• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.3
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• pp.130-135
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• 2002

This study investigates the effect of curing method on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. Lap shear tests and T-peel tests were performed based on the procedure of ASTM 906-94a and ASTMD1876-95, respectively. Test samples were fabricated by using the co-curing method and the secondary curing method. The results showed that the shear strength of test samples made by the co-curing method was 2.5 times greater than that of test samples made by the secondary curing method. The T-peel strength of the co-curing method case was almost 2 times greater than that of the secondary curing method case.

• Composites Research
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• v.24 no.5
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• pp.23-28
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• 2011

In this paper, the bonding strengths of co-cured T800 carbon/epoxy composite-aluminum single lap joints with and without additional pressures were investigated using the pressure information induced by the fiber tension during a filament winding process. The specimens of all the tests were fabricated by an autoclave vacuum bag de-gassing molding being controlled forming pressures (absolute pressures of 0.1MPa, 0.3MPa and 0.7MPa including vacuum). A special device which can act uniform additional pressures on the joining part of the single lap joint specimen was designed to measure the bonding strengths of composite-aluminum liners of type III hydrogen pressure vessel fabricated by a filament winding process. After the three different additional pressures (absolute pressures of 0.1MPa, 0.3MPa and 0.7MPa) were applied to the specimens the effect of the additional pressures on the bonding strengths of the co-cured single-lap joints were evaluated.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.3
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• pp.385-392
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• 1997

The joint design and manufacture of the composite structure have become an important research area because the structural efficiency of the composite structure is often determined by its joint not by its basic structure. The co-cured joint is an efficient joint technique because both curing and jointing for composite structures are achieved simultaneously. In this paper, the torque capacities of the co-cured tubular lap joint with and without knurling of the pyamid type were experimentally measure. From the experimental resuts, it was found that the excess resin played a role as an adhesive in the co-cured tubular lap joint whose steel adherends were not knurled. Also, it was found that the torque capacity of the co-cured joint was increased as the knurling size of the pyramid type on the surface of the steel adherend was increased.

• Composites Research
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• v.23 no.4
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• pp.21-27
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• 2010

In most engineering structures, fracture often takes place due to fatigue. Therefore, many studies about the effect of the various mode-mixities on fatigue characteristics have been performed. However, most of the former studies only address metal/metal interfaces or delamination of composite. In this study, the fatigue characteristics of composite/metal interfaces are investigated. The fatigue tests were performed using single leg bending(SLB)specimens that comprise composite and steel bonded to each other using co-cure bonding method. This paper focuses on fatigue characteristics depending on different mode ratios$(G_{II}/G_T$. The overall results obtained in this study show that the crack propagation rate increases with the mode II loading component.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.83-87
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• 2022

Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

• Composites Research
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• v.13 no.4
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• pp.42-53
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• 2000

A study has been made to establish an optimum condition in the surface treatment and curing method that is important for the fabrication of Al 7075/CFRP laminates. PAA(Phosphoric Acid Anodizing) provided a good adhesive strength and FPL(Sulfuric / Sodium Dichromate Acid Etching) had a similar adhesive strength with PAA. On the other hand, the poor adhesive strength was shown on vapor degrease and CAA(Chromic Acid Anodizing). By using the atomic force microscope(AFM), it was found that the PAA oxide surface obviously had a greater degree of microroughness as compared to vapor degrease, CAA and FPL treated surfaces. These results support the concept of a mechanical interlocking of the adhesive with-in the oxide pores as the predominant adhesion mechanism. In curing methods, the adhesive strength of co-curing method was higher than that of secondary curing method. With respect to stability of specimen shape, the secondary curing method was better than co-curing method. DMA(Dynamic Mechanical Analysis) test revealed $T_g$ in curing times over 60 min is nearly same, so it is estimated they will have similar degree of curing and joint durability in using FM300M adhesive film.

