• Title/Summary/Keyword: 금속화합물

Search Result 933, Processing Time 0.028 seconds

첨단 재료를 위한 새로운 금속 전구체 개발

  • Jeong, Taek-Mo;Kim, Chang-Gyun;Lee, Yeong-Guk;An, Gi-Seok;Lee, Seon-Suk
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2010.02a
    • /
    • pp.30-30
    • /
    • 2010
  • 최근 전자 분야의 눈부신 발달에 따라 진보된 재료를 도입할 필요성이 있고, 이에 필요한 원료 물질을 개발하는 연구가 필수적이다. 최첨단 전자, 자기, 광재료를 제조하기 위하여 여러가지 금속 전구체를 사용하고 있지만 휘발성, 열적 안정성, 제조의 용이성, 경제성 등 우수한 물성을 갖는 원료 물질에 대한 체계적인 연구가 활발하지 못하여 관련 업계에서는 원료 화합물을 도입하는 공정에서 많은 어려움이 있다. 새로운 첨단 금속 전구체를 개발하기 위하여 분자 수준에서 화합물을 설계하고 합성하는 과정을 통하여 쉽고 경제적인 방법으로 새로운 리간드를 다양하게 합성하였고, 이들 리간드를 도입하여 휘발성, 안정성, 경제성이 훨씬 향상된 새로운 금속 전구체를 개발하고 박막 및 나노 물질 제조 공정에 응용하는 연구를 수행하였다. 이로부터 반도체, 디스플레이 등 첨단 재료 분야에 적용이 가능한 여러 후보 전구체를 도출하였다. 본 발표에서는 새로운 금속 전구체 개발 및 이를 이용한 박막 증착, 나노 물질 합성과 특성 평가에 관하여 토의하고자 한다.

  • PDF

Flash Lamp Annealing of Ag Organometallic Ink for High-Performance Flexible Electrode (플래시 기반 유기금속화합물 열처리를 통한 고성능 유연 전극 제조)

  • Yu Mi Woo;Dong Gyu Lee;Yun Sik Hwang;Jae Chan Heo;SeongMin Jeong;Yong Jun Cho;Kwi-Il Park;Jung Hwan Park
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.36 no.5
    • /
    • pp.454-462
    • /
    • 2023
  • Flash lamp annealing (FLA) of metal nanoparticle (NP) ink has provided powerful strategies to fabricate high-performance electrodes on a flexible substrate because of its rapid processing capability (in milliseconds), low-temperature process, and compatibility with to roll-to-roll process. However, metal NPs [e.g., gold (Au), silver (Ag), copper (Cu), etc.] have limitations such as difficulty in synthesizing fine metal NPs (diameter less than 10 nm), high price, and degradation during ink storage and FLA processing. In this regard, organometallic ink has been proposed as a material that can replace metal NPs due to their low-cost (usually 1/100 times cheaper than metal nano inks), low-temperature processability, and high material stability. Despite these advantages, the fabrication of flexible electrodes through FLA treatment of organometallic compounds has not been extensively researched. In this paper, we experimentally guide how to determine the optimal conditions for forming electrodes on flexible substrates by considering material parameters, and flashlight processing parameters (energy density, pulse duration, etc) to minimize the difficulties that may arise during the FLA of organometallic ink.

Intermetallic Compound Growth Characteristics of Cu/Ni/Au/Sn-Ag/Cu Micro-bump for 3-D IC Packages (3차원 적층 패키지를 위한 Cu/Ni/Au/Sn-Ag/Cu 미세 범프 구조의 열처리에 따른 금속간 화합물 성장 거동 분석)

  • Kim, Jun-Beom;Kim, Sung-Hyuk;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.20 no.2
    • /
    • pp.59-64
    • /
    • 2013
  • In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

Study on the Intermetallic Compound Growth and Interfacial Adhesion Energy of Cu Pillar Bump (Cu pillar 범프의 금속간화합물 성장과 계면접착에너지에 관한 연구)

  • Lim, Gi-Tae;Kim, Byoung-Joon;Lee, Ki-Wook;Lee, Min-Jae;Joo, Young-Chang;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.15 no.4
    • /
    • pp.17-24
    • /
    • 2008
  • Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $150^{\circ}C,\;5{\times}10^4\;A/cm^2$ conditions, respectively, in order to compare the growth kinetics of intermetallic compound(IMC) in Cu pillar bump. The quantitative interfacial adhesion energy with annealing was measured by using four-point bending strength test in order to assess the effect of IMC growth on the mechanical reliability of Cu pillar bump. Only $Cu_6Sn_5$ was observed in the Cu pillar/Sn interface after reflow. However, $Cu_3Sn$ formed and grew at Cu pillar/$Cu_6Sn_5$ interface with increasing annealing and stressing time. The growth kinetics of total($Cu_6Sn_5+Cu_3Sn$) IMC changed when all Sn phases in Cu pillar bump were exhausted. The complete consumption time of Sn phase in electromigration condition was faster than that in annealing condition. The quantitative interfacial adhesion energy after 24h at $180^{\circ}C$ was $0.28J/m^2$ while it was $3.37J/m^2$ before annealing. Therefore, the growth of IMC seem to strongly affect the mechanical reliability of Cu pillar bump.

