• The Transactions of the Korean Institute of Power Electronics
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• v.15 no.1
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• pp.27-34
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• 2010

To dissipate the heat generated from the switching devices in the inverter system of HEV, the water cooling structure is proposed. The bolt type cooling structure has a problem such as water leakage for high pressure of water, therefore the proposed cooling structure applied pipe structure in the heat sink. The heat dissipation characteristics for various structures of water channel and distance between heat source and water channel was analyzed through the simulation. heat dissipation effect for two types of water cooling structures was investigated. Based on the simulation results, two types of water cooling system for 30kW inverter system of HEV were manufactured and the heat dissipation effect was verified.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.3
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• pp.211-217
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• 2006

The three-dimensional numerical analysis has been carried out to figure out the effect of the thermoelectric element thickness on the thermal performance of the thermo-electric micro-cooler. The small-size and column-type thermoelectric cooler is considered. It is known that tellurium compounds currently have the highest cooling performance around the room temperature. Thus, in the present study, $Bi_{2}Te_{3}$ and $Sb_{2}Te_{3}$ are selected as the n- and p-type thermoelectric materials, respectively. The thermoelectric leg considered is less than $20{\mu}m$ thick. The thickness of the leg may affect the thermal and electrical transport through the interfaces between the leg and metal conductors. The effect of the thermoelectric element thickness on the thermal performance of the cooler has been investigated with parameters such as the temperature difference, the current, and the cooling power.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1879-1884
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• 2014

Recently, the micro bonding technology comes into the spotlight as the miniaturization of the electronic product. The micro bonding technique can classify by way of laser welding and ultrasonic bonding and etc. However, the research on the micro bonding is much lacks. In this paper, carried out the cooling analysis of the 60 [kHz] ultrasonic bonding equipment to know heat effect of the piezoelectric element when the ultrasonic bonding equipment was operated. The ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the 60 [kHz] ultrasonic bonding equipment was done. We carried out the bonding for improving bonding strength to using the silver paste. air thightness of bonding surface was confirmed by analysis of bonding interfaces.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.10
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• pp.3666-3672
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• 2010

This study dealt with the controller design of the cooling system for controlling the inside temperature of the LCD panel console(the rest console') using as an outdoor billboard. The cooling performance of the LCD console that had been developed by the preceding research, was insufficient in the performance of the controller. In order to improve the performance of the system, in this study defined the structure and the design condition of the system first, after measured the parameters having influence on the dynamic characteristics, and developed the mathematical model for the analysis of the system. Finally planned a controlling scheme of the system and simulated the controller for the performance checking, compared the performance of this system controller with the preceding one. The purpose of this study is the presentation of the more improving method for the system control.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.167-167
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• 2003

현대 산업이 발전함에 따라 전자부품의 초소형화, 고성능화가 요구되어지고 있으며, 이러한 점에 부응하기 위하여 Pottier 효과를 이용하여 국부냉각이 가능한 열전재료에 대한 많은 연구가 이루어지고 있다. 열전재료에는 사용온도 영역에 따라 여러 종류가 있지만, Bi-Te계 열전재료는 상온영역에서 가장 성능지수(Z=$\alpha$$^2$$\sigma$/$textsc{k}$, $\alpha$는 Seebeck 계수, $\sigma$는 전기전도도, $textsc{k}$는 열전도도)가 높아 각종 냉각소자로서 사용되어 지고 있다. 하지만, 초소형 전자부품의 국부냉각을 위해서는 성능지수의 향상, 특히, 저온 영역에서의 성능지수의 향상이 요구되고 있다. 본 연구에서는 Bi-Te계 열전재료의 성능지수를 향상시키기 위하여, 열전도도의 저하에 의한 성능지수의 향상을 연구목적으로 하였다 열전도도는 전자에 의한 열전도도(K$_{e}$)와 phonon에 의한 열전도도(K$_{p}$)로 이루어지며, 전기전도도에 큰 영향을 미치지 않는 결정립 사이즈영역에서 결정립의 크기를 미세화 하면, 결정입계에서의 phonon의 산란이 증가하여 phonon에 의한 열전도도를 저하시킴으로서 성능지수의 향상이 기대된다. 따라서 본 연구에서는 나노사이즈 분말의 제조에 많이 이용되며 입자크기의 조절이 용이한 공침법을 이용하여 Bi-Te계 열전재료 분말을 제조하고 열전재료에의 적용가능성을 검토하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.6
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• pp.3410-3415
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• 2014

