• Journal of the Korean Society of Radiology
• /
• v.81 no.2
• /
• pp.272-289
• /
• 2020

Current advances in CT techniques allow thorough evaluation of the beating heart. The strengths of cardiac CT relative to echocardiography and magnetic resonance imaging are its high availability in most institutions, rapid production of high-quality images, and outstanding delineation of the anatomy. For many normal variants and pathologic conditions, such as thrombi, masses, and congenital abnormalities of the left atrium, CT findings are sufficient to make a presumptive diagnosis. Assessments of the left atrium and left atrial appendage are particularly important for the management of atrial fibrillation, as various catheter-based procedures are aimed at the mechanical and electrical isolation of these structures. CT offers information crucial to a successful catheter-based procedure or surgery. Therefore, a comprehensive review of the geometry (shape, size, and relative position), along with various CT imaging features of pathologic states, should be provided in radiology reports to be of clinical value.

• Korean Journal of Construction Engineering and Management
• /
• v.25 no.2
• /
• pp.11-22
• /
• 2024

Power plant engineering industry obtains EPC plan project and delivers results about electricity, measurement, machinery, and piping and so on. Its works are taken by projects. Although power plant engineering composes 2~5% of whole EPC project cost, it's one of the fundamentals because it affects process after planning step a lot. However, domestic power plant engineering companies' project performance ability is insufficient and there's a need for systematic performance. Thus, this study defined related factors of successful performance and analyzed the priority among them through analytical hierarchy process. All respondents recognized experience, knowledge, and communication as important factors. Administrators considered knowledge, experience, and communication. But hands-on workers considered experience, knowledge, human resources. Those who have experience in oversea project considered process, experience, human resources. However those who don't have experience in oversea project considered knowledge, experience, and communication. Recognition of important factors varies by the position and work experience of members.

• Journal of Korea Foundry Society
• /
• v.44 no.4
• /
• pp.97-102
• /
• 2024

In this study, the properties of Zr-14Cu-7.5Ni-2.6Al wide ribbon with amorphous structure and properties were analyzed using Hall effect, SEM-EDX, and XRD. Made by melt spinning method, this Zr-14Cu-7.5Ni-2.6Al based alloy ribbon is not more than 96 ㎛ thick and 100 mm wide. This amorphous alloy exhibited tensile strength of 1,641 MPa, yield strength of 1,541 MPa, elongation of 1% and elastic modulus of 98GPa. The bulk concentration, resistivity, and mobility values are midway between general heavy doping ceramics and metals, and they are about 100 times weaker than ordinary metals, so they are close to Si and have good electrical conductivity. In addition, folding tests were conducted at extreme temperatures, withstanding 150,000 times at -20℃, 300,000 times at 24℃, and 150,000 times at 60℃, with no folding defects observed. These results demonstrate the excellent durability and reliability of the Zr-14Cu-7.5Ni-2.6Al wide ribbon alloy and suggest the possibility of developing electronic products using this alloy.

• Applied Chemistry for Engineering
• /
• v.35 no.4
• /
• pp.309-315
• /
• 2024

Silicon and carbon composite (SiC) is considered one of the most promising anode materials for the commercialization of Si-based anodes, as it could simultaneously satisfy the high theoretical capacity of Si and the high electronic conductivity of carbon. However, SiC active material undergoes repeated volumetric changes during charge/discharge processes, leading to continuous electrolyte decomposition and capacity fading, which is still considered an issue that needs to be addressed. To solve this issue, we suggest a 4,4'-Methylenebis(cyclohexyl isocyanate) (H₁₂MDI)-based waterborne polyurethane binder (HPUD), which forms a 3D network structure through thermal cross-linking reaction. The cross-linked HPUD (denoted as CHPU) was prepared using an epoxy ring-opening reaction of the cross-linker, triglycidyl isocyanurate (TGIC), via simple thermal treatment during the SiC anode drying process. The SiC anode with the CHPU binder, which exhibited superior mechanical and adhesion properties, not only demonstrated excellent rate and cycling performance but also alleviated the volume expansion of the SiC anode. This work implies that eco-friendly binders with cross-linked structures could be utilized for various Si-based anodes.

