• Progress in Superconductivity and Cryogenics
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• v.10 no.3
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• pp.27-31
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• 2008

In order to cool the SMES coil to the operating temperature, conduction cooling is generally used. However, it often consumes a large amount of electric power because of it's continuous cryocooler operation. This can also lead to poor thermal stability and serious protection problems of the system. Solid nitrogen (SN2) can counter those disadvantages in the conduction cooling system because it has a large heat capacity. Particularly, a large amount of enthalpy with a minimal weight to the cold body of SN2 makes a compact and portable system by increase a recooling to recooling time period (RRTP) value. A conceptual design of the proto-type SN2 cooling system for a portable HTS superconducting magnetic energy storage (SMES) system will be introduced in this paper.

• Progress in Superconductivity and Cryogenics
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• v.8 no.1
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• pp.59-64
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• 2006

A closed-loop cryogenic cooling system for high field magnets is presented. This design is motivated by our recent development of cooling system for 21 tesla Fourier Transform ion Cyclotron Resonance (FT-ICR) superconducting magnets without any replenishment of cryogen. The low temperature superconducting magnets are immersed in a subcooled 1.8 K bath, which is connected hydraulically to the 4.2 K reservoir through a narrow channel. Saturated liquid helium is cooled by Joule-Thomson heat exchanger and flows through the JT valve, isenthalpically dropping its pressure to approximately 1 6 kPa, corresponding saturation temperature of 1.8 K. Helium gas exhausted from pump is now recondensed by two-stage cryocooler located after vapor purify system. The amount of cryogenic Heat loads and required mass flow rate through closed-loop are estimated by a relevant heat transfer analysis, from which dimensions of JT heat exchanger and He II heat exchanger are determined. The detailed design of cryocooler heat exchanger for helium recondensing is performed. The effect of cryogenic loads, especially superfluid heat leak through the gap of weight load relief valve, on the dimensions of cryogenic system is also investigated.

• Proceedings of the Korean Society of Postharvest Science and Technology of Agricultural Products Conference
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• 2003.04a
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• pp.140-140
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• 2003

신선한 채소나 과일은 무게의 74~94%에 상당하는 수분을 함유하고 있는데, 이러한 수분은 자칫하면 빠져나가기 쉽다. 품질이 우수한 채소나 과일이라도 수분손실이 생기면 다시는 보충할 수 없기 때문에 겉껍질을 마르고 쭈글쭈글하게 되어 품질등급과 가격결정에 손해가 된다. 또 무게의 5~l0%까지 수분이 줄어들면 상품성을 잃게되고, 무게단위로 판매되는 채소와 과일은 수분손실이 곧 무게감소이므로 총수입도 줄어드는 원인이 된다. 따라서 채소나 과일을 수확 한 후에 수분손실이 생기지 않도록 잘 관리하는 것은 농가소득과 직결되는 중요한 일이다. 그러나 기존의 저온저장고들은 저장고 내의 상대습도가 70~85%의 범위로 조성되고 있으며, 이러한 저습도의 문제를 해결하기 위하여 저장고의 바닥에 물을 뿌리는 등의 작업을 하고 있으나 문제가 해결되지는 않는다. 이에 따라 농업기계화연구소에서는 저온저장고 내의 상대습도를 90% 이상으로 유지할 수 있는 유닛쿨러를 '01년에 개발하였고,'02~'03년에 이것을 실제로 농가의 저온저장고에 설치하여 그 효과를 실증하였는데 그 결과를 요약하면 다음과 같다. 1. 현장연구에 사용된 저온저장고는 천안시에 있는 이진기 농가의 25평형 배 저온저장고 2동이었으며, 한 동은 시험구로 한 동은 대조구로 사용하였다. 2. 배의 저장온도는 0~-0.2$^{\circ}C$이었고, 상대습도는 대비 저온저장고의 경우 75~90% 범위에 있었으나 신기술투입 저온저장고에서는 98%로 유지되었다. 또 냉각기에 생기는 얼음을 제거하기 위해 작동되는 전기히터의 작동시간은 대비 저온저장고에서는 하루에 7회, 회당 45분 씩 이었고, 신기술 투입 저온저장고에서는 하루에 1회, 회당 30분 씩 이었다. 3. 배를 플라스틱 상자에 담아 저장할 때 대비 저온저장고에서는 111일 동안에 11.7%의 중량감모가 발생하였으나, 신기술투입 저온저장고에서는 5.6%의 중량감모만이 발생하여 약 50%의 중량감모를 줄일 수 있었으며, 배의 색깔이나 경도도 대비구 보다 우수하였다. 4. 배를 비닐로 포장하여 대비 저온저장고에 저장한 경우와 비닐로 포장하지 않고 신기술투입 저온저장고에 저장한 경우를 비교할 때 11월~다음해 1월 까지는 중량감모, 과피색깔 및 경도에 큰 차이가 없었으나, 2월부터는 비닐로 포장하여 대비 저온저장고에 저장한 배의 품질변화가 급격히 증가되어 중량감모, 과피색깔 및 경도가 신기술 투입시 보다 급속하게 나빠졌다.