  • PDF

Effect of Solder Structure on the In-situ Intermetallic Compounds growth Characteristics of Cu/Sn-3.5Ag Microbump (Cu/Sn-3.5Ag 미세범프 구조에 따른 실시간 금속간화합물 성장거동 분석)

  • Lee, Byeong-Rok;Park, Jong-Myeong;Ko, Young-Ki;Lee, Chang-Woo;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.20 no.3
    • /
    • pp.45-51
    • /
    • 2013
  • Thermal annealing tests were performed in an in-situ scanning electron microscope chamber at $130^{\circ}C$, $150^{\circ}C$, and $170^{\circ}C$ in order to investigate the effects of solder structure on the growth kinetics of intermetallic compound (IMC) in Cu/Sn-3.5Ag microbump. Cu/Sn-3.5Ag($6{\mu}m$) microbump with spreading solder structure showed $Cu_6Sn_5$ and $Cu_3Sn$ phase growths and then IMC phase transition stages with increasing annealing time. By the way, Cu/Sn-3.5Ag($4{\mu}m$) microbump without solder spreading, remaining solder was transformed to $Cu_6Sn_5$ right after bonding and had only a phase transition of $Cu_6Sn_5$ to $Cu_3Sn$ during annealing. Measured activation energies for the growth of the $Cu_3Sn$ phase during the annealing were 0.80 and 0.71eV for Cu/Sn-3.5Ag($6{\mu}m$) and Cu/Sn-3.5Ag($4{\mu}m$), respectively.

Chemical Reactivity of N-Iodopyridinium Dichlorodate as a Lubricant Additive (潤滑添加劑로서의 N-Iodopyridinium Dichlorodate의 화학반응성)

  • Moon Tak Jin;Kwon Oh Seung
    • Journal of the Korean Chemical Society
    • /
    • v.19 no.1
    • /
    • pp.43-49
    • /
    • 1975
  • Small amounts of iodine compound in mineral oils are usually effective in reducing friction of metallic surfaces. Such improvement in frictional behaviour of wear characteristics was explained by the formation of a diiodide layer lattice structure at the metallic contact surfaces. The lubrication mechanism, however, by which organoiodine compounds functions is not based on the formation of such lattice structure iodide. It was tested and shown, by a static surface chemical reactivity test, wear and EP tests, and a hot wire method, that compound such as N-iodopyridinium dichlorodate, a double charge transfer complex, reacted with metals as an interhalogen compound and that the resultant thin film product reduced appreciable the friction of metallic surfaces, more than compounds such as methyl iodide, diiodomethane, and iodoform. These results suggest that the action of iodine, included in organoiodine compounds, is not that of a classical layer structure iodide, and an entirely new mechanism may be derived from a further studies on charge transfer complex compounds of organoiodine compounds.

  • PDF

Surface Study on the Supported Molten Salt Catalyst (담지된 금속염 혼합물 촉매의 표면 연구)

  • Kim, Jong Pal;Lee, Kwang Hyun
    • Applied Chemistry for Engineering
    • /
    • v.20 no.4
    • /
    • pp.381-385
    • /
    • 2009
  • A basic objective is the preparation and surface studies of supported molten salt catalysts because molten salts can stay as the liquid phase in the range of the ordinary reaction temperature. Many kinds of metal salt mixtures for the formation of molten salt phase are appliable but CuCl and KCl were selected in this study because Cu is considered catalytically reactive in many reactons. The loading of the molten salt was selected as 25 vol% of the total pore volume of ${\gamma}-alumina$ to provide reasonable exposed surface area. The surface structure of catalysts containing molten salts in the ${\gamma}-alumina$ was studied using scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS). CuCl and KCl were added into the ${\gamma}-alumina$ using concentrated hydrochloric acid solution by the impregnation technique. The surfaces of the prepared catalysts before and after heat treatments were compared and they suggested that the heat treatment of catalysts helped the formation of molten-salt although the surface compositions of CuCl and KCl were not uniform.