• Korean Chemical Engineering Research
• /
• v.62 no.3
• /
• pp.274-280
• /
• 2024

Machine learning techniques utilizing neural networks have been employed in various fields such as disease gene discovery and diagnosis, drug development, and prediction of drug-induced liver injury. Disease features can be investigated by molecular information of DNA. In this study, we developed a neural network to predict the length of DNA and the number of DNA species in mixture solution which are representative molecular information of DNA. In order to address the time-consuming limitations of gel electrophoresis as conventional analysis, we analyzed the dynamic data of a microfluidic concentrating device. The dynamic data were reconstructed into a spatiotemporal map, which reduced the computational cost required for training and prediction. We employed a convolutional neural network to enhance the accuracy to analyze the spatiotemporal map. As a result, we successfully performed single DNA length prediction as single-variable regression, simultaneous prediction of multiple DNA lengths as multivariable regression, and prediction of the number of DNA species in mixture as binary classification. Additionally, based on the composition of training data, we proposed a solution to resolve the problem of prediction bias. By utilizing this study, it would be effectively performed that medical diagnosis using optical measurement such as liquid biopsy of cell-free DNA, cancer diagnosis, etc.

• The Korean Journal of Physiology
• /
• v.24 no.1
• /
• pp.39-49
• /
• 1990

It has been reported that bombesin induces contraction of the smooth muscle of the gastrointestinal tract. Thus, the present investigation was undertaken to see an influence of bombesin on electrical activity of the gastric smooth muscle, since electrical activity is associated with contractile activity in the smooth muscle of the stomach. Smooth muscle strips $(5\;{\times}\;1.5\;cm)$ that included the corpus and antrum were prepared from the ventral and dorsal portion of the feline stomach along the greater curvature. Circular muscle strips $(1\;{\times}\;0.3\;cm)$ of the corpus were also obtained. Electrical activity of the corpus and antrum of the muscle strip was monophasically recorded by using Ag-AgCl capillary electrodes placed on the circular muscle layer. Contractile activity of the circular muscle strip was also recorded. The recordings were performed in Krebs-Ringer solution that was continuously aerated with $O_{2}$ containing 5% $Co_{2}$, and kept at $36^{\circ}C$. Dose-related responses of electrical activity and contractility to bombesin was studied after frequency of slow waves and contraction of each strip reached to a steady state. An action of $D-leu^{13}-{\psi}\;(CH_{2}NH)-D-leu^{14}-bombesin,\;D-pro^{2}-D-trp^{7,9}-substance\;P$, tetrodotoxin, hexamethonium, atropine, phentolamine or propranolol on the effect of bombesin was also observed. 1) Bombesin increased frequency of slow waves and contractions dose-dependently at concentrations from $10^{-9}\;M\;to\;3\;{\times}\;10^{-8}\;M$. 2) The bombesin analogue at a concentration of $3\;{\times}\;10^{-7}\;M$ antagonized the effect of bombesin on frequency of slow waves. 3) The effect of bombesin on frequency of slow waves was inhibited by tetrodotoxin $(10^{-6}\;M)$ and hexamethonium $(10^{-3}\;M)$ but unaffected by atropine $(10^{-6}\;M)$, phentolamine $(10^{-5}\;M)$ and propranolol $(10^{-5}\;M)$. 4) The effect of bombesin on frequency of slow waves was blocked by the substance P analogue at a concentration of $10^{-5}\;M$. 5) Substance P at a concentration of $10^{-5}\;M$ failed to change frequency of slow waves. It is concluded from the above results that bombesin increases the frequency of slow waves as well as contractions of the smooth muscle strip from the feline stomach, and the effect of bombesin might be mediated by non-cholinergic or non-adrenergic mechanism at neuromuscular junction. However, enteric nerves that have substance P as a neurotransmitter do not appear to participate in the action of bombesin on frequency of slow waves.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.375-375
• /
• 2010