• Proceedings of the Optical Society of Korea Conference
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• 2007.07a
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• pp.243-244
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• 2007

본 연구에서는 성형용 코어 가공에서 초경합금(WC, Co 0.5%)의 초정밀 가공특성을 파악하기 위하여 다이아몬드 휠의 메시, 주축 회전속도, 터빈 회전속도, 이송속도 및 연삭깊이에 따른 표면거칠기를 측정하여 최적연삭조건을 규명하였다. 규명된 최적연삭가공조건을 활용하여 페러렐 연삭법으로 초정밀 연삭가공을 수행하였다. 연삭가공은 초정밀가공기(ASP01, Nachi-Fujikoshi Co., Japan)를 사용하였다. 최종 정삭가공을 수행한 비구면 성형용 코어의 형상측정결과 형상정도(PV; ${\varphi}$ 3.0mm) 0.15${\mu}m$(비구면), 0.10${\mu}m$(평면)으로 3M급 이상의 고화질 카메라폰에 채용되고 있는 비구면 Glass렌즈 양산용 성형용 코어 규격에 만족한 결과로서 본 연구에 수행된 초정밀 가공조건 및 측정방법이 매우 유효함을 알 수 있었다. 형상정도(PV) 및 표면조도(Ra) 측정은 초정밀 자유곡면 측정기(UA3P, Panasonic Co., Japan)와 3차원 표면조도 측정기(NewView5000, Zygo Co., USA)를 각각 사용하였다. 초정밀 가공된 성형용 코어면에 이온증착법을 활용하여 DLC 코팅을 수행하였다. 코팅 전후의 성형용코어를 활용하여 Glass소재(K-BK7, Sumita Co., Japan)를 최적의 성형조건(성형온도, 압력, 냉각속도)으로 성형하였다. DLC 코팅과 성형은 DLC 코팅기(NC400, Nanotech Co., Japan)와 Glass렌즈 성형기(Nano Press-S, Sumitomo Co., Japan)을 각각 사용하였다. Fig. 1은 초정밀 연삭가공, DLC 코팅막 구조, 코팅된 성형용 코어, 그리고, 성형된 비구면Glass렌즈를 각각 나타낸다.

• Food Science and Preservation
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• v.6 no.3
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• pp.313-318
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• 1999

The Properties of rice flour and consumed electricity to make rice flour were compared among three different process ; 1. roll mill after soaking rice in water, 2. roll mill after tempering, 3. try pin mill. When rice was milled by roll mill and pin-milled after tempering for 10 hrs(TRPMR), consumed electricity and moisture content of rice flour were the least. Particle size of rice flour prepared with TRPMR was 87.4% of 100 mesh or more which was the highest number among the rice flour prepared using different processes. Gelatinization temperature of the rice flour was 63.2$^{\circ}C$ and was 1.3$^{\circ}C$ lower than that of rice flour prepared with other processes. Viscosity of the rice flour prepared by TRPMR was the least. Whiteness of the rice flour prepared by TRPMR was similar to that of wheat flour.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.6
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• pp.155-166
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• 2016

It is important to configure capacitance(C) of the capacitor and the induction coefficient(L) of the work coil on the resonant circuit design stage in order to induce heating on the object by a precise and constant frequency components in the electromagnetic induction heating equipment. Work coil conducts a direct induction heating according to heating point and area of the object which has a fixed heat factor so that work coil is designed to has fixed value. On the other hands, Capacitor should be designed to be changed in order to be the higher the utilization of the entire equipment. It is extracted the samples by variation of single electrode capacity from the selection stage of raw materials for capacity to the stage of process design for output of the high frequency LC resonance of 700kHz on 1000 VAC maximum voltage and current to $200I_{MAX}$. It is suggested fundamental experiment results in order to prove relation for the optimal design of HF-LC resonance conduction-cooled capacitor based on the response of frequency characteristics and results of output parameters according to variation of the capacitance size.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.5
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• pp.27-37
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• 1999

