• Title/Summary/Keyword: 김 열

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Farm survey on the application of solar energy system to the controlled culture (태양열을 이용한 난방시스템의 시설재배 실용화 실태 조사)

  • 남상영;강한철;김태수;김인재;김민자;이철희
    • Korean Journal of Plant Resources
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    • v.13 no.3
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    • pp.249-254
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    • 2000
  • Heating supply system using solar energy-collecting plate was examined for 20 farmers. Some problems, resolution, future energy system, and basic information were discussed, Installation cost was approximately 18 million won/20a. Main crops cultured were tomato(30%) and floricultural crop(40%). Minor crops cultured were grape, red pepper, cucumber, lettuce, and strawberry. Information was mostly obtained from agricultural service agents. 75% of farm house hold reported that energy reduction effect was below 20%, showing some different result compared with over 20% that was totalized from agricultural service agents. Cost of installation was excessive in considering energy reduction effect. Another problem was insufficient technical proficiency of solar energy company.

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Development and Design Verification of Thermal Control Subsystem for EOS-C Ver.3.0 Flight Model (EOS-C Ver.3.0 비행모델의 열제어계 개발 및 설계 검증)

  • Chang, Jin-Soo;Yang, Seung-Uk;Kim, Ee-Eul
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.40 no.10
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    • pp.872-881
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    • 2012
  • The Flight Model (FM) of a high-resolution electro-optical camera (EOS-C Ver.3.0), the mission payload of an Earth observation satellite, was successfully developed by Satrec Initiative. We designed it to give improved thermal representatives compared with the Structural-Thermal Model (STM) by optimizing the thermal characteristics based on the STM thermal vacuum test results. We developed the FM and verified the workmanship by performing the acceptance level thermal vacuum test. We also conducted the verification of its Thermal Mathematical Model (TMM) by the thermal balance test. As the result, it was confirmed that TMM faithfully represents the thermal characteristics of the EOS-C Ver.3.0 FM.

Thermal Design of MGSE Panel for Thermal Vacuum Test of Ka-band Engineering Qualification Model Payload of Communications and Broadcasting Satellite (통신방송위성 Ka-대역 기술인증모델 탑재체의 열진공시험을 위한 MGSE 패널 열설계)

  • Kim, Jeong Hun;Choe, Seong Bong;Yang, Gun Ho
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.31 no.2
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    • pp.96-102
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    • 2003
  • The thermal design of MGSE(Mechanical Ground Support Equipment) panel is performed for thermal vacum thest of Ka-band EQM(Engineering Qualification Model) payload of communications and broadcasting satellite. The thermal environments are predicted to evaluate the performance of transponder equipments in the thermal vacum chamber. SINDA is used to verify the thermal design of the heat pipe layout. Embedded 16 heat pipes in the EQM payload developed for Ka-band trasponder equipments are designded properly. The heat fluz loaded on the external facesheet is 265W/㎡ for the hot platear function test of the traspinder equipments, and the zero heat flux for the cold plateau case. The maxium predicted heat transport capability is 2723 W-cm.

Equipment for Measuring the Adiabatic Temperature Rise of Concrete by Compensating Heat Loss (열손실량 보정을 통한 콘크리트 단열온도상승량 예측 장치)

  • Jin, Eun-Woong;Kim, Chin-Yong;Kim, Jin-Keun
    • Journal of the Korea Concrete Institute
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    • v.24 no.5
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    • pp.535-542
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    • 2012
  • Adiabatic temperature rise test for predicting heat of hydration in mass concrete is especially inconvenient in the field. In order to overcome the problem, the equipment to effectively and conveniently measure semi-adiabatic temperature change was developed. The main objective of this paper is to propose a new and simple equipment for measuring semi-adiabatic temperature rise by using insulation bottles. In order to predict exact heat loss of concrete using this device, it is required to assume the specific heat loss coefficient of the device by water temperature change inside the experimental device. According to experimental and analytical results, the adiabatic temperature rise does not have significant differences in changes of temperature and humidity of air, as well as initial temperature of water. By comparing adiabatic temperature rise tests, the equipment for measuring semi-adiabatic temperature change can be used to predict the hydration heat of concrete within sufficient accuracy.

Thermal Analysis of Satellite Panel Using Carbon Composites (탄소복합재를 이용한 위성 패널의 열해석)

  • Jun, Hyoung-Yoll;Kim, Jung-Hoon;Park, Jong-Seok;Park, Kun-Joo
    • Aerospace Engineering and Technology
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    • v.10 no.2
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    • pp.114-120
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    • 2011
  • Thermal control of satellite is mainly based on passive ways, such as the radiator made of aluminum honeycomb core with aluminum skins and OSR (Optical Solar Reflector). Additionally, for the thermal control of high dissipation unit, the aluminum doubler and heat pipe are utilized. Recently, efforts to find advanced thermal materials have been carried out to enhance heat rejection capability without increasing satellite size, weight and cost. This paper handles the carbon composites have high thermal conductivity with light weigh and have been considered as future thermal control materials to replace aluminum based radiator and doubler. Thermal analysis of satellite panel using APG(Annealed Pyrolytic Graphite) and carbon-carbon composites were performed and temperature contours were compared with the conventional thermal control methods.

Thermal and Stress Analysis of Power IGBT Module Package by Finite Element Method (유한요소법에 의한 대전력 IGBT 모듈의 열.응력해석)

  • 김남균;최영택;김상철;박종문;김은동
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.4
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    • pp.23-33
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    • 1999
  • A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

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