• Title/Summary/Keyword: 나노부품

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Research for Patent Application Tendency in the In-Line System Manufacturing for Component of Nano Scale (Nano 스케일 부품 제조용 In-Line 시스템의 특허동향 분석에 관한 연구)

  • Kim, Seung-Min;Ko, Jun-Bin;Park, Hee-Sang
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.6
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    • pp.150-158
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    • 2008
  • This research considered that the significance of the NT(Nano Technology) which gradually increased the importance of it and investigated the technology development current situation of the Korea, U.S.A, Japanese, Europe. Therefore, in domestic and foreign, this research was widely used. It includes the tendency of the technology about processing methods using the ion beam and electron beam among the In-line system related technique field for the high efficiency energy beam application nano scale manufacturing components. The technique level of Korea, the international trend of technology and cooperation research present condition are dealt in. The information about the checked out of business of research and development of the country consistency and policy establishment try to be provided.

Fabrication of ZnO Nanowires by Green Technology (녹색기술을 이용하여 제작된 ZnO 나노선)

  • Lee, Geun-Hyoung
    • Korean Journal of Metals and Materials
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    • v.50 no.3
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    • pp.233-236
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    • 2012
  • ZnO nanowires were fabricated through thermal evaporation of Zn or ZnS powder using solar energy. The Zn or ZnS powder was heated and evaporated by sunlight. The sunlight was concentrated on the Zn or ZnS powder by a converging lens and then the Zn or ZnS powder was evaporated and oxidized in air. After oxidation, ZnO nanowires were fabricated in the focal point. Strong ultraviolet emission, which corresponds to the near band-edge emission, was observed from the ZnO nanowires synthesized using Zn powder as a source material. Meanwhile, green emission, related to intrinsic defects such as oxygen vacancies, prevailed for the ZnO nanowires fabricated using ZnS powder. No catalysts were used in the fabrication of the ZnO nanowires, which suggested the ZnO nanowires were grown by a vapor-solid mechanism.

Heating Characteristics of Planar Heater Fabricated with Different Mixing Ratios of MXene-CNT-WPU Composites (MXene-CNT-WPU 복합소재 기반 면상발열체의 배합 비율에 따른 발열 특성)

  • Hyo-Jun, Oh;Quy-Dat, Nguyen;Yoonsik, Yi;Choon-Gi, Choi
    • Clean Technology
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    • v.28 no.4
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    • pp.278-284
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    • 2022
  • This study presents an excellent planar heater based on low-dimensional composites. By optimizing the ratio of 1D carbon nanotubes (CNT) and 2D MXene (Ti3C2TX), it is possible to create a planar heater that has superior electrical conductivity and high heat generation characteristics. Low-dimensional composites were prepared by mixing CNT paste and MXene solution with eco-friendly waterborne polyurethane (WPU). In order to find the optimal mixing ratio for the MXene-CNT-WPU composites, samples with MXene to CNT weight ratios of 3:1, 1:1, 1:3, 1:7, and 1:14 were investigated. In addition to these different weight ratios, 5 wt% WPU was equally applied to each sample. It was confirmed that the higher the weight ratio of CNT, the lower the sheet resistance and the higher the heating temperature. In particular, when the MXene-CNT-WPU planar heater was fabricated by mixing MXene and CNT at a weight ratio of 1:7 and 1:14, the heating temperature was higher than the heating temperature of a CNT-WPU planar heater. These characteristics are due to the optimized mixture of the 1D materials (CNT) and the 2D materials (MXene) causing the formation of a flat surface and a dense network structure. The low-dimensional composites manufactured with the optimized mixing ratios found in this study are expected to be applied in flexible electronic devices.

Warpage and Solder Joint Strength of Stacked PCB using an Interposer (인터포저를 이용한 Stacked PCB의 휨 및 솔더 조인트 강도 연구)

  • Kipoong Kim;Yuhwan Hwangbo;Sung-Hoon Choa
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.3
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    • pp.40-50
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    • 2023
  • Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.

Preparation of $Bi_2Te_3$ Thermoelectric Materials by Co-precipitation Method (공침법을 이용한 $Bi_2Te_3$ 열전재료의 제조)