• Korean Journal of Materials Research
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• v.3 no.6
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• pp.606-613
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• 1993

This was studied about aging characteristic of AC4A/$SiC_{w}$ 10-30v/o reinforced composite. Aging hardenability was decreased $SiC_{w}$ 30% > 10% > 20%. Aging hardening of T6 treatmented composite was higher absolute value than AC4A I/M material. And this results indicated initial hardening phenomenon according to increase $SiC_{w}$ volume fraction. Reinforced effect by pressure was the same effect as before aging treatment and the best condition pressure at 75MPa. Similar to reinforced effect according to $SiC_{w}$ volume fraction was 30 % > 10 % > 20 %. In case of pressure is low, whisker is not break the same time press with base metal after wetting. After it is wetting with base metal, a part transformed or wetting part break and whisker maintain original shape or a part transformed on the otherhand, in case of pressure is high, whisker is break in same time it was not against pressure and whisker's shape is near a polygon or spherical shape.

• Composites Research
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• v.19 no.4
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• pp.15-22
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• 2006

One of the primary factors limiting the application of composite-metal adhesively bonded joints in structural design is the lack of a good evaluation tool for the interfacial strength to predict the load bearing capacity of boned joints. In this paper composite-steel adhesion strength is evaluated in terms of stress intensity factor and fracture toughness of the interface corner. The load bearing capacity of double lap joints, fabricated by co-cured bonding of composite-steel adherends has been determined using fracture mechanical analysis. Bi-material interface comer stress singularity and its order are presented. Finally stress intensities and fracture toughness of the wedge shape bi-material interface corner are determined. Double lap joint failure locus and its mixed mode crack propagation criterion on $K_1-K_{11}$ plane have been developed by tension tests with different bond lengths.

• Journal of the Korean Wood Science and Technology
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• v.38 no.4
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• pp.333-340
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• 2010

The Korean Dendropanax lacquer, made from a natural resinous sap from Dendropanax orbifera Lev., was used as a golden and transparent varnish for the traditional artifacts (armor uits, helmets, arrowheads, etc.) to make them be brilliant golden color. The cured film of the acquer has excellent protective properties such as weatherability, water resistance, and nticorrosive. But, one of disadvantages is that takes a long time and much energy to fulfill curing the lacquer. The chemical constituents of the lacquer contained conjugated diene compounds s the photopolymerizable monomers. These monomers easily polymerized in sunlight to form olden-colored, hard-coating films in a short time. Photooxidation may be one of the most mportant reactions in the chemistry of the lacquer. Although the Korean Dendropanax Lacquer hould be dried to a thoroughly dry stage to achieve optimal film properties, curing with elevated emperatures may be required for the protracted curing time at atmospheric temperature. So we ntended to accelerate the curing rate of the lacquer by dual curing of thermal and radiation uring. The effect of thermal initiator on the thermal curing reaction was evaluated by monitoring he changes in double bond peak with FT-IR. Then the curing rate of the lacquer blended with hermal initiator and photoinitiator together was measured during dual curing using a RPT with V spot curing machine. Thermal initiator not only accelerated the curing rate but also improved he physical property. And the curing rate of the Korean Dendropanax lacquer was improved by ual curing method of thermal and UV curing. According to these results, the application area of he Korean Dendropanax lacquer could be expanded to surface coatings for electronic devices uch as mobile phones or electronics.

• Composites Research
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• v.31 no.4
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• pp.139-144
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• 2018

Long Fiber-reinforced composites have advantages of excellent production efficiency and formability of complex shapes compared to conventional continuous fiber reinforced composite materials. However, if we need to make complicated composite shapes or to assemble parts made of different materials, a variety of joining methods are needed. In general, long fiber prepreg sheet (LFPS) contains mold release agent to facilitate demolding after thermoforming. Therefore, mechanical fastening is required in addition to the adhesive bonding to get proper joining strength. In this study, we proposed a stainless steel insert for co-cure bonding which cures LFPS and bonds the stainless steel insert through thermoforming process. The wing of the insert which is spread during the thermoforming process induces adhesion and mechanical wedging effect and serves as a hook to resist the pulling force. The burn-out method was used to confirm the unfolded state of the stainless steel insert wings inserted into the composite material. The static pull-out test was performed to quantitatively evaluate the joining strength. From these experimental results, the condition which guarantees the most appropriate joining strength was derived.