• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1643-1644
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• 2006

본 논문에서는 마이크로/나노 다공질 실리콘 기판에 여러 형태의 전극을 형성하여 혈액 중의 요소, 콜레스테롤, AST, ALT 농도를 검출하는 바이오센서를 제각하고, 그 특성을 고찰하였다. 다공질 실리콘에 제작된 전극들은 모두 평면전극에 비해서 높은 감도증가를 나타내었는데, 이것은 다공질 실리콘 구조를 통한 유효전극면적의 증가에 기인하는 것으로 생각된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.343-346
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• 2000

This paper presents the characteristics of low consumption, high-response time hot-film type micro-flowsensors with SOI(Si-on-insulator) and trench structures. Output voltages increased due to increase of heat-loss from sensor to external. Compared with no-trench on the SOI structure, the micro-flowsensors with trench structures have properties of high output voltage and low consume power. Output voltage of micro-flowsensors with SOI and trench structures was 250 mV at $N_2$ flow rate of 2000 sccm/min, heating power of 0.3 W. The response time was about 85 msec when input flow was step-input.

• Journal of the Korean Society of Visualization
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• v.16 no.3
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• pp.35-39
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• 2018

In multiphase systems, surface wettability is one of dominant design parameters to enhance system performance. Since surface wettability can be maximized and minimized with micro-textured surfaces, therefore micro-textured surfaces are widely countered in various research and engineering fields. In this study, for better understanding of micrometer scaled surface wettability, spreading phenomena is experimentally investigated on the hydrophilic micro-textured surfaces. By photolithography and conventional dry etching method, there are prepared the surfaces with uniformly arrayed micro-pillars. The interfacial motions of a water droplet on the test sections are visualized by high speed camera in top view. On the basis of visualization data, it is analyzed the relation between dynamic coefficient and geometrical features on micro-textured surfaces.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.5
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• pp.91-96
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• 2018

The oleophobic property of surfaces modified with micro-post structures are investigated for a range of micro-post diameter ($11-23{\mu}m$) and pitch ($20-40{\mu}m$). The contact angle of an oil droplet on surfaces with various micro-post dimensions was calculated using the Cassie-Baxter model and did not show a good agreement with the measured contact angle. From measurement, the micro-post with diameter of $23{\mu}m$ and pitch of $32{\mu}m$ was found to have the highest contact angle ($134.3^{\circ}$).

• Journal of Advanced Navigation Technology
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• v.4 no.1
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• pp.23-35
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• 2000

In this paper, the design for a PCS base station antenna which is using broadband method by a stacked structure has been studied. The sensitive parameters, such as the parasitic elements, the height of air layer between the upper and lower patch, and the variation of feed point, of the microstrip antenna that has stacked structure in a characteristics variation situation are classified and the characteristics has been investigated through the simulations. A designed antenna has following characters. Impedance bandwidth is Z57.5MHz(VSWR${\leq}$2), horizontal beamwidth is $64.1^{\circ}$, and gain is 14.7dBi. Therefore, it is confirmed the characteristics is good. In this paper, through the designing of a stacked microstrip antenna, we has investigated the availability for Korea PCS base station antenna.

• Journal of Navigation and Port Research
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• v.30 no.5 s.111
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• pp.331-334
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• 2006

In this paper, we designed and fabricated the lowpass filter with the wide stopband characteristics using microp- strip line. Adding the $\lambda_g/4$ open stub at the input and output ports, we developed the L-C ladder type lowpass filter using the open stub which has wide stopband characteristics. In order to reduce the entire size qf this filter, the high impedance microstrip lines were made with the meander structure. The lowpass filter was fabricated with the cutoff frequency 2.3 GHz and its measured frequency responses agree well with the simulation results.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.41-45
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• 2015

RtMLF (Routable Molded Lead Frame) based on molded substrate has been developed to maximize advantages of both leadframe product which has high thermal and electrical performance and laminate product which accommodates more I/O count and keeps fan-in/fan-out design flexibility. Due to its structural features, RtMLF provided excellent thermal and electrical performance which was confirmed with simulation. The RtMLF samples were manufactured and its reliability analysis was done to evaluate the opportunities of the production and application.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.7
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• pp.727-733
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• 2003

In order to realize miniaturized and low-impedance MMIC passive component, a novel microstripline structure employing periodically perforated ground metal was proposed. The novel microstripline structure showed much lower impedance, and shorter guided-wavelength than conventional one. Using the novel microstripline with periodically perforated ground metal, a miniaturized 15 $\Omega$ ratrace was fabricated. The line width of the ratrace was 20 $\mu\textrm{m}$, and the size of it was 0.375 mm$^2$, which is 9.3 % of conventional one. The ratrace exhibited good RF performances from 20 to 30 GHz.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.33-37
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• 2003

The new textured surface epitaxial base(TSEB) cell as a high efficiency Si solar cell was fabricated and its eletro-optical characteristics were investigated. The fabricated device showed the open circuit voltage of 0.62 V, the short circuit current of 40 mA, the fill factor of 0.7, and the efficiency of 16% under the incident light of AM-1 100 mW/$cm^2$. The TSEB cell proposed in this paper has the structural superiority in the fabrication of high efficiency solar cell due to the carrier drift transport in the optical absorption region and the formation of back surface field by $P^-/P^+$ epitaxial base, and the low emitter series resistance by insertion of $n^+$ buried contact.

• Journal of Sensor Science and Technology
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• v.6 no.6
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• pp.430-436
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• 1997

A piezoresistive acceleration sensor for 30 G has been fabricated by silicon micromachining method using SDB(silicon direct bonding) wafer. The structure of the piezoresistive acceleration sensor consists of a seismic square pillar type mass and four beams. This structure was fabricated by reactive ion etching and chemical etching using KOH-etchant. The rectangular square structure is used in order to compensate the deformation of the edges due to underetching. The fabricated sensor showed a linear output voltage-acceleration characteristics and its sensitivity was about $88{\mu}V/V{\cdot}g$ from 0 to 10 G.