  • Kim, Dong-Hwan;Im, Hee-Joong;Je, Koo-Chul;Kang, Young-Jin;Ahn, Jeung-Sun;Tadaoki Mitani;Nam, Tae-Hyun;Shim, Young-Jae
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.03a
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    • pp.167-167
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    • 2003
  • 현대 산업이 발전함에 따라 전자부품의 초소형화, 고성능화가 요구되어지고 있으며, 이러한 점에 부응하기 위하여 Pottier 효과를 이용하여 국부냉각이 가능한 열전재료에 대한 많은 연구가 이루어지고 있다. 열전재료에는 사용온도 영역에 따라 여러 종류가 있지만, Bi-Te계 열전재료는 상온영역에서 가장 성능지수(Z=$\alpha$$^2$$\sigma$/$textsc{k}$, $\alpha$는 Seebeck 계수, $\sigma$는 전기전도도, $textsc{k}$는 열전도도)가 높아 각종 냉각소자로서 사용되어 지고 있다. 하지만, 초소형 전자부품의 국부냉각을 위해서는 성능지수의 향상, 특히, 저온 영역에서의 성능지수의 향상이 요구되고 있다. 본 연구에서는 Bi-Te계 열전재료의 성능지수를 향상시키기 위하여, 열전도도의 저하에 의한 성능지수의 향상을 연구목적으로 하였다 열전도도는 전자에 의한 열전도도(K$_{e}$)와 phonon에 의한 열전도도(K$_{p}$)로 이루어지며, 전기전도도에 큰 영향을 미치지 않는 결정립 사이즈영역에서 결정립의 크기를 미세화 하면, 결정입계에서의 phonon의 산란이 증가하여 phonon에 의한 열전도도를 저하시킴으로서 성능지수의 향상이 기대된다. 따라서 본 연구에서는 나노사이즈 분말의 제조에 많이 이용되며 입자크기의 조절이 용이한 공침법을 이용하여 Bi-Te계 열전재료 분말을 제조하고 열전재료에의 적용가능성을 검토하였다.

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The Development of a textile material for transportation through the companies cooperation linking (수송용 섬유소재산업 글로벌경쟁력강화 초광역벨트 연계기술개발)

  • Park, S.M.;Jeon, S.K.;Kim, M.S.;Yoon, J.G.;Kim, M.S.
    • Proceedings of the Korean Society of Dyers and Finishers Conference
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    • 2012.03a
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    • pp.17-17
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    • 2012
  • 수송용 섬유소재는 자동차, 항공기 또는 선박 등의 교통 및 운송 분야에 기여하는 사용되는 섬유소재를 말하며, 내장재, 각종 호스류, 벨트류, 타이어, 안전용품, 필터류 등을 포함하고 일반적으로 섬유, 발포체, 고무, 플라스틱, 접착제 등 유기소재가 결합된 복합체이다. 기존 섬유기술의 혁신과 더불어 IT, NT, BT, ET 등 첨단 기술과의 융합에 의한 고성능 극한 슈퍼섬유, 나노 복합섬유 등의 신소재를 개발하여 산업 전반에서 플라스틱의 금속소재 대체수요를 증가시키고 산업자재의 고성능화, 고기능화, 다양화를 이루기 위해 다양한 노력이 진행하고 있다. 현재 수송용 섬유소재 산업은 기술의 연결고리가 부족하며, 선도기업 및 원천기술이 부족하며, 자동차용 섬유부품소재 관련 기업의 역량도 부족한 실정이다. 이에 광역경제권 연계협력사업을 통해 생산기반의 대경권(대구경북)과 수요중심의 동남권(부산경남)의 네트워크를 강화하여 완성품 업체 및 수요기업과의 네트워킹을 강화하고자 한다. 따라서 본 연구에서 수송용 섬유소재개발, 수송용 친환경 oam-skin 일체형 표피재 개발, 고속성형 복합소재 및 수송용 경량부품 개발, 초경량 고내열 고강도 섬유활용 하이브리드 wire & cable 개발 등 수송용 섬유소재를 개발하고, 또한 수송용 섬유소재의 생산-수요 연계를 통한 투자활성화, 기술개발, 소재 산업 육성을 강화하여, 산학연네트워크구축, 지역 간 협력 및 국제적 협력, 생산-수요기반의 연계협력시스템을 활용한 자립형 수송용 소재 공급기지 완비하는 데 목적이 있다.

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Development and prospect of Smart EMW Absorber for Protection of Electronic Circuits and Devices with Heat Radiating Function (전자회로 및 부품 보호용 방열기능형 스마트 전파 흡수체의 개발과 전망)

  • Kim, Dong Il;Park, Soo Hoon;Joo, Yang Ick
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.19 no.5
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    • pp.1040-1046
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    • 2015
  • With the rapid progress of electronics and radio communication technology, human enjoys greater freedom in information communication. However, EMW (Electro-Magnetic Wave) environments have become more complicate and difficult to control. Thus, international organizations, such as the American National Standard Institution (ANSI), Federal Communications Commission (FCC), the Comite Internationale Special des Perturbations Radio Electrique (CISPR), etc, have provided standard for controlling the EM wave environments and for the countermeasure of the electromagnetic compatibility (EMC). In this paper, the status of EMW absorbers and the goal of smart EMW absorber in the future were described. Furthermore, design method of the smart EM wave absorber with heat radiating function was suggested. The designed smart EM wave absorber has the absorption ability of more than 20 dB from 2 GHz to 2.45 GHz band, the optimum aperture (hole) size, the adjacent hole space, and the thickness of which were 6 mm, 9 mm, and 6.5 mm, respectively. Thus, it is respected that these results can be applied as various EMC devices in electronic, communication, and controlling systems.

