• Journal of Marine Bioscience and Biotechnology
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• v.10 no.2
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• pp.83-90
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• 2018

Ultraviolet (UV) radiation causes inflammation and matrix metalloproteinase (MMP) over-expression and extra cellular matrix depletion, leading to skin photo-aging such as wrinkle formation, dryness, and sagging. In this study, we demonstrated that pretreatment with the hexane extract of microalgae protects UVB mediated cell damages. The results of clinical study showed that Microalgal Oil treated group reduced wrinkle and improve elasticity. All these results suggest Microalgal Oil may be useful as new photo-aging cosmetics for protection against UV induced activity.

• Environmental Analysis Health and Toxicology
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• v.15 no.1_2
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• pp.19-29
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• 2000

Acetanilide may be released into the environment through air and wastewater from its production and use sites as an intermediate in the synthesis of pharmaceuticals and dyes. Acetanilide is biodegraded rapidly under aerobic conditions and decomposed by indirect photolysis in the presence of OH radicals. An estimated bioconcentration factor of 4.5 suggests that bioaccumulation in aquatic organisms is low. Ecotoxicological data on acetanilide exist on acute toxicity to fishes of 4 species only. According to the EUSES system, the lowest PNEC (Predicted no effect concentration) in fishes is 0.01 mg/1 and PEC (Predicted environmental concentration) for surface water on a regional scale is 9.1$\times$10$\^$－5/mg/l as the worst case. RCR (Risk characterization ratio) of acetanilide for surface water on a regional scale was estimated as 9.1$\times$10-3, which is safe enough for fishes, RCR on a local basis slightly exceeds the value 1 in water and sediment; that is, 1.3 and 1.6, respectively, which suggests the existence of ecotoxicological risk at the vicinity of the manufacturing site. For the refinement of environmental risk assessment on acetanilide, more data should be collected regarding prolonged fish toxicity, acute toxicity toward daphnia and algae. It is, therefore, recommended that acetanilide should be a candidate for further work to supplement the lacking data until it is proved to be safe in the ecotoxicological aspects.

• Korean Journal of Materials Research
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• v.9 no.9
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• pp.926-931
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• 1999

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.45-54
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• 2000

The effect of electropolishing far stamped leadframe on the removal of the edge burr and residual stress relief was examined. The present study showed that the electropolishing could be used for enhanced surface quality of stamped leadframes. The electropolishing was performed at the condition of 60% phosphoric acid electrolyte, 5 ampere of current and 3 cm electrode gap at $70^{\circ}C$ for 2 minutes for Alloy42 type leadframe, and $50^{\circ}C$ for 1.5 minutes for C-194 type leadframe. The FWHM values from X-ray diffraction showed that residual stress of electropolished leadframe recovered to the level of as-received raw materials and surface roughness measured by using AFM tuned out to be improved by 0.079 $\mu\textrm{m}$ and 0.014 $\mu\textrm{m}$ ($R_{rms}$) far alloy 42 and C-194 type leadframes, respectively. The plated thickness using XRF showed the improved uniformity in thickness variation by 0.4~0.5 $\mu\textrm{m}$ and grain growth, which is favorable for interface adhesion, was also observed from the bake test samples. We could certify dimensional stability of leadframe with inspection by means of 3D-topography and hardness measurements.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.10a
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• pp.681-686
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• 1993

솔리드 모델의 새로운 분야인 복합다양체 모델을 지원하는 자료구조중 Radial-edge 자료구조 Vertex-Based 자료구조, 부분면 자료구조에 대하여, 각각의 위상요소들을 살펴보고 그들의 차이점을 비교 검토하였다. 그 결과 각 자료 구조들은 각각 독특한 장점을 갖고 있음을 알 수 있었다. 즉 Radial-edge 자료구조는 자료의 저장성 및 알고리즘의 복잡성 등에서 무난한 편이며, 부분면 자료구조는 자료 저장공간 측면에서 유리하고, Vertex-based 자료구조는 꼭지점에서의 복합다양체 상황 표현이 가장 명확히 됨을알수 있었다. 이와 같은 복합다양체를 지원하는 자료구조들의 특징과 차이점의 분석을 통하여 복합다양체 모델의 개발을 위한 기초를 마련하였다.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.879-882
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• 1998

본 논문에서는 리드 피치가 15mil인 208핀 QFP칩을 검사하는 고해상도의 비젼 모델 시스템을 개발하였다. 전체적인 하드웨어와 고해상도에 적합한 알고리즘 및 이를 실현하는 프로그램을 개발하였으며, 특히 칩 리드 검출을 위한 새로운 알고리즘을 제안하였다. 본 논문에서는 제안한 방법의 특징은 조명의 간섭에 대해 강하며 검사 속도 및 정밀도가 향상되었다.

• 한국초전도학회:학술대회논문집
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• 2007.07a
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• pp.90-90
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• 2007

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.130-131
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• 2014

자동용접용 솔리드와이어를 위한 치환동도금층 밀착력 향상을 위해 착화제로 Alanine을 사용하였다. 테이프 시험결과 Alanine 첨가에 따라 밀착력이 현저히 증가하였다. 또한 도금층내에 혼입되는 H와 Fe 분석결과 Alanine을 첨가하지 않았을 때 도금층 전체 영역에서 H와 Fe의 검출강도가 높게 나타났으나, Alanine 10g/l추가시 도금층내에서 미량 검출되었다.

• Proceedings of the Korean Information Science Society Conference
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• 2001.10b
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• pp.550-552
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• 2001

본 논문은 3차원 그래픽스 시스템이 기본적으로 제공하는 프리미티브인 면(surface), 솔리드(solid)의 복셀화 및 이들을 결합한 CSG 표현의 복셀화에 대하여 고찰한다. 복셀화는 서피스로 표현된 물체의 빈 내부를 복셀로 표현하여 내부를 태우는 과정이다. 본 방법의 특징은 PC 플랫폼이 제공하는 그래픽스 API인 OpenGL을 이용하여 면, 솔리드 등을 고속으로 복셀화하여 이들을 기본 물체로 하여 불리언연산에 의해서 간단히 새로운 물체를 만들고 볼륨 환경에서 이들을 단일화된 방법으로 렌더링할 수 있는 것이다.

• Proceedings of the Optical Society of Korea Conference
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• 2003.02a
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• pp.256-257
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• 2003

반도체 와이어 본딩(wire-bonding) 조립공정에 사용되는 검사용 현미경 광학계를 설계하였다. 이러한 와이어는 리드프레임에 대해 $\pm$ 1 mm의 단차를 가진다. 이 때 리드프레임은 6배로 관찰하며, 와이어 부분은 2배로 관찰하고자 한다. 그러나 와이어의 단차로 인해 물체거리가 변하게 되며, 일반 광학계로는 배율도 변하게 된다. 물체거리가 변해도 동일한 배율을 가지는 광학계를 설계하기 위해 유한 물점용 3군 줌 광학계를 목적에 맞게 변형시켰다. (중략)