CdTe as an absorber material is widely used in thin film solar cells with the heterostructure due to its almost ideal band gap energy of 1.45 eV, high photovoltaic conversion efficiency, low cost and stable performance. The deposition methods and preparation conditions for the fabrication of CdTe are very important for the achievement of high solar cell conversion efficiency. There are some rearranged reports about the deposition methods available for the preparation of CdTe thin films such as close spaced sublimation (CSS), physical vapor deposition (PVD), vacuum evaporation, vapor transport deposition (VTD), closed space vapor transport, electrodeposition, screen printing, spray pyrolysis, metalorganic chemical vapor deposition (MOCVD), and RF sputtering. The RF sputtering method for the preparation of CdTe thin films has important advantages in that the thin films can be prepared at low growth temperatures with large-area deposition suitable for mass-production. The authors reported that the optical and electrical properties of CdTe thin film were closely connected by the thickness-uniformity of the film in the previous study [1], which means that the better optical absorbance and the higher carrier concentration could be obtained in the better condition of thickness-uniformity for CdTe thin film. The thickness-uniformity could be controlled and improved by the some process parameters such as vacuum level and RF power in the sputtering process of CdTe thin films. However, there is a limitation to improve the thickness-uniformity only in the preparation process [1]. So it is necessary to introduce the external or additional method for improving the thickness-uniformity of CdTe thin film because the cell size of thin film solar cell will be enlarged. Therefore, the authors firstly applied the chemical mechanical polishing (CMP) process to improving the thickness-uniformity of CdTe thin films with a G&P POLI-450 CMP polisher [2]. CMP process is the most important process in semiconductor manufacturing processes in order to planarize the surface of the wafer even over 300 mm and to form the copper interconnects with damascene process. Some important CMP characteristics for CdTe were obtained including removal rate (RR), WIWNU%, RMS roughness, and peak-to-valley roughness [2]. With these important results, the CMP process for CdTe thin films was performed to improve the thickness-uniformity of the sputtering-deposited CdTe thin film which had the worst two thickness-uniformities of them. Some optical properties including optical transmittance and absorbance of the CdTe thin films were measured by using a UV-Visible spectrophotometer (Varian Techtron, Cary500scan) in the range of 400 - 800 nm. After CMP process, the thickness-uniformities became better than that of the best condition in the previous sputtering process of CdTe thin films. Consequently, the optical properties were directly affected by the thickness-uniformity of CdTe thin film. The absorbance of CdTe thin films was improved although the thickness of CdTe thin film was not changed.

• Korean Chemical Engineering Research
• /
• v.45 no.5
• /
• pp.466-472
• /
• 2007

A technology platform for wafer-level three-dimensional integration circuits (3D-ICs) is presented, and that uses wafer bonding with low-k polymeric adhesives and Cu damascene inter-wafer interconnects. In this work, one of such technical platforms is explained and characterized using a test vehicle of inter-wafer 3D via-chain structures. Electrical and mechanical characterizations of the structure are performed using continuously connected 3D via-chains. Evaluation results of the wafer bonding, which is a necessary process for stacking the wafers and uses low-k dielectrics as polymeric adhesive, are also presented through the wafer bonding between a glass wafer and a silicon wafer. After wafer bonding, three evaluations are conducted; (1) the fraction of bonded area is measured through the optical inspection, (2) the qualitative bond strength test to inspect the separation of the bonded wafers is taken by a razor blade, and (3) the quantitative bond strength is measured by a four point bending. To date, benzocyclobutene (BCB), $Flare^{TM}$, methylsilsesquioxane (MSSQ) and parylene-N were considered as bonding adhesives. Of the candidates, BCB and $Flare^{TM}$ were determined as adhesives after screening tests. By comparing BCB and $Flare^{TM}$, it was deduced that BCB is better as a baseline adhesive. It was because although wafer pairs bonded using $Flare^{TM}$ has a higher bond strength than those using BCB, wafer pairs bonded using BCB is still higher than that at the interface between Cu and porous low-k interlevel dielectrics (ILD), indicating almost 100% of bonded area routinely.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2017.05a
• /
• pp.165-165
• /
• 2017