A CMOS ReadOut Integrated Circuit (ROlC) for InfraRed Focal Plane Array (IRFPA) detector is presented, which is a key component in uncooled thermal imaging systems. The ROIC reads out signals from $64\times64$ Barium Strontium Titanate (BST) infrared detector array, then outputs pixel signals sequentially after amplifying and noise filtering. Various design requirements and constraints have been considered including impedance matching, low noise, low power dissipation and small detector pitch. For impedance matching between detector and pre~amplifier, a new circuit based on MOS diode structure is devised, which can be easily implemented using standard CMOS process. Also, tunable low pass filter with single~pole is used to suppress high frequency noise. In additions, a clamping circuit is adopted to enhance the signal~to-noise ratio of the readout output signals. The $64\times64$ IRFPA ROIC is designed using $0.65-\mu\textrm{m}$ 2P3M (double poly, tripple metal) N~Well CMOS process. The core part of the chip contains 62,000 devices including transistors, capacitors and resistors on an area of about $6.3-mm\times6.7-mm$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.2
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• pp.5-12
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• 2000

Uncooled metallic thin-film thermopile infrared detectors have been fabricated, and the figures of merit for the detectors were examined. The hot junctions of a thermopile were prepared on a $Si_{3}N_{4}/SiO_{2}/Si_{3}N_{4}$-membrane which acts as a thermal isolation layer, the cold junctions on the membrane supported with the silicon rim which functions as a heat sink, and Au-black was used as an infrared absorber. Infrared absorbance of Au-black, which strongly depends on the chamber pressure during Au-evaporation and its mass per area, was found to be about 90 ％ in the wavelength range from 3${\mu}{\textrm}{m}$ to 14${\mu}{\textrm}{m}$. Voltage responsivity, noise equivalent power, and specific detectivity of Bi-Sb thermopile infrared detector at 5 Hz-chopping frequency were about 10.5V/W, 2.3 nW/Hz$^{1/2}$, 및 $1.9\times10^{7}$ cm.Hz$^{1/2}$/w at room temperature in air, respectively.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.46 no.4
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• pp.94-101
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• 2009

In this paper, we propose design of hardware based on a high speed digital signal processor (DSP) and a field programmable gate array (FPGA) for real-time suppression of fixed pattern noise (FPN) using hardware neural networks (HNN) in cooled infrared focal plane array (IRFPA) imaging system FPN appears a limited operation by temperature in observable images which applies to non-uniformity correction for infrared detector. These have very important problems because it happen serious problem for other applications as well as degradation for image quality in our system Signal processing architecture for our system operates reference gain and offset values using three tables for low, normal, and high temperatures. Proposed method creates virtual tables to separate for overlapping region in three offset tables. We also choose an optimum tenn of temperature which controls weighted values of HNN using mean values of pixels in three regions. This operates gain and offset tables for low, normal, and high temperatures from mean values of pixels and it recursively don't have to do an offset compensation in operation of our system Based on experimental results, proposed method showed improved quality of image which suppressed FPN by change of temperature distribution from an observational image in real-time system.

• Economic and Environmental Geology
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• v.22 no.3
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• pp.253-266
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• 1989

The Cu-Pb-Zn-Ag hydrothermal vein type deposits which comprise the Dongil and Dong-cheogogsan mines occur within the Cretaceous sedimentary rocks in the Euiseong Basin of the southern Korean peninsula. The ore mineralization is contained within three stage(I,II and III) quartz and calcite veins. Ore minerals occur as dominant chalcopyrite, galena, sphalerite, tetrahedrite and Pb, Ag, Sb and Bi-bearing sulfosalts. Stage I ore minerals were deposited between $400^{\circ}C$ and $200^{\circ}C$ from the fluid with moderate salinities(7.0 to 4.5 eq. wt. % NaCl). Evidence of boiling suggests pressure of less than 150 bars during stage I mineralization. This pressure corresponds to maximum depths of 650 m and 1700 m, respectively, assuming lithostatic and hydrostatic loads. The data on mineralogy, temperature and salinity, together with information on the solubility of Cu complex, suggest that Cu deposition is a result of boiling coupled with declining temperature from $350^{\circ}$ to $250^{\circ}C$ or declining log $a_{o_2}$(from -29.8 to -35.9 atm.)and increasing in pH. Pb, Ag, Sb and Bi-bearing sulfosalts were deposited by cooling and dilution at temperature of less than $250^{\circ}C$ from the ore fluid with less than -35.9 atm. of log $a_{o_2}$.