Application of Ultrafast Laser for Micro-packaging and Germanium Surface Processing (초고속레이저 기반 마이크로 패키징 및 게르마늄 표면 공정 기술 개발)

  • Jeoung, S.C.;Yahng, J.S.
    • Journal of the Korean Vacuum Society
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    • v.16 no.1
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    • pp.74-78
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    • 2007
  • Much interests has been drawn for noble micro-engineering processes for the continuous size reduction on bulk materials from the field of micro-electronics with much downsized IC chips. A traditional microprocessing based on mechanical blade as well as a relatively long pulsed laser usually influence the physico-chemical properties of intact materials when the techniques are applied to process materials with a spatial resolution less than 10 microns. Meanwhile, ultrafast laser pulses are known to exhibit a very small heat-affect zone(HAE) compared to the traditional laser processing and to be applicable for the new functional materials with high performance in optical and electrical properties. In this report, we will review in brief the recent research works on the enhancement of micro-cutting speed of thin silicon wafer as well as the formation of Ge nanostructures based on ultrafast laser pulses.

The Photoluminescence Properties of Er doped Alumina Sol-Gel Films Coated on Si Substrates (Er이 도핑된 알루미나 졸-겔 코팅막의 광발광 특성)

  • 권정오;황영영;김재홍;석상일
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.03a
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    • pp.223-223
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    • 2003
  • 광통신에는 광신호의 전송과 광신호 처리에 처리 과정에서 광 손실을 수반하므로 각 요소별로 광신호 증폭이 반드시 필요하다. 또한 광통신망의 완전 광화를 위해서는 제조 공정이 간단하여 가격이 저렴하고, 높은 신뢰성과 높은 증폭 효율을 가지면서 다른 부품과의 집적화가 가능한 광도파로형 광증폭기가 요구되고 있다 그러나 실리카는 광통신 파장대인 1.55$\mu\textrm{m}$대역의 증폭이 가능한 Er 이온에 대한 용해도가 50ppm 이하로 낮아 lmol% 이상 고농도로 Er 이온을 첨가하여 높은 증폭 효율을 얻는데 한계를 가지고 있다. 따라서 본 연구에서는 Er 이온에 대하여 높은 용해 특성을 가지고 있어 고농도 Er 이온 도핑이 가능한 알루미나에 Er을 1-2 mol% 첨가하여 광발광 특성을 조사하였다. Er이 첨가된 알루미나 나노 졸은 Al(NO$_3$)$_3$ㆍ9$H_2O$와 Er(NO$_3$)$_3$.5$H_2O$가 일정 양 용해된 수용액에 NH$_4$OH를 가하여 침전물을 얻고 여과 및 수세하여 졸 입자의 함량이 약 5wt%가 되게 이온교환수와 해교제인 초산을 소량 가하여 10$0^{\circ}C$에서 약 50시간 열처리하는 방법으로 제조하였다. Er이 첨가된 알루미나 코팅막은 Er 이 첨가된 알루미나 나노 졸에 GPS(3-glycidoxypropyltriethoxysilane)를 Al에 대하여 7 mol% 가하여 스핀 코팅법으로 제조하였다. Si 기판에 코팅하고, 상온에서 90$0^{\circ}C$까지 각 1시간 열처리한 코팅막의 광 발광 특성은 Er 이온의 첨가량과 열처리로 변화된 알루미나 코팅막의 결정상과 연계하여 논의 될 것이다. X-선 회절법으로 분석한 알루미나 코팅막의 온도에 따른 결정상은 boehmite 상에서 약 50$0^{\circ}C$이후에 ${\gamma}$-Al$_2$O$_3$로 전이하고 있다.

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Electrical Properties of YSZ Electrolyte Film Prepared by Electron Beam PVD (EB-PVD법에 의해 제조된 YSZ 전해질의 전기적 특성)

  • Shin, Tae-Ho;Yu, Ji-Haeng;Lee, Shiwoo;Han, In-Sub;Woo, Sang-Kuk;Hyun, Sang-Hoon
    • Journal of the Korean Ceramic Society
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    • v.42 no.2 s.273
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    • pp.117-122
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    • 2005
  • Electron Beam Physical Vapor Deposition (EB-PVD) is a typical technology for thermal barrier coating with Yttria Stabilized Zirconia (YSZ) on aero gas turbine engine. In this study EB-PVD method was used to fabricate dense YSZ film on NiO-YSZ as a electrolyte of Solid Oxide Fuel Cell (SOFC). Dense YSZ films of -10 $\mu$m thickness showed nano surface structure depending on deposition temperature. Electrical conductivities of YSZ film and electric power density of the single cell were evaluated after screen- printing $LaSrCoO_3$ as a cathode.