• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• 제10권7호
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• pp.1138-1147
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• 1999

In this paper, two types of $2\times2$ Rx/Tx microstrip patch antenna are proposed to implement Ku-band satellite communications. The single-fed dual resonance patch antenna as the first type derives perpendicular polarizations at two resonant frequencies from a single patch radiator, using aperture coupling via a bended single-feeding line and a cross-shaped slot. The double-fed dual resonance patch antenna as the second type implements dual resonance with mutually orthogonal polarizations by mixing the two feeding mechanisms of the microstrip line and the aperture coupling. Especially, in the double-fed dual resonance antenna case, air-gap is introduced to broaden the bandwidth. Through measurement, each of the two types of antenna was verified to function properly both Rx and Tx. The double-fed dual resonance antenna shows excellent performance in the bandwidth and the crosspolarization characteristics.

• The Journal of Korean Institute of Communications and Information Sciences
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• 제18권4호
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• pp.549-560
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• 1993

A simple closed form approximation is developed by a new approach presented in this paper for the microstrip surface dyadic Green's function which arises in the problem of an electric current point source on an infinite planar grounded dielectric substrate. This closed form approximation includes the effects of the space wave, the surface wave and their coupling within the transition region near the source, and remains accurate as near as $0.1{\pi}_1$ from the source point for a substrate thickness as large as $0.04{\pi}_1$, where, ${\pi}_1$, is the free space wavelength, This result can significantly facilitate the rigorous moment method analysis of microstrip antenna arrays on relatively this substrates of practical interest. Numerical results illustrating the accuracy of the closed form approximation are presented and CPU times associated with some mutual impedance calculations are also included.

• Journal of Practical Engineering Education
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• 제6권2호
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• pp.105-110
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• 2014

In this work, mechanical characteristics of titanium diaphragm have been studied as a potential robust substrate and a diaphragm material for automotive tire pressure sensor. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on titanium diaphragm have been designed, fabricated and characterized. The fabrication process for micromachined titanium devices keeps the membrane and substrate being at the environment of 20 MPa pressure and $200^{\circ}C$ for a half hour and then subsequently cooled to $24^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated titanium film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the fabricated device is $9.45ppm\;kPa^{-1}$ with a net capacitance change of 0.18 pF over a range 0-210 kPa.

• Journal of the Microelectronics and Packaging Society
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• 제29권4호
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• pp.55-61
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• 2022

There is a major interest in diagnostic technology for multiple cancers worldwide. In order to reduce the difficulty of cancer diagnosis, a liquid biopsy technology based on a microfluidic device using trace amounts of biofluids such as blood is being studied. And optical biosensing, which measures the concentration of analytes through fluorescence imaging using biofluids, requires various strategies to improve sensitivity, and specialists and equipment are needed to carry out these strategies. This leads to an increase in diagnostic and production costs, and it is necessary to develop a technology to solve this problem. In this paper, we design and propose a fluorescent multi-cancer diagnostic sensing platform structure that implements passive self-separation technology and molecular recognition activation functions by fluid mixing, only with the geometry and microfluidic phenomena of microchannels based on self-driven flow by capillary force. In order to check the parameters affecting the performance of the plasma separation part of the designed sensor, the hydrodynamic diameter of the channel and the viscosity of the fluid were set as variables to confirm the formation of plasma separation flow through simulation. And finally, we propose an optimal sensor platform structure.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.162-162
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• 1999

초고주파 집적회로의 핵심소자로 각광을 받고 있는 GaAs MESFET(MEtal-emiconductor)은 게이트 형성 공정이 가장 중요하며, WNx 내화금속을 이용한 planar 게이트 구조의 경우 임계전압(Vth:threshold voltage)의 균일도가 우수할 뿐만 아니라 특히 Side-wall을 이용한 self-align 게이트는 소오스 저항을 줄일 수 있어 고성능의 소자 제작을 가능하게 한다.(1) 본 연구의 핵심이 되는 Side-wall을 형성하기 위하여 PECVD법에 의한 SiOx 박막을 증착하고, 건식식각법을 이용하여 SiOx side-wall을 형성하였다. 이 공정을 이용하여 소오스 저항이 낮고 임계전압의 균일도가 우수한 고성능의 self-aligned gate MESFET을 제작하였다. 3inch GaAs 기판상에 이온주입법에 의한 채널 형성, d.c. 스퍼터링법에 의한 WNx 증착, PECVD법에 의한 SiOx 증착, MERIE(Magnetic Enhanced Reactive Ion Etcing)에 의한 Side-wall 형성, LDD(Lightly Doped Drain)와 N+ 이온주입, 그리고 RTA(Rapid Thermal Annealing)를 사용하여 활성화 공정을 수행하였다. 채널은 40keV, 4312/cm2로, LDD는 50keV, 8e12/cm2로 이온주입하였고, 4000A의 SiOx를 증착한 후 2500A의 Side-wall을 형성하였다. 옴익 접촉은 AuGe/Ni/Au 합금을 이용하였고, 소자의 최종 Passivation은 SiNx 박막을 이용하였다. 제작된 소자의 전기적 특성은 hp4145B parameter analyzer를 이용한 전압-전류 측정을 통하여 평가하였다. Side-wall 형성은 0.3$\mu\textrm{m}$ 이상의 패턴크기에서 수직으로 잘 형성되었고, 본 연궁에서는 게이트 길이가 0.5$\mu\textrm{m}$인 MESFET을 제작하였다. d.c. 특성 측정 결과 Vds=2.0V에서 임계전압은 -0.78V, 트랜스컨덕턴스는 354mS/mm, 그리고 포화전류는 171mA/mm로 평가되었다. 특히 본 연구에서 개발된 트랜지스터의 게이트 전압 변화에 따른 균일한 트랜스 컨덕턴스의 특성은 RF 소자로 사용할 때 마이크로 웨이브의 왜곡특성을 없애주기 때문에 균일한 신호의 전달을 가능하게 한다. 0.5$\mu\textrm{m}$$\times$100$\mu\textrm{m}$ 게이트 MESFET을 이용한 S-parameter 측정과 Curve fitting 으로부터 차단주파수 fT는 40GHz 이상으로 평가되었고, 특히 균일한 트랜스컨덕턴스의 경향과 함께 차단주파수 역시 게이트 바이어스, 즉 소오스-드레스인 전류의 변화에 따라 균일한 값을 보였다. 본 연구에서 개발된 Side-wall 공정은 게이트 길이가 0.3$\mu\textrm{m}$까지 작은 경우에도 사용가능하며, WNx self-align gate MEESFET은 낮은 소오스저항, 균일한 임계전압 특성, 그리고 높고 균일한 트랜스 컨덕턴스 특성으로 HHP(Hend-Held Phone) 및 PCS(Personal communication System)와 같은 이동 통신용 단말기의 MMICs(Monolithic Microwave Integrates Circuits)의 제작에 활용될 것으로 기대된다.

