• Proceedings of the Korean Information Science Society Conference
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• 2010.06b
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• pp.313-317
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• 2010

최근에는 반도체 공정 기술의 발달로 인하여 프로세서의 성능은 급속도록 발전하였다. 하지만 프로세서에서 소모되는 전력이 급속도록 증가하고, 이에 따라 발생된 높은 온도는 프로세서 신뢰성에 부정적인 영향을 미치고 있다. 그러므로 최근의 프로세서 설계 시 전력, 온도등도 성능과 함께 중요한 고려사항이다. 프로세서의 신뢰성에 치명적인 영향을 미치는 고온현상을 해결하기 위해서 여러 가지 연구가 이루어지고 있다. 대표적으로 방열 판, 냉각 팬 등을 이용한 기계적인 기법과 동적 온도 관리 기법, 연산 이관 기법등을 적용한 구조적인 기법이 활발하게 연구되고 있다. 이러한 기법들의 적용으로 프로세서의 온도를 효과적으로 제어할 수 있게 되었으나 기계적인 냉각 기법은 냉각 효율성이 높지 않다는 단점이 존재하고, 구조적 설계 기법을 통한 냉각기법은 온도를 제어하기 위해 프로세서의 성능을 저하시키는 치명적인 단점이 존재하기 때문에 두 기법 모두 더 많은 연구가 필요하다. 최근의 프로세서 온도 제어 연구의 초점은 부가적인 장치를 통해 프로세서 내에서 발생 된 온도를 제어하는 기계적인 냉각 기법에서 프로세서 내에서 발생하는 온도를 효과적으로 제어하여 프로세서의 신뢰성과 냉각 비용을 절감할 수 있는 구조적 설계 기법으로 이동하고 있다. 본 논문에서는 연구의 초점이 이동하는 원인에 대해 분석하고자 고성능 프로세서에서의 기계적 냉각 기법의 냉각 효율성을 분석하고자 한다. 실험 결과, 온도를 제어하는 데 있어서 매우 높은 비용($1^{\circ}C$ 감소 당 최대 3.58W, 평균 3.36W)이 소모되는 것으로 나타났다. 향후에는 구조적인 설계 기법의 냉각 효율성을 분석하는 실험을 진행하고자 한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.277-277
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• 2003

• Journal of Energy Engineering
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• v.25 no.1
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• pp.113-121
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• 2016

Polymer electrolyte membrane fuel cell(PEMFC) requires cooling system to maintain the proper operating temperature(about $65^{\circ}C{\sim}75^{\circ}C$) because the efficiency and power are affected by operating temperature. In order to retain the operating temperature of PEMFC, cooling system and coolant control logic are needed. Hardware-in-the-loop simulation(HILS) is one of effective methods to study and evaluate control algorithm. In this paper, the HILS system was designed to study the coolant control algorithm. The models of HILS system consisted of PEMFC, heat exchanger, and external environment associated with temperature. The hardwares in HILS system are 3-way valves, pumps, and a heat exchanger. The priority control and the control target temperature were investigated to improve the control performance using HILS. The 3-way valve in $1^{st}$ cooling circuit was selected as priority control target. The under limit value of $2^{nd}$ 3-way valve set as a function of PEMFC power and $2^{nd}$ circuit coolant temperature to correct temperature control performance. As a result, the temperature of PEMFC is stably controlled.

• Journal of the Korean Institute of Intelligent Systems
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• v.25 no.2
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• pp.147-154
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• 2015

In this paper, we propose human detection and fuzzy temperature control system for energy reduction of cooling device in elevator. In order to improve problems of existing cooling device using the refrigerant, energy reduction and efficient management are continuously achieved because of operation of thermoelectric cooling device using the human detection and fuzzy temperature control system. The proposed system confirms the number of passengers in elevator and temperature is then controlled by those numbers and an average temperature for the season in fuzzy system. The human detection method scans the number of passengers using a head part as a feature based on bird's-eye view camera in elevator. The fuzzy system determines elevator internal temperature considering atmospheric temperature and the scanned passenger numbers as a look-up table. The proposed system reduces energy of the cooling device through the human detection and temperature control. In experiment, energy reduction is confirmed and the performance of the proposed system is verified.

