• Korean Chemical Engineering Research
• /
• v.58 no.3
• /
• pp.369-380
• /
• 2020

Most mono-crystalline silicon ingots are manufactured by the Czochralski (Cz) process. But If there are oxygen impurities, These Si-ingot tends to show low-efficiency when it is processed to be solar cell substrate. For making single-crystal Si- ingot, We need Czochralski (Cz) process which melts molten Si and then crystallizing it with seed of single-crystal Si. For melts poly Si-chunk and forming of single-crystalline Si-ingot, the heat transfer plays a main role in the structure of Cz-process. In this study to obtain high-quality Si ingot, the Cz-process was modified with the process design. The crystal growth simulation was employed with pulling rate and rotation speed optimization. Studies for modified Cz-process and the corresponding results have been discussed. The results revealed that using crystal growth simulation, we optimized the oxygen concentration of single crystal silicon by the optimal design of the pulling rate, rotation speed and melt charge level of Cz-process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.446-446
• /
• 2009

표면 패시베이션 기술로 이용되는 수소화된 실리콘 질화막은 제조원가의 절감을 위한 실리콘 기판재료의 두께 감소에 따른 특성상의 문제점을 해결하기 위해 중요한 영향을 미치는 요소이다. 실리콘 질화막은 강한 기계적 강도, 우수한 유전적 특성, 수문에 의한 부식과 유동적 이온에 대한 우수한 저항력 때문에, 반도체 소자 산업에서 널리 사용되고 있다. 수소화된 실리콘 질화막은 반사방지 특성과 함께 표면 패시베이션의 질을 향상시킬 수 있다. 굴절률 1.9 ~ 2.3 범위에서 쉽게 변화 가능한 수소화된 실리콘 질화막은 굴절률 1.4 ~ 1.5 사이의 열적 산화막 보다 효과적인 반사방지막이다. 수소화된 실리콘 질화막을 사용한 태양전지에서는 효율을 높이기 위해서 기판 표면에서의 케리어 재결합이 억제되어져야한다. 또한, 수소화된 실리콘 질화막은 최적화된 두께와 굴절률을 가져야한다. 본 연구에서는 고효율 태양전지에 적용하기 위해 반송자 수명이 향상된 수소화된 실리콘 질화막을 플라즈마 화학 기상 증착법을 이용하여 증착하였다. 박막은 $250^{\circ}C\;{\sim}\;450^{\circ}C$에서 증착되었으며 증착된 박막은 1.94 to 2.05 굴절률 값을 가지고 있다. 반송자 수명을 증가시키기 위해 $650^{\circ}C\;{\sim}\;950^{\circ}C$에서 어닐링 하였고 반송자 수명을 측정하여 패시베이션 특성을 분석하였다. 수소화된 실리콘 질화막은 $850^{\circ}C$의 어닐링 온도와 굴절률 2.0 조건에서 가장 좋은 반송자 수명을 나타냈다.

• New & Renewable Energy
• /
• v.4 no.2
• /
• pp.74-80
• /
• 2008

To improve the blue responses of screen-printed single crystalline silicon solar cells, we investigated an emitter etch-back technique to obtain high emitter sheet resistances, where the defective dead layer on the emitter surface was etched and became thinner as the etch-back time increased, resulting in the monotonous increase of short circuit current and open circuit voltage. We found that an optimal etch-back time should be determined to achieve the maximal performance enhancement because of fill factor decrease due to a series resistance increment mainly affected by contact and lateral resistance in this case. To elucidate the reason for the fill factor decrease, we studied the resistance analysis by potential mapping to determine the contact and the lateral series resistance. As a result, we found that the fill factor decrease was attributed to the relatively fast increase of contact resistance due to the dead layer thinning down with the lowest contact resistivity when the emitter was contacted with screen-printed silver electrode.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.11a
• /
• pp.43.1-43.1
• /
• 2010

In the crystalline silicon solar cells, the full area aluminum_back surface field(BSF) is routinely achieved through the screen-printing of aluminum paste and rapid firing. It is widely used in the industrial solar cell because of the simple and cost-effective process to suppress the overall recombination at the back surface. However, it still has limitations such as the relatively higher recombination rate and the low-to-moderate reflectance. In addition, it is difficult to apply it to thinner substrate due to wafer bowing. In the recent years, the dielectric back-passivated cell with local back contacts has been developed and implemented to overcome its disadvantages. Although it is successful to gain a lower value of surface recombination velocity(SRV), the series resistance($R_{series}$) becomes even more important than the conventional solar cell. That is, it is a trade off relationship between the SRV and the $R_{series}$ as a function of the contact size, the contact spacing and the geometry of the opening. Therefore it is essential to find the best compromise between them for the high efficiency solar cell. We have investigated the optimal design for the local back contact by using PC1D simulation.

