• Title/Summary/Keyword: 니켈도금

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Studies on Electroless Nickel Plating on Alumina Ceramics(I) on Empirical Deposition Rate in Electroless Nickel Plating (알루미나 세라믹스 표면에 무전해 환원 니켈막의 형성에 관한 연구(I) 무전해 니켈도금의 실험적 석출속도에 관한 연구)

  • Kim, Yong-Dai;Lee, Joon
    • Journal of the Korean institute of surface engineering
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    • v.19 no.3
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    • pp.109-120
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    • 1986
  • The electroless nickel plating on high alumina ceramics was performed in the bath containing nickel chloride, sodium hypophosphite and mono- or bi-carboxylic acid as a complexing agent in order to examine the empirical rate law as well as the effects of the complexing agent, plating temperature and pH on the rate of deposition. Adding the carboxylic acid to the plating bath, the rate of deposition was increased considerably, and each of the complexing agents showed a maximum deposition rate plateau around a particular concentration of the complexing agent. The rate of deposition was increased with increasing either temperature or pH, but microstructure of the surface became more rough. Furthermore, empirical rate law of the elecltroless nickel deposition on high alumina ceramics was discussed with the activation energy and other rate parameters calculated.

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Technology to Fabricate PMMA Light Guiding Plate with Pillar Type Nano Pattern Using Nano Impinrinting Technology (나노 임프린팅 기술에 의한 원기둥형 나노 패턴의 PMMA 도광판 형성 기술)

  • Lee, B.W.;Lee, T.S.;Lee, J.H.;Lee, K.W.;Jung, J.H.;Hong, C.;Kim, C.K.
    • Proceedings of the KIEE Conference
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    • 2007.11a
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    • pp.156-157
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    • 2007
  • 나노임프린팅 기술을 이용하여 원기둥형 나노 패턴을 갖는 도광판을 제작하였다. 나노 임프린트 공정을 이용하기 위해서는 니켈 스탬퍼가 필요하기 때문에 이를 제작하기 위하여 실리콘 웨이퍼 상에 건식식각을 이용하여 실리콘 몰드를 제작하였다. 제작된 실리콘 몰드를 전주도금을 이용하여 니켈 스탬퍼를 제작하였다. 제작된 니켈 스탬퍼를 사용한 나노임프린트 공정을 통해 원기둥 나노패턴을 갖는 도광판을 제작하였다.

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Specimen Tests for a Process Development of the Electro-Nickel/Chrome Coating for a Thrust Chamber (연소기 적용 전해니켈/크롬도금 공정개발을 위한 시편시험)

  • Lim, Byoung-Jik;Ryu, Chul-Sung;Choi, Hwan-Seok
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2011.04a
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    • pp.113-116
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    • 2011
  • A total of 9 coating specimens were fabricated through 3 different processes to evaluate the availability and performance of a nickel/chrome coating for the protection of the inner wall of a thrust chamber operating on a condition of high temperature and pressure. Thickness and thermal conductivity of the specimens were measured and thermal shock test was conducted.

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Recovery of Nickel from sulfuric acid solution using Lewatit TP 220 ion exchange resin (황산용액(黃酸溶液)으로부터 이온교환수지(交換樹脂) Lewatit TP 220에 의한 니켈의 회수(回收))

  • Kang, Nam-Hee;Park, Kyung-Ho;Parhi, P.K.
    • Resources Recycling
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    • v.20 no.6
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    • pp.28-36
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    • 2011
  • The adsorption of nickel(Ni) from sulfuric acid solution was carried out by ion exchange method. A series of batch tests in synthetic solutions were carried out using Lewatit Monoplus TP 220 resin. The following experimental parameters, such as temperature, shaking rate, reaction time, pH, resin dosage and concentration of nickel ions etc. were investigated to establish the effective optimum conditions of nickel adsorption. The solution pH(2.0~5.0) and shaking rate had little effects on the adsorption of nickel and adsorption time of 72hours was required to reach equilibrium. The experimental results show a good agreement with Feundlich isotherm and pseudo-second order reaction. The adsorption behavior of Ni obtained from synthetic solution was compared with that of waste electroplating solution. Elution of nickel from loaded resin increased with increase in $H_2SO_4$ concentration.

Fabrication of the multi-layer structure and Nickel mold with electroforming using KMPR (KMPR을 이용한 다층구조물 제작 및 전해도금을 이용한 니켈몰드 제작)

  • Hwang Sung-Jin;Jung Phill-Gu;Ko Jeung-Sang;Ko Jong-Soo;Jeong Im-Deok;Kim In-Gon
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.143-144
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    • 2006
  • In this paper, we proposed XP KMPR-1050 negative tone resist to replace SU-8 resist for multi-layer micro-structures and thick plating mold fabrication using UV-LIGA process. XP KMPR resist proposed in this paper can be easily striped using a common stripping solution such as NMP without damage of micro-structure. The conditions for the fabrication of XP KMPR micro-structure were optimized by adjustment of exposure and post-exposure bake(PEB). The $140{\mu}m$ -thick and an aspect ratio at least 10 micro-structure and multi-layer structures were successfully fabricated through the process conditions. Through-mold electroplating and PR striping of XP KMPR has been successfully demonstrated.

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