• Journal of the Korea Society of Computer and Information
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• v.16 no.7
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• pp.1-11
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• 2011

Many researchers have studied on the methods to improve the processor performance. However, high integrated semiconductor technology for improving the processor performance causes many problems such as battery life, high power density, hotspot, etc. Especially, as hotspot has critical impact on the reliability of chip, thermal problems should be considered together with performance and power consumption when designing high-performance processors. To alleviate the thermal problems of processors, there have been various researches. In the past, mechanical cooling methods have been used to control the temperature of processors. However, up-to-date microprocessors causes severe thermal problems, resulting in increased cooling cost. Therefore, recent studies have focused on architecture-level thermal-aware design techniques than mechanical cooling methods. Even though architecture-level thermal-aware design techniques are efficient for reducing the temperature of processors, they cause performance degradation inevitably. Therefore, if the mechanical cooling methods can manage the thermal problems of processors efficiently, the performance can be improved by reducing the performance degradation due to architecture-level thermal-aware design techniques such as dynamic thermal management. In this paper, we analyze the cooling efficiency of high-performance multicore processors according to mechanical cooling methods. According to our experiments using air cooler and liquid cooler, the liquid cooler consumes more power than the air cooler whereas it reduces the temperature more efficiently. Especially, the cost for reducing $1^{\circ}C$ is varied by the environments. Therefore, if the mechanical cooling methods can be used appropriately, the temperature of high-performance processors can be managed more efficiently.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.3
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• pp.327-335
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• 2015

In this paper, we propose an independent cooling control (ICC) scheme for high strength and atmosphere corrosion resisting steel to obtain the desired temperature and properties along the longitudinal direction of the steel in the run-out table (ROT) process. A temperature model of the independent process is developed to divide the ROT into front and back sections. The control concept uses field data, problem analysis, and a time-temperature transformation diagram. The effectiveness of the proposed control is verified using simulation results under a temperature disturbance by the transformation in the middle of the ROT. The results of a hot strip mill field test show that the temperature control performance is significantly improved by the proposed control scheme.

• Journal of the KSME
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• v.51 no.4
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• pp.37-40
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• 2011

이 글에서는 고효율 사출금형 온도제어를 위한 급속가열 및 냉각기술(Rapid mold heating and cooling)의 개요에 대해 소개하고, 국내외에 개발되어 있는 급속 금형가열 및 냉각기술의 현황 및 특성에 대해 비교분석을 제시하고자 한다.

• Korean Chemical Engineering Research
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• v.59 no.1
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• pp.77-84
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• 2021

To control hot spot in a plug flow reactor (PFR) is important for the yield and purity of products and safety. In this paper, coolant temperature is set as a state variable, and radial distributions of heat and mass are considered to model the PFR more realistic than without considering radial distributions. The model consists of three state variables, reactant concentration, reactant temperature, and the coolant temperature. The flow rate of the isothermal coolant is a manipulated variable. This paper shows that the controller considering the radial distributions of heat and mass is more effective than the controller without them. Assuming that u3,0 is 0.7, the suggested control equation was robust when St is bigger than 1.3, and Ac/A is smaller than 2.0. Under this condition, the hot spot temperature changed within the relative error of one percent when the temperature of input altered within the range of five percent.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.4
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• pp.429-435
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• 2011

In this study the operational characteristics of the temperature control system between an on-offemployed cooler and a bypass type cooler is analyzed. Currently an on-off controller employed coolerwhich is the industry's leading type on the market for industrial coolers is used. The new type cooler isused a bypass controller at discharge gas. The COP of the bypass controlled cooler with discharge gas is at least 8% higher than the on-off controlled cooler. The maximum COP difference is about 20%. Based on the results, the bypass control with discharge gas shows the possible temperature control with high precision.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1850-1858
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• 2014

The object of this study is to develop an cooling control algorithm for electronics devices of the electric vehicle. In order to estimate the existing cooling control logic of the electronic devices for the small and medium sized electric vehicle, the experiments on the coolant temperature variation of the cooling system were conducted under 4 different seasons conditions. As a result, the existing cooling control logic were overcooled when it was compared with the reference temperature for a required cooling load. In addition, the newly developed optimum cooling control logic for improving the mileages of the tested electric vehicle with consideration of the ambient temperature, vehicle speed, and refrigerant temperature of the air conditioning on/off is necessary.