• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2011.03a
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• pp.71-71
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• 2011

전류를 흘렸을 때 양극과 음극에 따라 움직이는 미세한 나노입자를 이용하여 색, 글자, 그림 등을 표시하는 응용디스플레이 기술이 전기영동디스플레이(electrophoretic display)이다. 최근 전자종이 등 상품화가 진행되면서 전기영동디스플레이에 대한 관심증대와 함께 기술개발이 지속적으로 진행되고 있다. 본 연구에서는 분산중합을 이용하여 $TiO_2$ core 입자에 polystyrene을 shell로 코팅하여 마이크로캡슐형의 전기영동디스플레이에 적합한 입자를 제조하고 성능을 분석하였다. 먼저 분산제의 종류, 모노머의 농도, 개시제의 농도에 따라 제조된 대전복합입자의 크기 및 분포를 보면, 분산제의 종류를 달리 하였을때를 제외하고 대체로 균일하였다. 입경의 변화를 보면, 약 200-300nm의 $TiO_2$가 개질에 의해 400-500nm의 입경을 나타내는 것으로부터 200nm 두께의 shell층을 갖는다는 것을 확인 할 수 있었다. 또한 분산제의 종류에 따라서는 분산제를 사용하지 않는 경우가 오히려 제조된 입자의 분포가 균일함을 알 수 있었고 모노머의 농도에 따른 변화는 볼 수 없었으며 입경분포가 균일한 입자가 제조되었음을 알 수 있었다. 대전복합입자의 TGA 곡선으로부터 $300^{\circ}C$ 부근에서 polystrene shell에 의한 분해를 볼 수 있었고 $600^{\circ}C$ 이후에 잔류된 core의 $TiO_2$ 입자를 확인 할 수 있었다. 이 결과로부터 $TiO_2$ core-polystyrene shell형의 전자 종이용 대전복합입자의 제조를 확인 할 수 있었다. 또한 제조된 대전복합입자의 zeta potential을 보면, (+)전하를 띄며 64.8mV의 비교적 높은 zeta potential을 가지는 것을 확인 할 수 있었다. 그리고 $TiO_2$ 대전복합입자와 같은 방법으로 제조된 흑색 대전복합입자를 혼합하여 cell test를 측정한 결과, cell에 ${\pm}$10V의 저전압을 가했을 때에도 비교적 응답속도가 빠른 입자의 구동현상을 확인 할 수 있었다.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.7
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• pp.233-240
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• 2003

Recently, the world are preparing for new revolution, called as If (Information Technology), NT (Nano-Technology), and BT (Bio-Technology). NT can be applied to various fields such as semiconductor-micro technology. Ultra precision processing is required for NT in the field of mechanical engineering. Recently, together with radical advancement of electronic and photonics industry, necessity of ultra precision processing is on the increase for the manufacture of various kernel parts. Therefore, in this paper, stability of ultra precision cutting unit is investigated, this unit is the kernel unit in ultra precision processing machine. According to alteration of shape and material about hinge, stability investigation is performed. In this paper, hinge shapes of micro stage in UPCU(Ultra Precision Cutting Unit) are designed as two types, where, hinge shapes are composed of round and rectangularity. Elasticity and strength are analyzed about micro stage, according to hinge shapes, by FE analysis. Micro stage in ultra precision processing machine has to keep hinge shape under cutting condition with 3-component force (cutting component, axial component, radial component) and to reduce modification against cutting force. Then we investigated its elasticity and its strength against these conditions. Material of micro stage is generally used to duralumin with small thermal deformation. But, stability of micro stage is investigated, according to elasticity and strength due to various materials, by FE analysis. Where, Used materials are composed of aluminum of low strength and cooper of medium strength and spring steel of high strength. Through this stability investigation, trial and error is reduced in design and manufacture, at the same time, we are accumulated foundation data for unit control.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.351-354
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• 2004

This work presents a simple and cost-effective approach for maskless fabrication of positive-tone silicon master for the replica molding of hyperfine elastomeric channel. Positive-tone silicon masters were fabricated by a maskless fabrication technique using the combination of nanoscratch by Nanoindenter ⓡ XP and XOH wet etching. Grooves were machined on a silicon surface coated with native oxide by ductile-regime nanoscratch, and they were etched in a 20 wt％ KOH solution. After the KOH etching process, positive-tone structures resulted because of the etch-mask effect of the amorphous oxide layer generated by nanoscratch. The size and shape of the positive-tone structures were controlled by varying the etching time (5, 15, 18, 20, 25, 30 min) and the normal loads (1, 5 mN) during nanoscratch. Moreover, the effects of the Berkovich tip alignment (0, 45$^{\circ}$) on the deformation behavior and etching characteristic of silicon material were investigated.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.173-178
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• 2003

