• Journal of the Korea Society for Simulation
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• v.15 no.4
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• pp.119-128
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• 2006

A turnout system which permits trains to pass from one track to another is a combination of the switch, the crossing, lead rails which are necessary to connect the switch and the crossing, two guard rails and a switch machine for operating the switch. A turnout is the sole moving part among the railway components and has complex configuration, so the safety has always been raised an issue. In Korea, it is planned to adopt the high speed tilting train, which operates at the maximum speed of 200km/h, at conventional lines by the year of 2010. However, for the application of the tilting train to conventional lines, it is prerequisite to establish a stable turnout system allowing the tilting train to pass through it without reducing speed. Therefore, the improved turnout system for the speed-up of conventional lines has been developed and the prototype of the turnout system has been constructed. In this study, simulation of noise and vibration around the improved turnout system was performed in order to predict the generation level of noise and vibration due to passing of the tilting train through the turnout system.

• Applied Microscopy
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• v.40 no.2
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• pp.65-71
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• 2010

Kribensis, Pelvicachromis pulcher is a teleost belonging to Cichlidae. The oogenesis was investigated by light microscope. The ovary was located between intestine and air bladder, a yellowish and ellipsoidal shape with the major axis 20mm and the minor axis 5 mm. Cytoplasm of oogonia in early stage was basophilic and many nucleoli were located at inside of nuclear membrane. In primary oocytes, yolk vesicles were distributed only in the marginal area and egg envelope was not formed on the outside of an egg. In secondary oocytes, the egg envelope was formed and yolk vesicles in the cytoplasm were increased than the earlier stage. The basophilic substance of cytoplasm was changed to acidic. Some yolk vesicles started forming small yolk mass except the surrounding nucleus. In case of matured egg, size of egg were increased. The yolk vesicles were changed to yolk mass in accordance with development. The yolk mass contained crystal-like structures. In conclusion, the oogenesis of Pelvicachromis pulcher was summarized by the increase in cell size, the formation and the accumulation of yolk, and the decrease of basophilic substance in the cytoplasm. The oogenesis of Coreoleuciscus splendidus is similar with other teleost. But there were differences in distribution of yolk vesicle and yolk mass containing cristal-like structures.

• Economic and Environmental Geology
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• v.48 no.4
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• pp.313-324
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• 2015

This study constructed a 3D geological model for Uggi Nuur Fe-Mn mineralization zone in Mongolia, and the 3D geological distribution is cross-analyzed with magnetic anomaly distribution to figure out relationship between ore zone and subsurface geology. As a result of 4 step 3D modeling procedures including geological cross section, surface modeling, foliation modeling and solid modeling, the geology of the both study area is bordered by faults in NW direction with Munguntessj formation being located in the west side of the fault while Yashill formation is located on the other side of the fault. Moreover, the strike direction of foliation in the both formation shows same directional pattern with the NW faults. The magnetic anomaly distribution reveals that higher anomaly values are concentrated to near the ground surface. The analyses of 3 dimensional distribution between subsurface geology and magnetic anomaly indicates that higher anomaly is mainly distributed over the Munguntessj formation as a elongated lens bodies whereas the magnetic anomaly is evenly found in the both of Munguntessj formation and Yashill formation in the study area 2. It infers that volcanic activities associated mineralization occurred during silurian period, and the mineralized zone is thought to be realigned along the geological structures caused by later stage tectonic activities.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.3-3
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• 2009

선박의 건조과정에서 필수적으로 선체 외판에는 선박의 안전과 운항 및 정비 등에 필요한 정보를 나타내기 위해 다양한 종류의 마크 및 문자가 마킹되어진다. 하지만, 단순한 도장 작업만으로는 해상과 같은 부식 환경에서 마크 및 문자가 쉽게 지워지거나 손상되기 때문에 마크 및 문자를 용접 비드(welding bead)로 표시하거나 미리 절단된 강판(steel plate)을 수동으로 용접한 뒤 도장을 함으로써 마크 및 문자의 손상을 방지하고 있다. 이러한 문자마킹작업을 하기 위해서는 작업자가 수작업으로 기준선과 마크 및 문자의 위치를 먹줄 등을 이용하여 마킹을 하고, 해당 마크 및 문자의 템플렛(template)을 이용하여 펀칭을 실시한 후 수동으로 용접을 실시한다. 하지만, 수작업을 통한 선체외판 문자마킹 작업은 작업자의 기량에 따라 품질이 상이하여 품질 저하의 원인이 된다. 또한 대조립 및 탑재 단계에서 문자 마킹 작업시 수직자세의 용접을 요구함으로써 작업자가 안전사고에 노출되어 있으며, 선박의 각 단계별 주요 공정보다 작업시간이 길어져 전체 선박 건조공정을 지연시키는 문제점 등을 야기시킬 수 있다. 이러한 문제점들을 해결하기 위해 조선업계에서는 선체 외판의 마크 및 문자를 자동으로 용접할 수 있는 장치를 개발하기 위해 노력해왔으며, 몇몇 개발 사례가 보고되고 있다. 하지만, 그 실효성 부분에서는 아직까지 해결하지 못한 문제점들로 인해 현장 적용에는 어려움을 보이고 있다. 본 연구에서는 선박외판 문자 자동용접장치의 기능성뿐만 아니라 현업 적용성을 가장 우선적으로 고려하여 문자마킹장치(Marking Robot for Shipbuilding) 개발을 진행하였다. 우선, 적절한 용접 재료를 선정하기 위해서 솔리드 와이어(Solid Wire)와 플럭스 코어드 와이어(Flux Cored Wire)에 대한 비드온 용접(Bead-On Welding)을 아래보기자세와 수직자세에 대해서 실시하여 적절한 용접 조건을 설정하였다. 본 연구에서 개발된 문자마킹 자동용접장치는 3축으로 구성되어 있으며 각 축들을 분리할 수 있도록 개발하여 이동성을 향상시켰으며, 작업면과 용접토치간의 거리를 일정하게 유지시킬 수 있도록 용접전류 센서(Welding Current Sensor)를 이용하여 토치 높이(Wire Extension)를 제어함으로써 균일한 품질의 용접비드를 얻을 수 있었다. 또한 문자마킹 자동용접장치는 본체 구동부와 제어부(Touch Screen)가 쉽게 분리되고 장착이 가능한 구조로 개발되었으며, 용접시 각 용접자세별로 용접전압, 전류 그리고 용접속도 설정이 가능하여 아래보기 자세뿐만 아니라 어떠한 자세에서도 같은 모양의 비드형상을 가지는 문자마킹용접이 가능하도록 개발하였으며, 이는 실험과 현장적용을 통해 검증하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.