP showed a lower rate of platelet adhesion (<10%) than that of the surface of an untreated PLCL film immersed in PRP.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.35-50
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• 2012

$900^{\circ}C$이상 초고온 He-gas 분위기 또는 용융불화염 (molten salts, FLINAK) 환경에서 사용될 VHTR(Very High Temperature Reactor)의 IHX(Intermediate heat exchanger)용 열수송 구조재료로 가장 가능성이 높은 합금인 Inconel 617 및 Hastelloy X 상에 습식화학적, 물리적기상합성법(Vacuum arc-plasma과 RF magnetron sputtering) 및 pack cementation에 의한 표면개질 및 마이크로 초내열(refractory ceramics) 코팅층(TiN, TiCN, TiAlN, $Al_2O_3$, $TiO_2$)을 형성시켰다. 고온 장기사용 시 문제가 될 수 있는 고온에서의 조직변화, 미세구조와 상(phase)형성, 고온 부식 및 그에 따른 마모(wear resistance) 손상 등 이들 소재의 내열, 내식 및 내마모 물성을 개선하는 연구를 수행하였다. TiAlN 박막의 경우 공기분위기에서 N이 분해되나 치밀한 산화물($TiO_2/Al_2O_3$ layer)을 형성하여 내식성 있는 보호피막을 형성함으로 기판과의 열팽창 계수로 인한 박리가 발생하지 않아 보호피막으로 적합하였다. Pack cementation법에 의한 aluminiding(Al-Ni합금)도 He 및 공기분위기에서 고온물성의 저하를 가져오는 $Cr_2O_3$의 생성을 충분히 억제하고 있었으며 He 및 air 분위기에서 사용이 가능한 박막으로 여겨진다. 내열 및 내식성에 대한 실험을 종합한 결과, 공기분위기에서 사용할 수 없는 박막은 He-gas 및 FLINAK(LiF-NaF-KF) 용융염 분위기에서도 사용할 수 없었으며, He-gas, FLINAK 및 air 분위기에서 모두 사용이 가능한 박막으로는 Inconel 617에서는 $(TiO_2-)Al_2O_3$, TiAlN 및 Al-Ni이었고 Hastelloy에서는 Al-Ni 및 $Al_2O_3$가 가장 적당하였다.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.11-15
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• 2018

In this study, we deposited silver nanoparticles on the nanocone array structure which was fabricated by the UV nanoimprint process for optical signal amplification. The deposition of the silver nanoparticles was based on the evaporation behavior of the solution droplet according to wettability of surface and the deposition pattern changed from the center of the droplet to the edge depending on the difference of thermal energy. The optical property of silver nanoparticles that were deposited on imprinted nanohole patterns was simulated by the Finite difference time domain (FDTD) analysis method, and it was confirmed that energy was concentrated around the silver nanoparticle of the finally fabricated structure.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.195-200
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• 2000

In order to find a residual stress in the micro-machined beam, first natural frequency of the beam that has the residual stress inside is analyzed using the Rayleigh's energy method. Micro gold electroplated structure is fabricated by surface micro-machining process. The made structure is clamped-clamped beam and its 1st natural frequency is measured by resonance method. For the better estimation of the residual stress, an equivalent length of micro-machined beam to ideal beam is calculated by FEM. The residual stress is estimated from the equivalent length and the measured natural frequency.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.287-287
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• 2010

휴대용 기기의 사용이 증가하면서 배터리의 고용량화와 소형화가 요구되고 있다. 특히 내시경 캡슐과 같은 의료용 센서 기기에서는 소형화가 매우 중요하며 인체에 해로운 액체전해질이 들어가지 않는 것이 바람직하다. 최근 무선센서, RFID 태그, 스마트 카드 등을 위하여 고체전해질을 사용하는 박막 마이크로 배터리가 개발되고 있으나, 에너지 저장용량이 작아 응용분야가 제한적이다. Si wafer 위에 형성된 고단차의 3차원 구조 위에 박막 배터리를 형성한다면 표면적 증가에 의해 에너지 저장용량 역시 크게 증가할 것이며, Si 기반의 반도체, 디스플레이, 태양전지 등과 쉽게 집적이 가능할 것이다. 본 연구에서는 펄스 레이저 증착법(Pulsed Laser Deposition)으로 리튬 배터리의 cathode 물질인 $LiCoO_2$를 박막으로 제조하고 그 특성을 연구하였다. 펄스 레이저 증착법은 저온 증착이 가능하고 타겟 물질과 같은 조성의 박막을 증착하는 것이 용이한 장점이 있다. Pt, TiN 등의 기판 위에 $LiCoO_2$ 박막을 증착하고 증착 온도와 산소($O_2$) 분압이 박막의 조성, 미세구조, 결정성, 그리고 전하저장용량에 미치는 영향을 고찰하였다.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.77-82
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• 2012

In this paper, the research of IC embedded PCB process is carried out. For embedding chips into PCB, solder-balls on chips were etched out and ABF(Ajinomoto Build-ip Film), prepreg and Cu foil was laminated on that to fabricate 6 layer build-up board. The chip of which solder ball was removed was successfully interconnected with PCB by laser drilling and Cu plating. However, de-lamination phenomenon occurred between chip surface and ABF during reflow and thermal shock. To solve this problem, de-smear and plasma treatment was applied to PI(polyimide) passivation layer on chip surface to improve the surface roughness. The properties of chip surface(PI) was investigated in terms of AFM(Atomic Force Micrometer), SEM and XPS (X-ray Photoelectron Spectroscopy). As results, nano-size anchor was evenly formed on PI surface when plasma treatment was combined with de-smear(NaOH+KMnO4) process and it improved thermal shock reliability ($260^{\circ}C$-10sec solder floating).

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.25-29
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• 2001

This study examined the effects of carbon surface modification by the epoxy resin coating on the electrochemical performance. The mesocarbon microbeads(MCMB) carbon was surface-modified by coating the epoxy resin and its electrochemical properties as an anode was examined. The surface coating of MCMB was carried out by refluxing the MCMB powders in a dilute H2SO4 solution, and mixing them with the epoxy resin-dissolved tetrahydrofuran(THF) solution. Under heat-treatment of the coated MCMB at the temperature over $1000^{\circ}C$, the epoxy-resin coating layer was converted into amorphous phase which was identified by a high resolution transmission electron microscope (HRTEM). The epoxy resin coated MCMB has higher Brunauer-Emmett-Teller (BET) surface area, higher charge/ discharge capacity and better cycleability than a raw MCMB without coating. The reason for the enhancement of cell performance by the epoxy resin coating were considered as the epoxy resin coating layer plays an important role to be a barrier for carbon reacting with electrolyte and to retard the formation of passivation layer.