지난 수 십 년 동안, 전 세계적으로 자원의 소비가 급격히 증가하게 되면서 최근 자원 고갈은 물론 환경오염이 커다란 이슈로 문제가 되고 있다. 이에 따라 재료 관련 분야에 있어서는 보다 효율적이고 친환경적인 방법으로 자원을 활용해야 된다는 필요성이 대두되었고 이와 같은 관점에서 목적하는 성분이 우수하고 환경 친화적인 표면처리 재료 개발연구가 활발하게 진행되고 있는 실정이다. 그 중 플라즈마 전해 산화(Plasma Electrolytic Oxidation, PEO)는 알루미늄, 마그네슘 등의 경금속의 경도를 향상시키고 높은 내마모성, 내식성을 갖게 하는 표면처리로써 그 관심이 증가하고 있다. 이 플라즈마 전해 산화는 일반적으로 공정비용 대비 효과적이고 환경 친화적이며 코팅 성능 면에서 우수하다고 알려져 있다. 이러한 고유한 특성으로 인해 플라즈마 전해 산화 코팅은 최근 몇 년 동안 기계, 자동차, 우주항공, 의학 및 전기 산업 등의 분야에서 그 적용이 점차 증가하고 있는 상황이다. 한편, 플라즈마 전해 산화 코팅을 하는 모재들의 경우 부동태 산화피막을 용이하게 형성할 수 있는 특성의 모재에 한정되고 있어서 그 응용확대에 한계가 있는 것이 사실이다. 따라서 본 연구에서는 플라즈마 전해 산화법을 사용하여 용융알루미늄도금 강판 상에 산화피막 형성을 시도하였다. 전원공급 장치의 양극은 전해질 속에 잠겨있는 작동전극에 연결하고 음극은 대전극 역할을 하는 스테인레스강 전해질 용기에 연결되었다. 전해질은 Sodium Aluminate 및 기타 첨가제를 함유한 것을 사용하였고 온도는 열교환기를 사용하여 $30^{\circ}C$ 이하로 유지되었다. 또한 여기서 전류밀도는 $5{\sim}10A/dm^2$, 실험 주파수는 700Hz, Duty cycle은 30 및 90%의 각 조건에서 공정처리 시간을 각각 30분 및 60분 동안 진행하였다. 이와 같은 조건에서 형성한 막들에 대해서는 주사형전자현미경(SEM)을 이용하여 코팅 막의 표면 및 단면의 모폴로지를 관찰하였음은 물론 EDS 및 XRD 측정을 통하여 원소조성분포 및 결정구조를 각각 분석하였다. 또한 이 코팅 막들에 대한 내식성은 5% 염수분무 환경 중 노출시험(Salt spray test), 3% NaCl 용액에서의 침지 시험 및 전기화학적 동전위 양극분극(Potentiodynamic Polarization) 시험을 진행하여 평가하였다. 이상의 실험결과에 의하면, 제작조건별 플라즈마 전해 산화 코팅 막의 모폴로지 및 결정구조가 상이하게 나타나는 것을 알 수 있었다. 코팅 막의 모폴로지 관찰 결과, 공정 시간에 비례하여 표면에 존재하는 원형 기공의 수는 감소하였으나 그 크기가 커지고 크레이터의 직경 또한 커진 것이 확인되었다. 이 기공은 마이크로 방전에 의해 형성된다고 알려져 있는데 공정 시간이 증가함에 따라 코팅 두께가 점차 증가하여 마이크로 방전의 빈도수가 줄어들고 그 강도는 증가하게 되어 기공 크기가 증가한 것으로 사료된다. 또한 공정시간이 긴 시편에서 표면에 크랙이 다수 존재하는 것으로 확인되었다. 이것은 방전에 의해 고온이 된 소재가 차가운 전해질과 만나게 되어 생긴 큰 온도구배로 인해 강한 열응력이 발생하여 균열을 초래한 것으로 보인다. 조성원소 분석 결과 원형 기공 주변의 크레이터 영역에는 알루미늄이 풍부하였으며 그 주변에 결절상을 갖는 구조에서는 전해질 성분의 원소가 포함되어 있는 것이 확인되었다. 이러한 코팅 막의 표면 특성은 내식성에 영향을 주게 된 원인으로 사료된다. 동전위 분극측정 결과에 의하면 플라즈마 전해 산화 공정 시간이 길어질수록 부식전류밀도가 증가하였다. 이것은 공정시간이 길어짐에 따라 강한 방전이 발생하여 기공의 크기가 증가하고 크랙이 발생하게 되면서 내식성이 저하된 것으로 판단된다. 종합적으로 재료특성 분석 및 내식성 평가를 분석한 결과, 플라즈마 전해 산화의 공정 시간이 너무 길게 되면 오히려 내식성은 저하되는 것이 확인되었다. 이상의 연구를 통하여 고내식 특성을 갖는 플라즈마 전해 산화 막의 유효성을 확인하였으며 용융알루미늄강판 상에 실시한 플라즈마 전해 산화 처리에 대한 기초적인 응용 지침을 제시할 수 있을 것으로 사료된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.226-226
• /
• 2008