1,3-bisdicyanovinylindane 색소를 이용한 선택적 $Hg^{2+}$ 감지 특성

  • Kim, Su-Ho;Kim, Young-Sung;Kim, Sung-Hoon;Son, Young-A
    • Proceedings of the Korean Society of Dyers and Finishers Conference
    • /
    • 2009.11a
    • /
    • pp.19-20
    • /
    • 2009
  • 최근 화학, 물리, 생명과학, 전기, 전자등의 다양한 분야에 활발하게 연구가 이루어지고 있는 초분자 화학은 선택적 분자인지를 위한 효율적인 골격구조와 나아가 다양한 계에 응용할 수 있다. 초분자 화학의 분자인지 과정의 특징은 일반적으로 수용체 (receptor 혹은 host)가 목표가 되는 기질 (substrate, analyte, 혹은 guest)에 대하여 선택적으로 식별하고 반응하는 것이다. 비공유 결합성 상호작용에 의하여 이루어지는 초분자 화학의 분자 인지 과정의 특징은 일반적으로 수용체 (receptor 혹은 host)가 목표가 되는 기질 (substrate, analyte, 혹은 guest)에 대하여 선택적으로 식별하고 반응하는 것이다. 이는 공유결합을 이용하는 분자화학과는 차별화 된 것이다. 수용체는 간단한 구조의 화합물 및 금속 이온들과 같은 기질과 가역적으로 상호 작용할 수 있는 착물을 형성한다. 최근들어 급격한 산업화가 진행되어 환경문제가 심각하게 대두 되어져 왔고, 그 중에서 특히 수은이나 카드뮴에 의한 질병, 납에 의한 중독 등 중금속에 의한 오염이 크게 나타남에도 불구하고, 현재 그러한 중금속을 검출함에 있어 많은 비용과 시간이 드는 문제점이 있다. 또한 우리에게 이로운 금속은 효율적 분석을 통해 환경계와 의료계에 많은 도움을 줄 것으로 사례되므로 화학센서 기술의 개발은 절실히 요구되어지고 있다. 이에 새로운 1,3-bisdicyanovinylindane 을 통해 $Hg^{2+}$ 금속의 감지 여부 알아보고, 그 특성을 파악하고자 한다. 1,3-indandion (2.18g, 14.9mmol), malononitrile (2.95g, 44.7mmol), ethanol 50ml를 20분간 상온에서 용해시킨다. 후에 sodium trihydrate acetate(3.05g)을 첨가한 후 5시간 동안 환류반응 시킨다. 이 과정에서 얻어진 용액을 필터과정을 통하여 에서 합성 반응 중에 생성된 불순물(1,3-dicyanovinylindane-1-one, monocondensation)을 제거한다. 필터과정을 통해 걸러진 미 반응 물질을 제�G 용반응욕액을 증류수(100ml)를 이용하여 희석시키고 난 후 염산을 이용, 산성화 시켜 고체 생성물을 얻어낸다. 이렇게 생성된 고체 생성물은 다시 필터 및 건조를 통하여 회색의 고체 화합물을 얻어낸다. 1,3-bisdicyanovinylindane과 금속이온에 대한 감응도를 확인하기 위하여 metanol/water(1:2)을 용매로 하여 금속이온의 농도를 변화시켜 발색특성을 살펴보았다. 본 색소화합물과 Hg2+에 대한 UV 흡광도 변화 적정결과와 그 화합물의 상태 살펴본 결과 금속이온이 0.2ml씩 더 참가되면서 색의 변화를 뚜렷하게 나타내었다. 반면 그 밖에 이온($Fe^{3+}$, $Ag^{2+}$, $Pd^{2+}$, $Zn^2$, $Fe^{2+}$, $Cu^{2+}$, $Pb^{2+}$)은 UV 흡광도 변화가 적거나 변화 자체가 없었다. 하지만 과량의 $Fe^{3+}$, $Ag^{2+}$, $Pd^{2+}$는 색상 변화를 나타내었으며,이와 같은 흡광도 변화는 금속에 따라 약간의 차이가 있지만, 420nm를 등흡수점으로 하여, 580nm의 파장 영역에 있는 흡수 밴드의 세기는 감소하는 반면 400nm 파장 영역에 있는 흡수 밴드의 세기가 증가하였다. 1,3-bisdicyanovinylindane 화합물은 다양한 생물계 및 환경계에서 요구되는 micro mol에서 milli mol 농도 영역의 $Hg^{2+}$ 이온의 선택적이고 민감한 검출과 정량적인 분석에 유용하게 사용될 수 있을 것이다.

  • PDF