• The Journal of the Convergence on Culture Technology
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• v.8 no.4
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• pp.115-120
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• 2022

The Rsussian Armed Forces(RAF) invaded Ukraine on Feburary 24. However, the Armed Forces of Ukraine(AFU) unexpectedly blocked the Russian wave attack made the war between Ukraine and Russia lengthened. Major think-tanks and military experts in the world assessed that the AFU overwhelmed the RAF at the initial stage of the war because of decentralized combats based on mission command. Especially, the decentralized small units of the AFU damaged the RAF and slowed down its Iniative. The 4^th industrial revolution makes the Korean Peninsula the multi-domain battlefield in the future; accordingly, the Decentralized combat won't be a choice, but a necessity in the future. Therefore, the AFU's offensive decentralized combats in this war Suggests many things to the Republic of Korea Army.

• The Journal of the Convergence on Culture Technology
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• v.6 no.3
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• pp.105-109
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• 2020

The Future Army in 2050 should prepare for various future threats and effectively utilize its superintelligence and hyper-connected weapons systems to develop ways of fighting new concepts to dominate multi-regional battlefields and achieve victory. First, the establishment of active and offensive military strategies based on ability. Second, the battle of central strike for enemy combat will paralysis. Third, the battle of simultaneous integrated mosaic using multidisciplinary areas. Fourth, cyber warfare based on artificial intelligence that transcends time and space. Fifth, Combined Platform War. After all, future wars will be won or lost by invisible wars on cyber space.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.10a
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• pp.600-601
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• 2021

The cyberspace, which is the fifth battle field, should be utilized for multi-domain maneuvering between the cyberspace and the physical space using an electromagnetic spectrum. This becomes a major concept of cyber electronic warfare that combines the characteristics of cyber warfare and electronic warfare. In this study, the concept of cyber electronic warfare is analyzed by using the OSI reference model and examining the threats of the two-layer data link layer.

• Journal of Convergence for Information Technology
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• v.11 no.4
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• pp.26-34
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• 2021

In the era of the Fourth Industrial Revolution, the future battlefield will carry out multi-area operations with hyper-connected, high-speed and mobile systems. In order to prepare for changes in the future, the Korean military intends to develop various weapons systems and form a multi-layer tactical network to support On The Move communication. However, current tactical networks are limited in support of On The Move communications. In other words, the operation of multi-beam antennas is necessary to efficiently construct a multi-layer tactical network in future warfare. Therefore, in this paper, we look at the need for multi-beam antennas through the operational scenario of a multi-layer tactical network. In addition, based on development consideration factors, features of rotary-wing and fixed-wing aircraft, we present the location and operation of airborne relay drone installations of multi-beam antennas.

• Journal of the Korea Society for Simulation
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• v.25 no.3
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• pp.133-146
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• 2016

To engage multiple missiles in single launcher against multiple targets, launcher system has to operate for optimized launch angle to each target sequentially. If the launch angle sequence is simply defined according to the target assignment order only, overall engagement time would be increased, and even in some engagement scenarios, it could be possible to miss some moving targets being out of proper engagement area. Therefore, the study on methodology for a real-time decision of optimized launch angle sequence is necessary. In this paper, the automatic decision model of launch angle sequence was suggested to minimize total engagement time by analyzing the simulation results of all engagement sequence set for multiple moving target scenario. Performance of proposed methodology for decision of optimal launch angle sequence was verified by comparing with the optimal or suboptimal sequence obtained from simulation results.

• The Journal of Korean Academy of Prosthodontics
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• v.47 no.1
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• pp.46-52
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• 2009

Statement of problem: Recently, titanium has become popular as superstructure material in implant dentistry because titanium superstructure can be easily milled by means of computer-aided design and manufacture (CAD/CAM) technique. But retention form such as nail head or bead cannot be cut as a result of technical limitation of CAD/CAM milling and bond strength between titanium and porcelain is not as strong as that of conventional gold or metal alloy. Purpose: The objective of this study was to evaluate the shear bond strength of three different materials: heat curing resin, composite resin, porcelain which were bonded to grade II commercially pure Titanium (CP-Ti). Material and methods: Thirty seven CP-Ti discs with 9 mm diameter, 10 mm height were divided into three groups and were bonded with heat curing resin (Lucitone 199), indirect composite resin (Sinfony), and porcelain (Triceram) which were mounted in a former with 7 mm diameter and 1 mm height. Samples were thermocycled for 1000 cycles at between $5-55^{\circ}C$. Shear bond strength (MPa) was measured with Instron Universal Testing Machine with cross head speed of 1 mm/min. The failure pattern was observed at the fractured surface and divided into adhesive, cohesive, and combination failure. The data were analyzed by one-way ANOVA and Scheffe's multiple range test (${\alpha}=0.05$). Results: Lucitone 199 ($17.82{\pm}5.13\;MPa$) showed the highest shear bond strength, followed by Triceram ($12.97{\pm}2.11\;MPa$), and Sinfony ($6.00{\pm}1.31\;MPa$). Most of the failure patterns in Lucitone 199 and Sinfony group were adhesive failure, whereas those in Triceram group were combination failure. Conclusion: Heat curing resin formed the strongest bond to titanium which is used as a CAD/CAM milling block. But the bond strength is still low compared with the bond utilizing mechanical interlocking and there are many adhesive failures which suggest that more studies to enhance bond strength are needed.