The heat generated by electronic devices can result in performance degradation. Therefore, a heat sink has been used to release the operating heat into the air outside. This study addressed a methodology for a heat sink with an inner tunnel. Under forced convection conditions, the heat transfer characteristics were different so the cooling and heating performances were studied for the heat sink with an inner tunnel. This was evaluated by performing the experimental test examining the heat transfer characteristics related to the variance in time and temperature distribution. In the cooling experiment, the temperature of the A-shape was lower than that of the B-shape, when the voltage was 10 V. These experimental results indicate the optimal cooling effect. In a heating experiment, the temperature of the A-shape was higher than that of the B-shape, when the voltage was 13 V. The experimental results showed that the temperature and efficiency of the A-shape were higher than those of the B-shape.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.12
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• pp.8165-8175
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• 2015

In Korea, summer is hot and humid, and air-conditioners consume lots of electricity. In such case, simultaneous usage of indirect evaporative cooler may reduce the sensible heat and save the electricity. In this study, heat transfer and pressure drop characteristics of indirect evaporative cooler made of aluminum, plastic, plastic/paper are investigated both under dry or wet condition. Results show that indirect evaporation efficiencies of the plastic/paper sample (38.5% ~ 51.4%) are approximately the same as those of the aluminum sample (41.9% ~ 47.5%), and are larger than those of the plastic sample (29.0% ~ 37.4%). This suggests that the plastic/paper sample could be a good substitute to the aluminum sample. However, the pressure drops across the paper channel are 92% ~ 106% larger than those across the aluminum channel. The heat transfer coefficients of the paper channel under dry condition are 15% ~ 44% larger than those of the plastic channel. The increases are 185% ~ 203% for the aluminum channel. The pressure drops of the paper channel are 34% ~ 48% larger than those of the plastic channel and 93% ~ 106% larger than those of the aluminum channel. Rigorous heat transfer analysis reveals that, for the plastic sample, 30% ~ 37% of the wet channels remain dry, whereas all the channels are wet for plastic/paper sample. For aluminum sample, the ratio is 17% ~ 23%.

• Journal of Sensor Science and Technology
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• v.3 no.1
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• pp.12-18
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• 1994

In this study, we fabricated and characterized a calorimetric-type flow sensing element using a micromachined silicon substrate. The cooling and heating effects resulted from the gas flow were measured by two temperature sensors located at both sides of the heating resistor, and the insulator diaphragm was employed as a substrate in order to improve thermal isolation. The sensor generated $0{\sim}378.4mV$ output signal under 10V bridge-applied voltage when the nitrogen gas was passed on the sensor surface having a mass flow rate of $0{\sim}0.25grs/min$, and reached to the stable operating condition within 10 seconds.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.7-12
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• 2010

We have developed a SPICE compatible model of thermoelectric devices, and a parameter extracting technique only by electrical and temperature measurement by using Harman method was proposed. The proposed model and parameter extraction technique do not require experimental data from thermal conductivity measurements. The maximum error between extracted parameters extracted by proposed method and conventional method was about 14%, which is not a severe mismatch for real application. The proposed model is applicable to design of both for thermoelectric coolers and thermo electric generators.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.164-173
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• 2006

The cooling capacity of a micro-heat pipe is mainly governed by the magnitude of capillary pressure induced in the wick structure. For microchannel wicks, a higher capillary pressure is achievable for narrower and deeper channels. In this study, a metallic micro-heat pipe adopting high-aspect-ratio microchannel wicks is fabricated. Micromachining of high-aspect-ratio microchannels is done using the laser-induced wet etching technique in which a focused laser beam irradiates the workpiece placed in a liquid etchant along a desired channel pattern. Because of the direct writing characteristic of the laser-induced wet etching method, no mask is necessary and the fabrication procedure is relatively simple. Deep microchannels of an aspect ratio close to 10 can be readily fabricated with little heat damage of the workpiece. The laser-induced wet etching process for the fabrication of high-aspect-ratio microchannels in 0.5mm thick stainless steel foil is presented in detail. The shape and size variations of microchannels with respect to the process variables, such as laser power, scanning speed, number of scans, and etchant concentration are closely examined. Also, the fabrication of a flat micro-heat pipe based on the high-aspect-ratio microchannels is demonstrated.