• Title/Summary/Keyword: 동판 검사

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3D Analysis System for Copper Palate Defect Detection (동판의 결함 검출 위한 3차원 분석 시스템 개발)

  • Oh, Choon-Suk
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.13 no.1
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    • pp.55-62
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    • 2013
  • Automatic inspection system is required for increment of copper plate production and demand expansion. Thus 3D surface form and defect detection of copper plate calls for 3D image and GUI analysis. Limitation of 2D analysis, such as error occurrence and decision difficulty makes eye inspection automatic. Automatic inspection is able to raise accurate inspection rate and productivity efficiency elevation. In this paper defect classification is defined and inspection system is implemented. Defect analysis algorithms and GUI for 3D image analysis is developed and tested.

A Real-time Copper Foil Inspection System using Multi-thread (다중 스레드를 이용한 실시간 동판 검사 시스템)

  • Lee Chae-Kwang;Choi Dong-Hyuk
    • Journal of KIISE:Computing Practices and Letters
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    • v.10 no.6
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    • pp.499-506
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    • 2004
  • The copper foil surface inspection system is necessary for the factory automation and product quality. The developed system is composed of the high speed line scan camera, the image capture board and the processing computer. For the system resource utilization and real-time processing, multi-threaded architecture is introduced. There are one image capture thread, 2 or more defect detection threads, and one defect communication thread. To process the high-speed input image data, the I/O overlap is used through the double buffering. The defect is first detected by the predetermined threshold. To cope with the light irregularity, the compensation process is applied. After defect detection, defect type is classified with the defect width, eigenvalue ratio of the defect covariance matrix and gray level of defect. In experiment, for high-speed input image data, real-time processing is possible with multi -threaded architecture, and the 89.4% of the total 141 defects correctly classified.

Defect detection for a conductor using amorphous wire sensor head (금석 구조체의 미소결함검사에 대한 기초적인 검토)

  • Kim, Y.H.;Shin, K.H.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.05a
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    • pp.35-39
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    • 2002
  • A defect detection test was performed for a conductor using a amorphous wire sensor head. A uniform magnetic field was applied in the space between the most inner conductors of a spiral-typed coil. The conductor with a defect was placed on the space between the most inner conductors of spiral-typed coil. The defect can be detected from the differences of induced voltage measured in the vicinity of gap of the conductor. The induced voltage difference of 2.5mV was measured in the gap vicinity of the 1mm thick conductor having 0.5mm gap in the frequency region of 100kHz~600kHz.

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Flaw Detection in a Conductor Using Sensor Head of Amorphous Wire (비정질 와이어를 센서헤드로 이용한 금속의 미세결함 검출)

  • Kim, Y.H.;Shin, K.H.
    • Journal of the Korean Magnetics Society
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    • v.12 no.5
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    • pp.174-178
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    • 2002
  • Ac magnetic field was changed in the vicinity of a flaw because of the distribution of eddy current within a conductor, when the magnetic field was applied to a conductor having a flaw. The flaw detection was performed by using Co-based amorphous wire sensor head. The wire has almost 0 magneto-striction and high permeability. An comparative uniform magnetic field was applied to a 1㎜ thick copper plate and a 25㎛ thick aluminum sheet conductor using spiral typed coil. The size of the coil has 40㎜$\times$40㎜ outer width and 8㎜$\times$8㎜ inner width. The copper plate and the aluminum sheet has 0.5㎜ and 0.1㎜ wide gap, respectively. The frequency range of applied field was 100㎑∼600㎑. The induced voltage difference of 2.5㎷ was obtained in the maximum voltage and minimum one measured across the gap of the 1mm thick conductor. In the case of aluminum sheet, 0.4㎷ was obtained. From this results, the effectiveness of Co-based amorphous wire was confirmed in the ECT technique.