지난 10여년 동안 Sn-3.0Ag-0.5(wt%)Cu 합금은 대표 무연솔더 조성으로 다양한 전자제품의 실장 및 접합에 적용되어 왔으며, 그 신뢰성 역시 충분히 검증된 바 있다. 그러나 최근 Ag 가격의 급격한 상승과 솔더 접합부의 내 충격 신뢰성을 보다 향상시키고자 하는 업계의 동향은 Ag의 함량이 낮은 무연솔더 조성의 적용 확대를 유도하고 있다. 이에 따라 본 연구자들은 저 Ag 함유 무연슬더로 Sn-1.2Ag-0.5Cu-0.4In 조성을 제안한 바 있는데, 이는 Sn-3.0Ag-0.5Cu 조성 이상의 solderability를 가지면서도 그 금속원료 가격이 약 20% 가량 저렴한 특징을 가진다. 또한 열 싸이클링 (cycling) 테스트를 통한 슬더 조인트의 신뢰성을 평가한 결과, Sn-3.0Ag-0.5Cu에 크게 뒤떨어지지 않는 양호한 특성이 관찰되었다. 따라서 본 연구에서는 열 싸이클링 테스트와 더불어 최근 그 중요성이 지속적으로 커지고 있는 내 충격 신뢰성 평가 시험을 실시하여 개발된 4원계 무연솔더 조성의 기계적 특성을 기존 무연솔더 조성과 비교, 분석해 보았다. 각 솔더 조성은 솔더 볼 형태로 제조되어 CSP(Chip Scale Package) 상에 범핑 (bumping)되었으며, CSP를 PCB(Printed Circuit Board) 상에 실장하는 공정에서도 Sn-3.0Ag-0.5Cu 및 Sn-1.2Ag-0.5Cu-0.4In의 두 종류의 솔더 페이스트가 사용되었다. 본 연구에서의 내 충격 신뢰성 시험에는 자체 제작한 rod drop 시험기를 사용하였는데, 고정된 CSP 실장 board의 후면 부위를 일정한 높이에서 추를 반복적으로 자유 낙하시켜 급격한 충격을 주는 방식으로 실험을 실시하였다. 이 때 추의 무게는 30g, 낙하 높이는 10cm 였으며, 추의 낙하 시 측정된 board 의 휨 변위량은 약 0.7mm로 측정되었다. 사용된 CSP와 PCB 는 모두 daisy chain 방식으로 연결되어 있기 때문에 저항측정기를 사용한 간단한 실시간 저항 측정 방법으로 시험 이력에 따른 파단부의 발생 시점과 대략의 위치를 손쉽게 확인할 수 있었다. 솔더 조인트의 파단 기준 저항값으로 $1000\Omega$을 설정하였으며. 각 조건 당 5 개 이상의 샘플에 대해 평가를 실시한 후 그 평균값을 조사하였다. 시험 결과 제안된 Sn-1.2Ag-0.5Cu-0.4In 조성은 대표적인 저 Ag 함유 조성인 Sn-1.0Ag-0.5Cu에 비해서는 떨어지는 내 충격 신뢰성을 나타내었지만, 우수한 연성에 기인하여 Sn-3.0Ag-0.5Cu 조성에 비해서는 약 2 배 이상 우수한 신뢰성이 관찰되었다. 또한 CSP의 실장 시 Sn-3.0Ag-0.5Cu보다 Sn-1.2Ag-0.5Cu-0.4In 조성 솔더 페이스트를 적용한 경우에서 보다 우수한 내 충격 신뢰성을 나타내어 기본적으로 개발된 Sn-1.2Ag-0.5Cu-0.4In 솔더 페이스트가 Sn-3.0Ag-0.5Cu 조성의 기존 솔더 페이스트 보다 내 충격 신뢰성이 우수함을 검증할 수 있었다. 각 조성의 솔더 조인트를 $150^{\circ}C$ 에서 500시간 aging한 후 실시한 내 충격 신뢰성 평가에서는 모든 조성에서 그 신뢰성이 급감하는 경항을 나타내었으나, Sn-1.2Ag-0.5Cu-0.4In가 Sn-l.0Ag-0.5Cu보다도 그 상대적인 신뢰성이 우수한 것으로 관찰되었다. 이와 같이 aging 후 실시하는 충격시험은 가장 실제적인 상황과 유사한 조건이므로 상기의 실험 결과는 매우 고무적이었으며, 이에 대한 보다 면밀한 분석이 요청되었다. 마지막으로 파면 및 미세조직 관찰을 통하여 각 조성에서의 충격 파단 특성을 비교, 분석해 보았다.