• Journal of the Microelectronics and Packaging Society
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• 제31권2호
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• pp.69-77
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• 2024

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

• Proceedings of the KIEE Conference
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• 대한전기학회 2001년도 추계학술대회 논문집 전기물성,응용부문
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• pp.35-37
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• 2001

다층 인쇄 회로 기판에 Combline 구조를 가진 스트립 라인 또는 마이크로 스트립 라인 대역통과 필터를 구현하였다. 저 비용 구현과 이동성과 휴대성을 강조하기 위해 기존의 세라믹 대신 FR4 와 에폭시를 기반으로 하는 다층 회로 기판의 도체 층에 집적화하였다. Combline 각 끝단에 커패시터를 부하 함으로써 전기적 길이를 화장하였고 전체적인 크기를 감소시킴으로서 적당한 필터 특성을 얻을 수 있었다. 구현된 필터는 마이크로파 대역에서 사용 가능하며 특히 Bluetooth나 Wireless LAN 과 같은 ISM 대역을 사용하는 무선통신소자로서 사용 가능하다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• 제44권12호
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• pp.37-42
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• 2007

Clock grid networks are now common in most high performance microprocessors. This paper presents a new effective modeling and simulation methodology for the clock grid using scattering parameter. It also shows the effect of wire width and grid size on the clock skew of the grid. The interconnection of the clock grid is modeled by RC passive elements. The results show that the error is within 10 % comparing to Hspice simulation results.

• The Magazine of the IEIE
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• 제28권3호
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• pp.97-108
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• 2001

본 논문은 미래의 산업 전반에 걸쳐 엄청난 변화를 촉진시킬 것으로 예상되는 MEMS 기술의 군사응용분야에 대하여 기술하고 있다. 여기에서 정의하는 MEMS 기술은 센서와 액츄에이터로 대변되는 마이크로 소자를 제작하는 기술과 이를 이용한 소형 시스템 기술을 모두 포함하며 이를 이용한 소형 시스템 기술을 모두 포함하며 매우 다양하고 광범위한 측면에 대한 이해를 필요로 한다. 이러한 배경을 바탕으로 국내의 MEMS 기술의 현황과 발전추세를 파악하고 군사응용을 위한 MEMS 기술을 관성측정, 감지 및 구동, 정보통신, 추진 및 전원 분야 등 네 가지로 분류하였으며 이를 이용하여 개발할 수 있는 핵심적인 소형 무기체계들을 소개하였다. 결론으로는 민수분야의 기술과 인프라를 바런시켜야 할 필요성을 지적하고 국내 현실에 적합한 국사용 MEMS 기술 발전 방안을 제시하였다.

• Proceedings of the IEEK Conference
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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• pp.115-118
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• 2000

Uncooled pyroelectric infrared detectors based on BST(B $a_{-x}$S $r_{x}$Ti $O_3$) thin films have been fabricated by RF magnetron sputtering and surface Micromachining technology. The detectors form BST thin film ferroelectric capacitors grown by RF magnetron sputtering on N/O/N(S $i_3$ $N_4$/ $SiO_2$/S $i_3$ $N_4$) membrane. The sputtered BST thin film exhibits highly c-axis oriented crystal structure that no poling treatment for sensing applications is required. This is an essential factor to increase the yield for realization of an infrared image sensor. surface-Micromachining technology is used to lower the thermal mass of the detector by giving maximum sensor efficiency Gold-black is evaporated on top of the sensing elements used the thermal evaporator. fabricated uncooled pyroelectric infrared detectors is highly output voltage at the low temperature(1$^{\circ}C$).).).