• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.5
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• pp.39-49
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• 2013

The effect of the finite substrate size on the radiation characteristics of H-plane linear microstrip array antennas is investigated. The radiation characteristics versus scan angle are systematically analyzed for 5-element H-plane linear array antennas with various substrate sizes and element spacings for the substrates with different dielectric constants. The distance between the antenna center and the substrate edge on the E-plane for the enhancement of the radiation characteristics of the array antenna is presented.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.353-353
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• 2008

트랜지스터 속도는 현저하게 향상되어지는 반면에 RFICs(RF integrated circuits)는 대용량화, 고속화, 고집적화, 소형화, 고 효율화 온칩(on-chip) 수동소자의 부재에 의해 발전을 이루지 못하였다. 즉, 최근 전자기기의 집적화, 초소형화 됨에 따라 실장 밀도를 높이기 위해 부품의 소형화가 강하게 요구되는 동시에 Radio Frequency(RF)에서 이용가능한 수동소자인 capacitor를 개발하고자 본 논문에서는 손가락 모양(interdigital configuration)을 갖는 RF capacitor를 Ansoft사의 HFSS를 이용하여 이상적인 S-parameter, 정전용랑(capacitance), 손실계수(loss tangent)를 도출하고자 한다. 680um의 $Al_2O_3$ 기판에 BST doped MgO을 30um, Chromium과 gold를 각각 5um로 증착시켰다. 핑거 개수 (n, number), 핑거 길이(1, length), 핑거 간격(g, gap), 핑거 너비(w, width)를 변화 시켜가면서 이상적인 결과 값에 가까운 모양 (interdigital configuration)을 얻을 수 있었다. 핑거 수 3 개 일 때 입력 값에 대하여 손실 없는 출력 값(투과값)을 갖는 $S_{21}$이 1.5GHz에서 6dB이하로 떨어졌으며 핑거 간격이 줄고 핑거 너비가 커지고 핑거길이가 커질수록 높은 캐패시턴스 값을 갖는 것을 확인 할 수 있었다.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.37 no.3
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• pp.58-63
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• 2000

For the microwave high density devices and modules of the 3D configuration, we proposed radial stub for the ground connection. The proposed structure is analyzed by the full-wave analysis of finite element method (FEM) and characterized experimentally. The results show that the return loss is more than 15 dB and the insertion loss is less than 0.5 dB in the frequency range from 2.5 GHz to 6.3 GHz. The proposed grounding scheme will be useful for the ground connection lot the microwave high density devices and module of 3D configuration.

• The Transactions of the Korean Institute of Power Electronics
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• v.10 no.1
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• pp.70-77
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• 2005

A new converter to transfer energy from a low-voltage AC current source to a battery is proposed. It is focused to find operational modes of the converter. The low-voltage AC current source is an equivalent of the piezoelectric generator, which converts the mechanical energy to the electric energy. The converter consists of a full-bridge MOSFET rectifier and a MOSFET boost converter in order to make the converter small and efficient. The operational principle and modes of the converter are investigated with the consideration of effects of the parasitic capacitances of MOSFETs and diode. The results are proved with simulation studies using PSIM and Pspice.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.5
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• pp.84-90
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• 2004

A prediction of SEE rates for a candidate microprocessor is made based on the ground experiment results with a proton accelerator. Populations of charged particles in space are estimated with numerical models such as AP8, JPL91 and CREME. The cross section curves that are previously obtained with the accelerator are then employed for SEE prediction. Both the high and low inclinations are considered for low-earth orbits with nominal altitudes of about 685km. The results show that the occurrence rate of SEEs for the candidate device is acceptable for low-inclinations, but can be considerable under worst conditions for high inclinations.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.1
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• pp.1-10
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• 2016

Nowadays, the importance of role of the international standardization keeps increasing substantially. We have already known that international standards have a huge impact on many companies, industries and nations. So far, it has been thought that standardizations are needed after the new products come into the market and are mass-produced in order to encourage the use of the products, systems and services. Standardization will make the products more safe, efficient, and environmentally friendly for the users. However, in these days, a paradigm of the standardization has been changed. International standard becomes a tool for dominating global market and is the most important ingredients of the competitiveness and economic progress of the nation and enterprises. Many countries like Japan, Germany and U.S. use the standardization as an effective method to dominate the market and monopolized the new technologies. Therefore, worldwide competition for the standardization of the new technology become fierce. Korea is leading the technology in semiconductor field. However, activities of international standardization are not sufficient. In order to boost the standardization activities in Korea from industry, academia, and research institute, this paper briefly introduce the international standard organization and some critical issues for next-generation semiconductor memory such as flexible semiconductor, automobile semiconductor and wearable devices.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.9-14
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• 2012

Robust power delivery and distribution are considered one of the major challenges in electronic devices today. As a technology develops (i.e. frequency and complexity, increase and size decreases), both power density and power supply noise increase, and voltage supply margin decreases. In addition, thermal problem is induced due to high power and poor power distribution. Until now most of studies to improve power delivery and distribution have been focused on device circuit or system architecture designs. Interconnect process technologies to resolve power delivery issues have not greatly been explored so far, but recently it becomes of great interest as power increases and voltage specification decreases in a smaller chip size.

• Korean Journal of Optics and Photonics
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• v.17 no.4
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• pp.366-370
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• 2006

An optical microphone incorporating a reflective diaphragm and a fiber-optic head was demonstrated. The diaphragm was made of a micromirror membrane which is suspended by a silicon bar connected to a frame, allowing fer a displacement induced by acoustic waves. A compact, simple optical head was implemented by exploiting a single multimode fiber. For the assembled microphone, the static characteristics were investigated to find the operation point defined as the optimum distance between the head and the diaphragm, and a flat frequency response with a variation of $\sim$2dB for the range of up to 2 kHz was accomplished.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.816-821
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• 2013

This paper proposes the design method of low-cost vector control system for induction motor using the ARM Cortex-M4 microcontroller. This MCU can be used instead of expensive DSP to control the home appliances such as refrigerator, air conditioner, washing machine and so on. This paper explains the major features of Cortex-M4 for motor control and how to realize a vector-controlled inverter using it. The developed system is applied to 3-phase induction motor of 200[W] and experimental results show good performance similar to the system using TMS320F28335 DSP.