Recently, according to the development of mechatronics industry that was composed of NT, ST, IT, RT and etc, the 1 necessity of nano-parts was increased. Because of the necessity, this research was started for improving work precision of the parts as fixing UPCU( Ultra Precision Cutting Unit)on lathe. So, in this research we executed the modeling of UPCU (Ultra Precision Cutting Unit) by the application of PZT, the relationship between the displacement of tool in UPCU and the cutting force of it has been in take a triangular position in the case of plane cutting. The modeling of system that is containing the fine displacement was performed. Also, we found like to find the optimal cutting condition through the simulation of relationship between the displacement and the cutting force.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.10
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• pp.1189-1193
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• 2012

The Miniaturized Fingerprint Imager (MFI) is a slim optical mouse that can be used as an input device for application to wireless portable personnel communication devices such as smartphones. In this study, we have fabricated key optical components of an MFI, including the illumination optical components and imaging lens. An LED beam-shaping lens consisting of an aspheric lens and a Fresnel facet was successfully machined using a diamond turning machine (DTM). A customized V-shaped groove for beam path banding was fabricated by the bulk micromachining of silicon that was coated with aluminum using the shadow effect in thermal evaporation. The imaging lens and arrayed multilevel Fresnel lenses were fabricated by electron beam lithography and FAB etching, respectively. The proposed optical components are extremely compact and have high optical efficiency; therefore, they are applicable to ultraslim optical systems.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.1-12
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• 2021

Here, we introduce a laser-induced graphene synthesis technology and its applications for the electric/electronic device manufacturing process. Recently, the micro/nanopatterning technique of graphene has received great attention for the utilization of these new graphene structures, which shows progress developments at present with a variety of uses in electronic devices. Some examples of practical applications suggested a great potential for the tunable graphene synthetic manners through the control of the laser set-up, such as a selection of the wavelength, power adjustment, and optical techniques. This emerging technology has expandability to electric/electronic devices combined together with existed micro-packaging technology and can be integrated with the new processing steps to be applied for the operation in the fields of biosensors, supercapacitors, electrochemical sensors, etc. We believe that the laser-induced graphene technology introduced in this paper can be easily applied to portable small electronic devices and wearable electronics in the near future.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.7
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• pp.4388-4397
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• 2015

The purpose of this study was to research the property change of acrylic resins depending on the induced-beam change and research the improved physical property of dry-heat and microwave-cured dental place acrylic resin in order to develop the acrylic resins with the optimum characteristic. As a result of observing flexural rigidity, hardness and color difference, the dry-heat-cured specimens of Vertex RS and Paladent 20 showed ideal property at 5, 15, and 25 kGy irradiation. The microwave-cured specimens of Vertex RS and Paladent 20 showed ideal property at 5 kGy irradiation. The correlation analysis showed a positive correlation among ARD, flexural rigidity (0 418), E coefficient (0.675) and Barcol hardness (0 588). The radiation cure technology is helpful for relieving the contamination caused by the manufacture of polymer composite. It can significantly contribute to the fusion of ultra violet cure technology and nano technology and the improvement of mechanical property without giving effect to the workability of polymer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.12
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• pp.119-127
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• 2007

Recently, microstructures fabricated using microstereolithography technology have been used in the biological, medical and mechanical fields. Microstereolithography can fabricate real 3D microstructures with fine features, although there is presently a limited number of materials available for use in the process. Deformation of the fine features on a fabricated microstructure remains a critical issue for successful part fabrication, and part deformation can occur during rinsing or during fabrication as a result of fluid flow forces that occur during movement of mechanical parts of the system. Deformation can result in failure to fabricate a particular feature by breaking the feature completely, spatial deflection of the feature, or attaching the feature to neighboring microstructures. To improve mechanical strength of fabricated microstructures, a clay nanocomposite can be used. In particular, a high-aspect ratio microstructure can be fabricated without distortion using photocurable liquid resin containing a clay nanocomposite. In this paper, a clay nanocomposite was blended with a photocurable liquid resin to solve the deformation problem that occurs during fabrication and rinsing. An optimal mixture ratio of a clay nanocomposite was found through tensile testing and the minimal allowable distance between microstructures was found through fabrication experimentation. Finally, using these results, high-aspect ratio microstructures were fabricated using a clay nanocomposite resin without distortion.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.