• 한국소음진동공학회논문집
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• 제18권4호
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• pp.381-385
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• 2008

This paper suggests a non-contact sensor for measuring bending vibration of a non-metallic cylinder in two orthogonal directions simultaneously. Recent research shows that a solenoid can pick up bending vibrations of a nonmetallic cylinder based on the reversed Lorentz force mechanism if an electrically conductive patch is attached to the cylinder. In this work, pairs of specially designed patches are used to make two independent paths for the current induced by bending vibrations, which enables the measurement of bending vibrations along two orthogonal directions simultaneously. The working performance of the developed sensor was verified by using two accelerometers.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.24-26
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• 2006

The copper foil of 10fm of thickness was prepared, and the surface treatment on the copper foil was done by the method of the electrolytic plating in the acid solution with the sulfate ion as a purpose to remove the main element of the surface contaminant of copper variously. The structure on the surface of the copper foil in this study investigated AFM with SEM the changed phenomenon according to added plating time and current. The phenomenon of the structure's of the oxide on the surface of long plating time and high current growing was confirmed.

• 한국표면공학회지
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• 제5권1호
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• pp.1-7
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• 1972

Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${\pm}$5${\mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods and conditions were studied to produced good quality copper foils for printed circuit board applications. The electroplating bath solutions used were a copper-sulfate solution and a concentrated copper fluoborate solution. A surface roughening treatment that improved the adhesive strength of copper foils with an insulating laminate was also developed . A conventional copper sulfate solution containing sulfuric acid was used for the roughening treatment.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 연구회
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• pp.88-91
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• 2001

The mechanical properties and surface luminous intensities of copper foil have been studied with variation of the amount of additives into the electrolyte. Especially, organic compound of HEC was added from 0.1 to 10ppm for the propose of increasing the mechanical property and the surface state. The total thickness of electrodeposited copper foil was decreased with increasing the amount of organic compounds. There was not so much significant effect of the current density. It has been observed that mechanical property and surface luminous intensity increase with increasing concentration of organic compounds.

• 한국전기전자재료학회논문지
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• 제28권12호
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• pp.771-775
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• 2015

In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with $10{\mu}m$ linewidth are fabricated on $180mm{\times}180mm$ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with $10{\sim}20{\mu}m$, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.55-55
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• 2015

오늘날 전해동박은 리튬이온전지의 집전체, PCB, FPCB등의 핵심부품으로써, 산업 전반에 걸쳐 널리 사용되고 있다. 그러나 전자 회로의 미세화로 인한 열 발생, 낮은 강도에 의한 신뢰성 하락 등이 문제가 되고 있는 실정이다. 구리에 나노 쌍정을 높은 밀도로 형성하게 되면, 전기 저항의 변화 없이 기계적 강도를 높이는데 도움이 된다. 특히 펄스 전해증착에서는 높은 전류밀도가 인가되기 때문에 고밀도의 나노쌍정을 얻을 수 있다는 점이 여러 논문에서 보고되었다. 이번 연구에서는 펄스도금 조건에서 온도 조건의 변화를 통해 강도가 향상됨을 알 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1540-1542
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• 2001

In this paper, the amount of additives in the electrode were investigated the relation of the mechanical properties and surface luminance of copper foil. Especially, organic compound of PEG(Poly-ethylene Glycol) was added from 1 to 20ppm for the propose of increasing the mechanical property and the surface state. The surface luminance of copper foil is appealed 69.25 at 2ppm-15A/$dm^2$ and 68.25 at 2ppm-10A/$dm^2$. It guess that 10ppm-10A/$dm^2$ occurred pin-hole. Tensile strength was not showed the significant difference but elongation appealed the most value at 5ppm-15A. We earned that the most PEG value of mechanical properties is 5 PPM.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.317-317
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• 2010

전자기기의 수요 증가와 함께 기기의 소형화, 고집적화가 요구되어짐에 따라 packaging 기술 개발에서 필요한 소재에 관한 연구가 활발히 진행되고 있다. 이에 따라 우수한 절연특성, 낮은 열팽창계수와 낮은 흡습도를 갖고 있으며 무엇보다도 플렉시블하여 3차원 조립이 가능한 LCP가 차세대 기판 부품소재로 많이 거론되고 있다. 그러나 LCP는 구리 동박을 열 압착하여 패턴을 형성하므로 미세 패턴제작이 어려운 문제점이 있다. 본 연구에서는 LCP의 열가소성 특성을 이용하여 seed 구리 도금 층을 형성하여 열 압착 후 패턴 도금 법으로 $10{\mu}m$ 이하의 패턴을 형성하였으며 구리층과 LCP 간의 접합강도를 열 압착 온도 별로 측정하였다.

• 한국전자파학회논문지
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• 제19권7호
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• pp.754-760
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• 2008

본 논문에서는 금속 표면에 부착하여도 인덕턴스의 변화가 거의 발생하지 않는 RFID용 평면 코일의 구조를 새로이 소개한다. 코일의 후면에 도체판을 부착할 때 발생하는 인덕턴스 감소 비율을 고려하여 그 비율의 역수 배에 해당하는 인덕턴스를 갖도록 코일을 설계하고 코일의 기판 후면에 동박 영역을 배치한다. 이러한 코일 구조는 매우 간단하며, 금속 표면에서 발생하는 인덕턴스 감소 현상을 방지하므로 금속 표면을 가지는 물체를 관리하기 위한 RFID 시스템을 구축하는 데에 매우 효과적이다.

• 한국정밀공학회지
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• 제28권2호
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• pp.193-201
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• 2011

Clamp type transferring mechanism for package substrate's wet processes was newly developed instead of conventional roller type transferring mechanism. Clamp type transferring mechanism has the advantages of reducing the panel deflection and of minimizing the contact problem between the panel and the transferring mechanism. Individual clamp of the mechanism has two distinct mechanical functions which are perfectly fixing a panel during the transferring and generating adequate tension for the panel. To determine the mechanical parameters of the clamp, panel deflection simulation was conducted and the result was verified by the panel deflection measurement. Also, fixing angle of a clamp could be determined by the free body force analysis of individual clamp. Finally clamp type transferring mechanism was actually manufactured and the transferring performance was verified during the water spraying condition of the package substrate's wet processes.