• 한국신재생에너지학회:학술대회논문집
• /
• 2008.05a
• /
• pp.390-393
• /
• 2008

To improve the blue responses of screen-printed single crystalline silicon solar cells, we investigated an emitter etch-back technique to obtain high emitter sheet resistances, where the defective dead layer on the emitter surface was etched and became thinner as the etch-back time increased, resulting in the monotonous increase of short circuit current and open circuit voltage. We found that an optimal etch-back time should be determined to achieve the maximal performance enhancement because of fill factor decrease due to a series resistance increment mainly affected by contact and lateral resistance in this case. To elucidate the reason for the fill factor decrease, we studied the resistance analysis by potential mapping to determine the contact and the lateral series resistance. As a result, we found that the fill factor decrease was attributed to the relatively fast increase of contact resistance due to the dead layer thinning down with the lowest contact resistivity when the emitter was contacted with screen-printed silver electrode.

• 한국태양에너지학회:학술대회논문집
• /
• 2011.04a
• /
• pp.105-110
• /
• 2011

The doping procedure in crystalline silicon solar cell fabrication usually contains oxygen injection during drive-in process and removal of phosphorous silicate glass(PSG). In this paper, we studied the effect of oxygen injection and PSG on conversion efficiency of solar cell. The mono crystalline silicon wafers with $156{\times}156mm^2$, $200{\mu}m$, $0.5-3.0{\Omega}{\cdot}cm$ and p-type were used. After etching $7{\mu}m$ of the surface to form the pyramidal structure, the P(phosphorous) was injected into silicon wafer using diffusion furnace to make the emitter layer. After then, the silicon nitride was deposited by the PECVD with 80 nm thickness and 2.1 refractive index. The silver and aluminium electrodes for front and back sheet, respectively, were formed by screen-printing method, followed by firing in 400-425-450-550-$880^{\circ}C$ five-zone temperature conditions to make the ohmic contact. Solar cells with four different types were fabricated with/without oxygen injection and PSG removal. Solar cell that injected oxygen during the drive-in process and removed PSG after doping process showed the 17.9 % conversion efficiency which is best in this study. This solar cells showed $35.5mA/cm^2$ of the current density, 632 mV of the open circuit voltage and 79.5 % of the fill factor.

• 한국태양에너지학회:학술대회논문집
• /
• 2011.11a
• /
• pp.34-39
• /
• 2011

Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.364.1-364.1
• /
• 2014

고효율 태양전지로 가기 위해서는 태양전지의 후면 패시베이션은 중요한 역할을 한다. 후면 패시베이션 막으로 사용되는 $Al_2O_3$ 막은 $Al_2O_3/Si$ 계면에서 높은 화학적 패시베이션과 Negative Fixed Charge를 가지고 있어 적합한 Barrier막으로 여겨진다. 하지만 이후에 전면 Metal paste의 소성 공정에 의해 $800^{\circ}C$이상 온도를 올려주게 됨에 따라 $Al_2O_3$ 막 내부에 결합되어 있던 수소들이 방출되어 blister가 생성되고 막 질은 떨어지게 된다. 우리는 blister가 생성되는 것을 방지하기 위한 방법으로 PECVD 장비로 SiNx를 증착하는 공정 중에 $N_2O$ 가스를 첨가하여 SiON 막을 증착하였다. SiON막은 $N_2O$가스량을 조절하여 막의 특성을 변화시키고 변화에 따라 소성시 막에 미치는 영향에 대하여 조사하였다. 공정을 위해 $156{\times}156mm2$, $200{\mu}m$, $0.5-3.0{\Omega}{\cdot}cm$ and p-type 단결정 실리콘 웨이퍼를 사용하였고, $Al_2O_3$ 막을 올리기 전에 RCA Cleaning 실행하였다. ALD 장비를 통해 $Al_2O_3$ 막을 10nm 증착하였고 RF-PECVD 장비로 SiNx막과 SiON막을 80nm 증착하였다. 소성로에서 $850^{\circ}C$ ($680^{\circ}C$) 5초동안 소성하고 QSSPC를 통해 유효 반송자 수명을 알아보았다.

• Korean Chemical Engineering Research
• /
• v.49 no.4
• /
• pp.432-437
• /
• 2011

Recently, industry needs a new design of Czochralski(Cz) process for higher productivity with reasonable energy consumption. In this study, we carried out computational simulations for finding out a new optimal design of Cz process with variables which can be applied in real industry such as location of heater, shape of shield and crucible size. Objective process was Cz process which can be produced 8 inch diameter Si ingot for solar cell and we acquired an optimal design for higher productivity, low power consumption with stable production condition. For higher productivity we also change the crucible diameter from 22 inches to 24 inches with changing insulation thickness only because the process housing size could not be changed in industry.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.61-65
• /
• 2009

We produced noble surface structure of crystalline Si for solar cells by using preferential aqueous etching on crystallographic defects which were induced by grinding process. We analyzed the reflectance of textured surface according to surface topography resulting from various etchant concentrations and duration of etching process. The crystallographic defects and textured surface topography were investigated by using transmission electron microscopy and secondary electron microscopy, respectively. Also, the measurement of reflectance of textured surface utilizes spectrophotometer. The optimized texture surface exhibits improved result indicating reflectance of below ave. 1%. And it is cost-effective as well as taking short time within a few minutes.